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STATS ChipPAC expands WLP offering with 12-inch manufacturing in Taiwan

Press release; Jessie Shen, DIGITIMES Asia 0

STATS ChipPAC has announced the expansion of its wafer-level package (WLP) offering with new 300mm manufacturing capabilities in Taiwan. The 300mm WLP operation is located in Hsinchu County to work closely with the local wafer foundries.

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