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NEWS TAGGED MOBILE
Tuesday 27 July 2021
SK Hynix posts profit surge in 2Q21
SK Hynix has reported net profits surged 100% sequentially and 57% on year to KRW1.99 trillion (US$1.73 billion) in the second quarter of 2021.
Monday 26 July 2021
Asian countries see mixed 5G progresses
5G subscriptions are growing at a rate of about one million per day. 5G is expected to become the fastest adopted mobile generation in history, compared to 4G LTE. It is estimated...
Monday 12 July 2021
Adata expects double-digit rise in DRAM contract prices
Memory module maker Adata Technology expects DRAM contract prices to register a double-digit sequential surge in the third quarter of 2021, with an over 15% rise in low-power DRAM...
Thursday 24 June 2021
TSMC 6nm process attracts orders for 5G APs
Qualcomm, MediaTek and Unisoc have all placed orders for their upcoming 5G mobile application processors with TSMC demanding the foundry's 6nm process manufacturing, according to...
Thursday 10 June 2021
Samsung completes 8nm RF technology development for 5G mobile chips
Samsung Electronics has introduced its newest radio frequency (RF) technology based on 8nm process. This cutting-edge foundry technology is expected to provide a "one chip solution,"...
Friday 4 June 2021
TSMC InFO_B packaging gains positive feedback
TSMC's just-unveiled InFO_B packaging technology designed for smartphones enables DRAM stacking flexibility at contract manufacturers, and has received positive feedback from handset...
Thursday 3 June 2021
TSMC stepping up advanced process capacity expansion
TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Thursday 27 May 2021
Vietnam mobile e-commerce to reach US$7 billion in 2021 revenues
Revenues generated from Vietnam's mobile e-commerce industry are expected to reach US$7 billion in 2021 revenues and will surpass those of the desktop e-commerce sector in 2022, according...
Friday 21 May 2021
5G growing rapidly despite component shortages, says Strategy Analytics
Radio component revenue reached an all-time high in 2020, according to Strategy Analytics, which expects revenue to grow through 2025.
Friday 21 May 2021
Backend houses gearing up for new orders from Qualcomm
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...
Wednesday 19 May 2021
Arm loses smartphone and tablet GPU share in 2020
The global smartphone and tablet graphics processing unit (GPU) market leader Arm lost share in 2020, according to Strategy Analytics.
Monday 17 May 2021
SK Hynix to expand 8-inch foundry capacity
SK Hynix is considering feasible plans to double its foundry capacity, according to company co-CEO and vice chairman Park Jung-ho.
Wednesday 12 May 2021
Intel launches new notebook CPUs
Intel has launched its new Core H series mobile processors (Tiger Lake-H) led by the Core i9-11980HK, targeting the gaming, Creator and enterprise notebook markets.
Monday 14 October 2019
Microsoft's new Surface family
Microsoft has announced a new Surface lineup with five new products coming this holiday and two new dual-screen devices, Surface Neo and Surface Duo, coming in holiday 2020. The five new devices are 13.5- and 15-inch Surface Laptop 3, Surface Pro 7, Surface Pro X and Surface Earbuds. The Surface Laptop 3 is now with a choice of a 13.5- or 15-inch display and new colors and finishes, while the Surface Pro remains the most versatile 2-in-1 device for consumers. Microsoft also brings the productivity of Surface to even smaller and more mobile form factors with Surface Neo and Surface Duo dual-screen devices.
Friday 1 June 2018
Samsung 10nm 32GB DDR4 SoDIMM
Samsung Electronics has started mass producing 32GB DDR4 memory for gaming laptops in the widely used format of small outline dual in-line memory modules (SoDIMMs). The new SoDIMMs are based on 10nm-class process technology that will allow users to enjoy enriched PC-grade computer games on the go. Using the new memory solution, PC manufacturers can build faster top-of-the-line gaming-oriented laptops with longer battery life at capacities exceeding conventional mobile workstations, while maintaining existing PC configurations, according to Samsung. Compared to Samsung's 16GB SoDIMM based on 20nm-class 8Gb DDR4, which was introduced in 2014, the new 32GB module doubles the capacity while being 11% faster and approximately 39% more energy efficient, said the vendor. With a total of 16 of Samsung's newest 16Gb DDR4 DRAM chips (eight chips each mounted on the front and back), the 32GB SoDIMM allows gaming laptops to reach speeds up to 2,666Mbps. A 64GB laptop configured with two 32GB DDR4 modules consumes less than 4.6W in active mode and less than 1.4W when idle, said Samsung. This reduces power usage by approximately 39% and over 25%, respectively, compared to today's leading gaming-oriented laptops, which are equipped with 16GB modules.
Thursday 22 February 2018
Intel Xeon D-2100 processor
Intel has introduced the new Intel Xeon D-2100 processor, a system-on-chip (SoC) processor architected to address the needs of edge applications and other data center or network applications constrained by space and power. The Intel Xeon D-2100 processor extends the Xeon Scalable platform from the heart of the data center to the network edge and web tier, where network operators and cloud service providers face the need to continuously grow performance and capacity without increasing power consumption, said the vendor. Intel Xeon D-2100 processors will enable greater performance and hardware-enhanced security to the network edge in support of the growing number of workloads that demand more compute, analytics and data protection closer to endpoint devices. For example, the new processors will help communications service providers CoSPs offer multi-access edge computing (MEC), which allows software applications to tap into local content and real-time information about local-access network conditions, reducing mobile core network of network congestion. This can enable uses cases ranging from 5G-connected cars, smart stadiums, and retail and medical solutions, said Intel.
AROUND THE WEB
Samsung strikes deal to manufacture mobile phones in Pakistan
Saturday 17 July 2021
NXP brings GaN to 5G multi-chip modules for mobile networks
Monday 28 June 2021
Huawei plans to launch new operating system for phones in June
Tuesday 25 May 2021
Raytheon, Globalfoundries partner to accelerate 5G wireless connectivity
Monday 24 May 2021
Apple to build new semiconductor design center in Munich
Wednesday 10 March 2021
Jul 23, 10:33
Chenbro launches the RM252/RM352 series server chassis to empower small base stations deployment in telecommunications
Tuesday 13 July 2021
MOBI standards guide innovation in blockchain services for growth in smart mobility industry
Wednesday 7 July 2021
ADLINK helping manufacturers upgrade businesses with private 5G network-enabled smart manufacturing solutions
Wednesday 7 July 2021
Coretronic leverages strengths to enable smart manufacturing
TSMC dossier (8): Can China establish leadership in semiconductor sector?
ASC 100: Motherson Sumi rides EV wave
Mitac sees 52-week lead time for server component deliveries
PCB firms shipping in small volumes for upcoming AirPods
Chip probing houses to gain from new iPhone SE series, say sources
O-RAN in uncertain future
China top-3 OSATs to see combined revenue climb over 20% in 2021, says Digitimes Research
Google, VW, Toyota keen to develop car operating systems
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