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Integrated handheld solutions driving demand for wafer-level packaging, says ASE

Ingrid Lee, Taipei; Jessie Shen, DIGITIMES Asia Monday 13 April 2009 0

Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor Engineering (ASE) recently commented. Demand for WLP is growing because...

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