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Home Tech Semiconductors

Hanmi reportedly planning US$71 million hybrid bonding investment amid HBM surge

Daniel Chiang, Seoul; Sherri Wang, DIGITIMES Asia Thursday 31 July 2025 0

Credit: Hanmi Semiconductor

South Korea's Hanmi Semiconductor is reportedly planning to invest KRW100 billion (US$71.4 million) in hybrid bonding technology, with commercial equipment targeted for release by the end of 2027.

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