中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    How a misread partnership exposed Nissan’s deeper uncertainties
    1min ago
    SEMICON West 2025: Chip leaders urge policy stability to counter China
    14min ago
    New H-1B fee surge forces Indian tech firms to rethink global workforce plans
    14min ago
    China's top-four TV brands dominate 90% of surging miniLED market
    15min ago
    FuriosaAI leads South Korea's physical AI push
    15min ago
    First of Taiwan's FORMOSAT-8 satellite heads to the US for launch into orbit
    19min ago
    NEWS TAGGED PACKAGING
    Sunday 31 August 2025
    Intel veteran to head ADI’s Oregon fab as leadership exodus deepens

    Narahari Ramanuja, a 25-year Intel veteran and former director of advanced packaging technology development, is leaving the company to...

    Saturday 30 August 2025
    TSMC supplier AMC rewires its future with warpage-control materials after LCD collapse

    Taiwan's LCD panel industry, which peaked at over NT$1 trillion in 2007, collapsed within years and became unprofitable. The decline...

    Friday 29 August 2025
    Niching's AI-driven cooling technology drives revenue surge amid advanced packaging shifts
    On August 28, Niching presented strong growth prospects at its latest investor conference, highlighting the AI-driven opportunities for cooling solutions. The company's improved product...
    Friday 29 August 2025
    Tex Year Industries to adjust production across Asia and Americas amid geopolitical pressures
    Tex Year Industries is set to optimize its manufacturing operations across Taiwan, Vietnam, the US, and other Asian locations in response to ongoing tariffs and geopolitical challenges...
    Friday 29 August 2025
    AEMC, Nanpao, and Trusval form JV targeting high-end semiconductor packaging adhesives
    AEMC, Nanpao, and Trusval, on August 28, 2025, announced the establishment of a joint venture (JV) with a capital of NT$500 million (US$16.4 million). The shareholding is divided...
    Friday 29 August 2025
    India-based boAt, HrdWyr unveil indigenously designed chip with Tata Electronics support
    boAt has partnered with semiconductor startup HrdWyr to launch the HrdWyr Indus 1011, a high-volume chip fully designed in India, with assembly, packaging, and testing enabled by...
    Friday 29 August 2025
    CG Semi launches $870m OSAT facility in Gujarat to boost India’s chip ambitions
    According to BusinessWire, CG Semi Private Limited, a subsidiary of CG Power and Industrial Solutions Limited and part of the Murugappa Group, has inaugurated its first Outsourced...
    Thursday 28 August 2025
    CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
    Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
    Thursday 28 August 2025
    Samsung is reportedly considering a stake in Intel to boost chip packaging and challenge TSMC

    Samsung Electronics is reportedly considering a strategic investment in Intel to strengthen its foundry business, according to South...

    Wednesday 27 August 2025
    Nvidia's CoWoP PCB architecture targets ABF substrates but faces warpage risk
    Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...
    Wednesday 27 August 2025
    Nvidia's Huang meets Samsung, SK leaders at US summit as HBM battle escalates
    The South Korea-US summit offered a rare gathering of tech heavyweights, as Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won...
    Tuesday 26 August 2025
    ASMPT exhibits at SEMICON Taiwan, enabling chips for AI
    ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the Intelligence...
    Monday 25 August 2025
    Semco revamps IC substrate supply chain amid AI accelerator push
    Samsung Electro-Mechanics (Semco) has recently adjusted its IC substrate supply chain, appointing Mitsubishi and Resonac as the primary suppliers for key materials such as copper-clad...
    Sunday 24 August 2025
    Samsung snaps up Intel engineers as layoffs flood market with talent
    Intel is grappling with accelerating staff departures as CEO Pat Gelsinger pushes through sweeping restructuring efforts and cancels projects championed by his predecessor. The financially...
    Friday 22 August 2025
    TSMC's gross margin nears 60% as equipment allies shine
    TSMC's strong second-quarter results demonstrated resilience amid global challenges, posting a 58.6% gross margin and NT$759.83 billion (US$24.93 billion) revenue in the first half...
    8/35 pages
    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Wednesday 1 October 2025
    Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
    Wednesday 1 October 2025
    AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
    Wednesday 1 October 2025
    Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
    aiexpo