Marvell says SerDes and packaging are key hurdles in switch chip development

Jay Liu

, Taipei

Jun 5, 2026, 10:45 0

Credit: DIGITIMES

Marvell says the next gains in switch chip performance will depend on faster SerDes and better packaging — issues that affect network capacity, signal quality, and cost across global data centers. The company is advancing its 100T TerraLynx T100 chip while...

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