Monday 4 June 2018
Taiwan 2nd-tier backend firms enjoy pick-up of orders
Taiwan-based second-tier packaging and testing houses have enjoyed a pick-up of orders for flash memory, and 3D sensing and other optical components recently as their downstream clients...
Thursday 8 February 2018
Xintec losses widen in 2017
Image sensor packaging specialist Xintec saw its net losses widen to NT$733 million (US$25.1 million) in 2017 from losses of NT$636 million in 2016. EPS stayed negative at NT$2.71.
Thursday 1 June 2017
MediaTek launches next-gen Wi-Fi chipset portfolio for IoT
MediaTek has announced its next-generation Wi-Fi chipset portfolio for connected smart home, office and other IoT applications. The MediaTek MT7686, MT7682, and MT5932 will deliver...
Thursday 4 May 2017
Xintec reports 7th consecutive quarterly loss in 1Q17
Specialty-IC packaging specialist XinTec has reported a seventh consecutive quarterly loss in the first quarter of 2017, in which net losses came to NT$248 million (US$8.23 million)...
Tuesday 17 March 2015
Xintec 12-inch wafer-level CSP ready for volume production in 2H15, says chairman
Image sensor packaging house Xintec will have its 12-inch wafer-level chip-scale package (WL-CSP) line ready for volume production in the second half of 2015, according to company...
Tuesday 31 December 2013
IC backend service firms to ramp up bumping, WL-CSP capacities in 2014, say sources
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...
Monday 13 April 2009
Integrated handheld solutions driving demand for wafer-level packaging, says ASE
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Monday 13 October 2008
Image sensor packaging house XinTec to ship 300,000 WL-CSP wafers in 2008
Image sensor and MEMS-chip packaging house XinTec is expected to ship 300,000 wafer-level chip-scale packaging (WL-CSP) wafers in 2008, with shipments to gain more momentum in 2009,...
Research Report Database
Summary of Tech Supply Chain News!
Fuel cell is pivotal for Taiwan's hydrogen industry, according to DIGITIMES Research
Silicon shield doesn't guarantee military deterrence for Taiwan, says DIGITIMES Research
Taiwan IPC makers pushing integrated services to boost profits and to see revenues grow in 2024, says DIGITIMES Research