中文網
Taipei
Tue, Jul 27, 2021
19:25
mostly clear
32°C
CONNECT WITH US
NEWS TAGGED MOBILE
Tuesday 27 July 2021
SK Hynix posts profit surge in 2Q21
SK Hynix has reported net profits surged 100% sequentially and 57% on year to KRW1.99 trillion (US$1.73 billion) in the second quarter of 2021.
Monday 26 July 2021
Asian countries see mixed 5G progresses
5G subscriptions are growing at a rate of about one million per day. 5G is expected to become the fastest adopted mobile generation in history, compared to 4G LTE. It is estimated...
Monday 12 July 2021
Adata expects double-digit rise in DRAM contract prices
Memory module maker Adata Technology expects DRAM contract prices to register a double-digit sequential surge in the third quarter of 2021, with an over 15% rise in low-power DRAM...
Thursday 24 June 2021
TSMC 6nm process attracts orders for 5G APs
Qualcomm, MediaTek and Unisoc have all placed orders for their upcoming 5G mobile application processors with TSMC demanding the foundry's 6nm process manufacturing, according to...
Thursday 10 June 2021
Samsung completes 8nm RF technology development for 5G mobile chips
Samsung Electronics has introduced its newest radio frequency (RF) technology based on 8nm process. This cutting-edge foundry technology is expected to provide a "one chip solution,"...
Friday 4 June 2021
TSMC InFO_B packaging gains positive feedback
TSMC's just-unveiled InFO_B packaging technology designed for smartphones enables DRAM stacking flexibility at contract manufacturers, and has received positive feedback from handset...
Thursday 3 June 2021
TSMC stepping up advanced process capacity expansion
TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.
Wednesday 2 June 2021
Micron intros 176-layer NAND, 1α DRAM technology
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Thursday 27 May 2021
Vietnam mobile e-commerce to reach US$7 billion in 2021 revenues
Revenues generated from Vietnam's mobile e-commerce industry are expected to reach US$7 billion in 2021 revenues and will surpass those of the desktop e-commerce sector in 2022, according...
Friday 21 May 2021
5G growing rapidly despite component shortages, says Strategy Analytics
Radio component revenue reached an all-time high in 2020, according to Strategy Analytics, which expects revenue to grow through 2025.
Friday 21 May 2021
Backend houses gearing up for new orders from Qualcomm
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) reportedly will offer backend services for Qualcomm's newly-released Snapdragon 778G...
Wednesday 19 May 2021
Arm loses smartphone and tablet GPU share in 2020
The global smartphone and tablet graphics processing unit (GPU) market leader Arm lost share in 2020, according to Strategy Analytics.
Monday 17 May 2021
SK Hynix to expand 8-inch foundry capacity
SK Hynix is considering feasible plans to double its foundry capacity, according to company co-CEO and vice chairman Park Jung-ho.
Wednesday 12 May 2021
Intel launches new notebook CPUs
Intel has launched its new Core H series mobile processors (Tiger Lake-H) led by the Core i9-11980HK, targeting the gaming, Creator and enterprise notebook markets.