At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Taiwanese OSAT providers stated that the trend of connectivity in everything will continue in 2024, and it will be combined with trends such as cloud AI, edge computing, and high-speed...
Niching Industrial, a distributor of IC packaging materials, sees clear order visibility for heat sinks thanks to brisk demand for midrange and high-end logic IC packaging.
SKC, the specialized materials manufacturer under the SK Group is poised to invest in Chipletz, a US IC packaging startup, to enhance its capability in IC packaging.
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Taiwan Semiconductor Manufacturing Co. and Arizona authorities are talking about adding advanced chip packaging capacity to the chipmaker's plants in the state, Governor Katie Hobbs...
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
IC packaging leadframe suppliers are bracing for on-year profit decreases in 2023, as demand for automotive chips cannot offset the impact of diminishing consumer chip demand, according...
The US should invest more in cutting-edge semiconductor packaging to ensure it leads in emerging technologies such as artificial intelligence, Cadence Design Systems Inc. Chief Executive...
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat...
According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development...
In light of the fact that Chinese foundries can still obtain used equipment and consumables for process technology upgrades despite the US ban, the US could target advanced packaging...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
