Infineon WBG chip capacity expansion in Malaysia to benefit Taiwan leadframe makers

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia 0


Infinenon Technologies has recently announced plans to invest over EUR 2 billion to build a new fab for wide bandgap (WBG) semiconductors (SiC and GaN) at its manufacturing complex in Kulim, Malaysia, which is expected to generate robust business opportunities for Taiwan's major leadframe suppliers including SDI and Jih Lin Technology, according to industry sources.

In terms of power devices and modules, Infineon has seen its product lines cover both silicon-and SiC/GaN-based MOSFET and IGBT offerings for industrial and automotive applications, and expects its SiC and GaN sales to top US$1 billion and US$800 million, respectively, by 2025, the sources said.

Infineon mainly manufactures and packages high-end WGB semiconductors in house, but requires the support of customized leadframes from SDI, Jih Lin and other validated suppliers, which are all expected to benefit directly from the IDM's capacity expansion project in Malaysia, the sources said.

The new investment will greatly reinforce Infineon's overall competitiveness, which is based on the combination of technology leadership, a broad product portfolio and deep application know-how, the sources continued.

Infineon and other IDMs are expanding outsourcing midrange chips manufacturing and packaging operations to third-party supporting partners, the sources added.