ASE Technology has reported revenue grew 2.3% sequentially and about 18% on year to NT$42.27 billion (US$1.53 billion) in May 2021, a record high for the same month, and its January-May revenues rose 20.55% on year to NT$203.07 billion, according to company statistics.
Its May packaging and testing revenues came to NT$26.524 billion, up 4% on year and 14.5% on year, mainly driven by strong wire-bonding service demand that is expected to persist throughout the year.
The increasing shortages of ABF substrates for BGA process have prompted many chipmakers to turn to ASE Technology for processing their chips with its patented aQFN wire-bonding technology, adding further momentum to the OSAT's wire-bonding business, according to industry sources.
The company is set to procure up to 3,000 new wire-bonders by the end of the year to meet ever-increasing demand from clients, many of them having booked its wire-bonding capacity for first-half 2022 to process MCUs, power management ICs and other PC peripheral chips, the sources said.
ASE Technology reportedly will offer SiP (system in package) services for Apple's new UWB (ultra wideband) U1 chips, new Apple Watch processors, and wireless communication modules for new iPhones, while also processing mmWave AiP modules for new iPhones, the sources continued.
The company declined to comment on specific clients or orders.