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    Asus and Foxconn lead Taiwan's AI City National Team as Middle East conflict escalates
    20min ago
    Oracle says AI will augment, not kill, enterprise SaaS
    30min ago
    China leads nuclear power revival as US and Europe talent and supply chain gaps widen
    Mar 10, 19:54
    Japanese automakers reintroduce US-spec left-hand drive cars to domestic market amid trade tensions
    Mar 10, 19:54
    Samsung's Taylor fab to focus on HPC and automotive chips, foundry clients rise to 121
    Mar 10, 19:54
    Nvidia conducted final verification visits to Samsung's Cheonan packaging plant for HBM4 supply
    Mar 10, 19:54
    Sercomm expects memory shortages and price hikes to last until end of 2026
    Mar 10, 19:54
    OpenClaw surge drives Mac mini shortage in China with high computing costs
    Mar 10, 19:40
    NEWS TAGGED PACKAGING
    Friday 6 February 2026
    ASE expects advanced packaging and testing revenue to double in 2026
    OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...
    Friday 6 February 2026
    Infineon announces price hikes up to 25%; Taiwanese power semiconductor makers plan to follow in 2Q26
    Given frequent price increases across precious metals, wafer foundry services, and packaging and testing, Infineon's announcement of price increases is very telling for the market...
    Friday 6 February 2026
    ASE Technology posts 3-year profit high on strong advanced packaging orders in 4Q25
    Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding held its earnings call, revealing that robust demand for advanced semiconductor packaging services...
    Thursday 5 February 2026
    Packaging costs rise as Chinese MCU makers push price hikes despite weak demand
    Amid rising wafer fab and raw material costs, Chinese MCU maker Cmsemicon led a 15-50% price increase to curb losses in the sluggish MCU market. Despite packaging firms signaling price...
    Thursday 5 February 2026
    Skytech delivers self-made PLP equipment, eyes record 2026 growth
    As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...
    Wednesday 4 February 2026
    TI and NXP report strong results as AI data center power management boosts semiconductor packaging demand
    Texas Instruments (TI), Infineon Technologies AG, STMicroelectronics, and NXP Semiconductors are expanding their manufacturing footprint in Malaysia as global customers accelerate...
    Wednesday 4 February 2026
    Samsung, SK Hynix move into HBM4 as yields and policy risks loom
    Samsung Electronics and SK Hynix have both secured production-ready technology for 16-layer stacks of sixth-generation high-bandwidth memory, known as HBM4, positioning the two South...
    Tuesday 3 February 2026
    AMD and Broadcom back Powertech's FOPLP; monthly revenue to hit NT$3 billion
    Memory packaging giant Powertech Technology is aggressively expanding into fan-out panel-level packaging (FOPLP), with chairman Duh-Kung Tsai optimistic about the AI industry. Amid...
    Tuesday 3 February 2026
    C Sun invests NT$1.48 billion in Taichung plant to boost AI advanced packaging equipment
    Semiconductor and printed circuit board (PCB) equipment maker C Sun announced plans to invest approximately NT$1.48 billion (US$46.87 million) to acquire a nearly 3,000-ping (106,750...
    Tuesday 3 February 2026
    Nexperia plans Malaysia expansion in face of geopolitical risks and automotive supply concerns
    Geopolitical tensions between the Netherlands and China led to Nexperia halting shipments at the end of 2025, raising concerns over potential disruptions in the automotive semiconductor...
    Tuesday 3 February 2026
    Sumitomo Bakelite to acquire Kyocera unit, paving way for Chang Wah expansion
    Japanese materials maker Sumitomo Bakelite has announced plans to acquire the materials business of Japanese electronic components company Kyocera. Industry observers say the companies'...
    Monday 2 February 2026
    SMIC reportedly sets up advanced packaging research institute in Shanghai
    As Intel, Samsung Electronics, and TSMC increase investment in advanced packaging, market sources say SMIC has set up an advanced packaging research organization in Shanghai, with...
    Monday 2 February 2026
    ASE ramps advanced packaging in Taiwan as SPIL scales central hub
    ASE Technology Holding is accelerating capacity expansion across multiple locations to meet rising demand for advanced packaging and testing services, with projects underway in northern,...
    Saturday 31 January 2026
    Nvidia CEO tells TSMC to "work harder" as 2026 demand surges; reveals 10-year capacity doubling plan

    Nvidia CEO Jensen Huang hosted a high-profile banquet in Taipei on January 31, 2026, for the leaders of Taiwan's semiconductor ecosystem.

    Friday 30 January 2026
    KLA: AI-driven process control boom lifts 2026 semiconductor equipment demand

    US semiconductor equipment maker KLA said growing AI infrastructure demand is accelerating investment in advanced logic chips, high-bandwidth...

    5/44 pages
    New Power WorldWide 2026
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook