Micron Technology has announced the launch of uMCP5, which the company claims is the industry's first universal flash storage (UFS) multichip package with low-power DDR5 DRAM.

Sales of 5G phones in China, already in full swing, are expected to gain a further boost in fourth-quarter 2020 thanks to higher than expected pre-orders for iPhone 12 lineup received...

The worldwide market for smart home devices is expected to grow 4.1% on year in 2020 with shipments totaling more than 854 million units, according to the IDC.

Three years after the launch of its gaming sub-brand Legion, Lenovo has launched its first gaming smartphone, the Legion Phone Duel, recently. The gaming phone is crafted with a symmetrical...

Taiwan-based IC test interface solutions provide Chunghua Precision Test Tech (CHPT), mobile device certification specialist Sporton International, and testing house Sigurd Microelectronics...

Samsung Electronics and some others have held nearly four months of DRAM and NAND flash inventories on average, due to a slowdown in orders for datacenter applications and overall...

MediaTek has announced its T750 5G chipset designed to power next-generation 5G CPE wireless products, such as fixed wireless access routers (FWA) and mobile hotspots.

MediaTek and Qualcomm have introduced their new AI-capable mobile SoC chips designed specifically for gaming smartphones - the Helio G95 and Snapdragon 732G respectively.

Huawei's senior officials have told Taiwan's semicondcutor suppliers that the Chinese company fears for the worst for its smartphone business because of the US trade ban, according...

Samsung Electronics has announced mass production of 16Gb LPDDR5 mobile DRAM, using extreme ultraviolet (EUV) technology, at its second production line in Pyeongtaek.

Taiwan-based IC design houses will see their gross margins come under downward pressure in the fourth quarter of 2020, due to falling chip ASPs in China, according to industry sour...

The US trade restrictions on Huawei are set to affect the overall shipments of 5G mobile APs to the Chinese market in fourth-quarter 2020, and to significant change the landscape...

Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...

Coretronic Intelligent Robotics has developed a navigation solution based on 3D LiDAR SLAM (simultaneous localization and mapping) technology for autonomous mobile robots, according...

MediaTek has introduced the Dimensity 800U as the latest addition in its 5G SoC lineup. The new chipset is designed for multi-core high performance and leading 5G+5G dual Sim dual...

Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.

Kdan Mobile Software, a Taiwan-based developer of mobile device-based collaborative work software solutions, has provided Japan-based Vacan with its DottedSign e-signing service to...

Second-quarter 2020 smartphone AP shipments to China-based vendors amounted to 169.9 million units, down 20.6% year-over-year but up 25.8% quarter-over-quarter.

Smartphone shipments to the China market in second-quarter 2020 were doubled sequentially, as the coronavirus pandemic in China was eased, while the economy was benefited by the re-opening...

Taiwan Mobile and Formosa Plastics Transport (FPT) have unveiled two autonomous vehicles for trial operation along a 3km road in a retiree commuinity.

MediaTek has announced advances in its collaboration with Intel to bring 5G experiences to next-generation PCs with the successful development and certification of its 5G modem data...

Taiwan's CCL maker Elite Material (EMC) expects to see its third-quarter 2020 revenues sequentially grow at least 10% on strong demand for flagship handset and 5G infrastructure applications,...

Specialty DRAM and flash memory maker Winbond Electronics returned to profitability in the second quarter of 2020, ending a streak of two consecutive quarterly losses.

Corning has unveiled Gorilla Glass Victus, which it says provides consumers and OEMs with significantly better drop and scratch performance compared to competitive aluminosilicate...

Cadence Design Systems and United Microelectronics (UMC) have jointly announced that the Cadence millimeter wave (mmWave) reference flow has achieved certification for UMC's 28HPC+...