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NEWS TAGGED PACKAGING
Tuesday 30 September 2025
Qualcomm engages with India's chip packaging sector, open to partnerships with local players
Qualcomm is in active discussions with multiple Indian suppliers, including the Tata Group, to leverage the country's semiconductor packaging capacity and is open to collaborating...
Tuesday 30 September 2025
Non-China supply chain pushes 12-inch SiC into advanced packaging, but China stands to gain
The surge in AI chips fueling CoWoS packaging demand has put silicon carbide (SiC), a third-generation semiconductor, on the verge of entering this high-value arena. The shift is...
Sunday 28 September 2025
SEA emerges as key hub amid shifting PCB supply chains
Taiwan-based Ampoc, a distributor and manufacturer of PCB wet process equipment and semiconductor materials, anticipates increasing overlap between PCB and semiconductor industries...
Sunday 28 September 2025
TSMC’s 2nm gamble stretches from Hsinchu to Arizona

Taiwan Semiconductor Manufacturing Company (TSMC), the world's leading contract chipmaker, has begun ramping up production of its cutting-edge...

Sunday 28 September 2025
Hanmi Semiconductor expands into advanced chip packaging for AI era

Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem...

Sunday 28 September 2025
Taiwan's E-Chem expands footprint in semiconductor chemicals, targets global growth

As global demand for advanced semiconductor packaging surges, Taiwanese specialty chemicals and materials maker E-Chem is investing aggressively...

Saturday 27 September 2025
Infineon, Rohm sign MOU to support flexible SiC power device shipments
Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate...
Friday 26 September 2025
ASE plans major expansion of advanced packaging capacity in Southern Taiwan
ASE Technology Holdings' subsidiary, ASE Semiconductor, announced the construction of a new advanced packaging plant in Kaohsiung, Taiwan, aiming to boost production capacity to meet...
Thursday 25 September 2025
Alibaba stakes out AI chip ecosystem, setting up a clash with Huawei
Alibaba is steadily building a vertically integrated chip ecosystem that spans cloud computing, AI chip design, and advanced packaging. People's Daily recently revealed a...
Wednesday 24 September 2025
Yole Group CEO interview (Part 2): Post-Moore's Law era sparks advanced packaging race
As Moore's Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its...
Tuesday 23 September 2025
Hanwha Semitech reportedly courts Foxconn, ASE in OSAT race
Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South...
Tuesday 23 September 2025
Henkel Adhesives highlights portfolio of Semiconductor Packaging Materials to foster collaboration with Taiwan
As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled...
Tuesday 23 September 2025
TSMC extends lead in foundry market as Samsung loses ground
The global boom in artificial intelligence is creating a stark divide in the semiconductor industry, with Taiwan's TSMC solidifying its dominance while rival Samsung Electronics falls...
Tuesday 23 September 2025
12-inch SiC substrates poised for two-phase entry onto CoWoS packaging
After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...
Tuesday 23 September 2025
Yole Group CEO interview (Part 1): TSMC dominates AI era as supply chain dynamics undergo massive shifts
The semiconductor industry is experiencing its most dramatic transformation in decades, driven by artificial intelligence's relentless demand for computing power. Traditional boundaries...