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NEWS TAGGED BUMPING
Thursday 21 July 2022
SPIL and USI cut into supply chain for new wearables
Siliconware Precision Industries (SPIL) and Universal Scientific Industrial (USI), both under ASE Technology Holding, have cut into the supply chains for the upcoming Apple Watch...
Monday 4 July 2022
Consumer IC packaging demand unlikely to rebound till 1Q23
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
Tuesday 31 May 2022
High-end IC testing demand to stay robust in 2H22
Outsourced semiconductor assembly and testing (OSAT) vendors continue to enjoy strong order pull-in for high-end chips used in automotive, high-performance computing (HPC), and server...
Thursday 21 April 2022
Packaging material vendors 'rationing' supplies to IDMs, OSATs
Taiwan's packaging materials vendors are "rationing" supplies in serving international IDMs and local OSATs, as their capacity expansion pace lags behind the latter's, according to...
Tuesday 12 April 2022
PTI obtains backend orders for new MediaTek smartphone APs
Powertech Technology (PTI) has obtained orders for packaging MediaTek's smartphone application processors slated for launch later in 2022, under the chipmaker's strategy to diversify...
Wednesday 26 January 2022
With high revenue in 1Q22, PTI considers deals with Micron, SK Hynix
Backend house Powertech Technology (PTI) expects to post a double-digit on-year revenue surge in the first quarter of 2022 after posting record business results for 2021, and is optimistic...
Thursday 6 January 2022
Taiwan OSAT, test interface vendors upbeat about demand for new processors
Taiwan-based OSATs and IC test interface solution providers are upbeat about demand for new processors unveiled by vendors including AMD and Nvidia for the next couple of years, according...
Tuesday 9 November 2021
ChipMOS sees high-end DDI testing capacity fully utilized
ChipMOS Technologies continues to see its high-end display driver IC (DDI) testing lines remain fully utilized, but expects to post flat growth in revenues from the DDI segment in...
Monday 6 September 2021
UMC, Chipbond to form partnership through share swap
Pure-play foundry United Microelectronics (UMC) has announced plans to form a strategic partnership with Chipbond Technology, a display driver IC (DDI) backend specialist, through...
Monday 28 June 2021
Backend demand for HPC chips strong, but ABF substrate support matters
Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual...
Friday 25 June 2021
PTI obtains new bumping orders for logic chips
Memory backend specialist Powertech Technology (PTI) has recently obtained wafer bumping orders for networking chips from Broadcom and MediaTek, indicating a significant payoff in...
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Thursday 29 April 2021
ASE raises capex projection for 2021
Taiwan's leading OSAT firm ASE Technology Holding will raise its capex budget by 10-15% to up to US$2 billion for 2021, from the previous estimation of US$1.7 billion, according to...
Wednesday 28 April 2021
PTI to further expand DRAM backend capacity
Powertech Technology (PTI) plans to further expand production capacity for standard-type DRAM memory at its Xian plant in China to better serve major clients, according to the Taiwan-based...
Tuesday 23 March 2021
PTI to offer Renesas additional backend capacity support
Backend house Powertech Technology (PTI) will provide automotive chips vendor Renesas Electronics with additional capacity support starting April, as the IDM's backend bumping capacity...