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NEWS TAGGED WL-CSP
Monday 4 June 2018
Taiwan 2nd-tier backend firms enjoy pick-up of orders
Taiwan-based second-tier packaging and testing houses have enjoyed a pick-up of orders for flash memory, and 3D sensing and other optical components recently as their downstream clients...
Thursday 8 February 2018
Xintec losses widen in 2017
Image sensor packaging specialist Xintec saw its net losses widen to NT$733 million (US$25.1 million) in 2017 from losses of NT$636 million in 2016. EPS stayed negative at NT$2.71.
Thursday 1 June 2017
MediaTek launches next-gen Wi-Fi chipset portfolio for IoT
MediaTek has announced its next-generation Wi-Fi chipset portfolio for connected smart home, office and other IoT applications. The MediaTek MT7686, MT7682, and MT5932 will deliver...
Thursday 4 May 2017
Xintec reports 7th consecutive quarterly loss in 1Q17
Specialty-IC packaging specialist XinTec has reported a seventh consecutive quarterly loss in the first quarter of 2017, in which net losses came to NT$248 million (US$8.23 million)...
Tuesday 17 March 2015
Xintec 12-inch wafer-level CSP ready for volume production in 2H15, says chairman
Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...
Tuesday 31 December 2013
IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...
Monday 13 April 2009
Integrated handheld solutions driving demand for wafer-level packaging, says ASE
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Monday 13 October 2008
Image sensor packaging house XinTec to ship 300,000 WL-CSP wafers in 2008
Image sensor and MEMS-chip packaging house XinTec is expected to ship 300,000 wafer-level chip-scale packaging (WL-CSP) wafers in 2008, with shipments to gain more momentum in 2009,...
Research Report Database
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