TSMC has seen the installation of its advanced 3nm and 5nm process capacity disrupted by lifting equipment delivery delays, according to sources familiar with the matter.
TSMC at its recent investors conference reiterated its capex target this year of a record US-15-16 billion, with the majority of the sum to be utilized for the development of the foundry's advanced node manufacturing.
But TSMC has encountered delays in the delivery of a piece of lifting equipment for use in the installation of the foundry's most-advanced fab tools, the sources indicated. The facilities are being stalled by customs procedures.
That lifting equipment is specified in the standard operating procedure (SOP) the fab tool supplier has set for the manufcturing facility installation at the TSMC plant, the sources said.
TSMC disclosed previously its 3nm technology development remains on track, with risk production scheduled for 2021 followed by volume production in the second half of 2022. As for its 5nm process, volume production has already kicked off since April with satisfactory yield rates. The foundry expects "a very fast and smooth ramp" of the process in the second half of 2020, thanks to robust chip demand for mobile and HPC device applications.
Article translated by Jessie Shen
