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    FOPLP progress fastest in foundries, slower in testing and panel fabs
    11h 54min ago
    YMTC launched third phase with hubei state capital support, no big fund stake
    11h 54min ago
    Military and semiconductor sectors boost IPC growth momentum
    11h 55min ago
    AI chip demand drives future semiconductor growth trends
    11h 55min ago
    YMTC decade-long journey highlights the evolution of China tech sovereignty
    11h 55min ago
    China's leading wafer maker aquaire three loss-making subsidiaries to strengthen 12-inch wafer integration
    11h 55min ago
    NEWS TAGGED PACKAGING
    Thursday 14 August 2025
    Samsung reportedly plans US$170M in Japan packaging hub to challenge TSMC
    Samsung Electronics is reportedly investing JPY25 billion (approx. US$170 million) to set up an advanced packaging research institute in Yokohama and acquire a major office tower...
    Thursday 14 August 2025
    AblePrint seizes AI packaging edge with early WMCM, CoPoS deployment

    AblePrint Technology (APT), a key supplier of advanced degassing equipment to major chipmakers such as TSMC, reported strong second-quarter...

    Thursday 14 August 2025
    Samsung aims to meet Tesla's chip packaging demand with new panel-level technology
    Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible...
    Wednesday 13 August 2025
    China's chip equipment spending surges in 1H25, defying global downturn
    China's semiconductor industry posted CNY455 billion (approx. US$63.3 billion) in total investment during the first half of 2025, down 9.8% from a year earlier, according to a new...
    Wednesday 13 August 2025
    Zhen Ding bullish on CoWoP despite long road to mass production
    Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...
    Wednesday 13 August 2025
    India approves four chip projects under ISM
    India has approved four additional semiconductor projects under the India Semiconductor Mission (ISM), further strengthening the country's semiconductor manufacturing ecosystem. These...
    Wednesday 13 August 2025
    TSMC adds US$10B to US subsidiary in strategic forex hedge
    Taiwan Semiconductor Manufacturing Company (TSMC) held a board meeting on August 12, during which several key resolutions were made. Of particular interest was the approval to increase...
    Tuesday 12 August 2025
    ASMPT to wind down Shenzhen plant in China, cutting 950 jobs
    Singapore-based semiconductor and electronics manufacturing equipment supplier ASMPT will shut down its wholly owned Shenzhen subsidiary, ASMPT Equipment (Shenzhen) Co. (AEC), as...
    Tuesday 12 August 2025
    ASE invests US$217 million to expand advanced packaging capacity in Kaohsiung
    ASE Technology Holdings, a leading global semiconductor assembly and testing company, will invest approximately NT$6.5 billion (US$217 million) to purchase a factory and related facilities...
    Tuesday 12 August 2025
    HiSilicon ally SJ Semi taps domestic lithography to scale advanced packaging output
    SJ Semiconductor (Jiangyin) Corp. (SJ Semi), a major packaging and testing partner of Huawei's chip design arm HiSilicon, has received domestically developed back-end steppers from...
    Monday 11 August 2025
    Samsung reportedly planning to produce iPhone image sensors in Texas, but keep packaging in Korea
    Samsung Electronics will build a CMOS image sensor (CIS) production line at its Austin, Texas, semiconductor facility for Apple's next-generation iPhones, but the chips' back-end...
    Monday 11 August 2025
    TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops
    Taiwan Semiconductor Manufacturing Co. (TSMC) has undergone a reorganization of its advanced packaging capacity and workforce, even as it publicly emphasizes expansion efforts. The...
    Monday 11 August 2025
    Taiwan chipmakers sidestep HBM giants with tailored edge-AI memory
    Taiwanese memory chipmakers are intensifying efforts to capture growth in customized AI applications, unveiling low-power, high-bandwidth alternatives to High Bandwidth Memory (HBM)...
    Monday 11 August 2025
    From cost burden to growth engine: AI revolutionizes advanced packaging
    At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation...
    Sunday 10 August 2025
    Tesla's Dojo shutdown signals new alliances with Samsung and Intel in AI race

    Tesla is dismantling its in-house AI supercomputer project "Dojo" and shifting gears toward a new external chip strategy involving Samsung...

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    TPCA
    BIZ FOCUS
    Aug 5, 11:49
    Cultivating OCP, embracing open source
    Wednesday 3 September 2025
    Tescan Unveils New Global Brand Platform 'The Art of Discovery' with APAC Rollout at SEMICON Taiwan
    Wednesday 3 September 2025
    Micraft System Plus Unveils Proprietary Thermo-Compression Bonder, Expands into Advanced Packaging Market
    Wednesday 3 September 2025
    SK hynix Introduces Industry's First Commercial High NA EUV
    Summary of Tech Supply Chain News!