Infineon Technologies announced on September 25, 2025, that it has signed a memorandum of understanding (MOU) with Japanese semiconductor manufacturer Rohm Semiconductor to collaborate...
ASE Technology Holdings' subsidiary, ASE Semiconductor, announced the construction of a new advanced packaging plant in Kaohsiung, Taiwan, aiming to boost production capacity to meet...
Alibaba is steadily building a vertically integrated chip ecosystem that spans cloud computing, AI chip design, and advanced packaging. People's Daily recently revealed a...
As Moore's Law approaches physical and commercial limits, advanced packaging has surged as a new battleground in the semiconductor industry. TSMC not only leads globally with its...
Hanwha Semitech is stepping up its push into Taiwan's semiconductor supply chain, holding closed-door talks with Foxconn and ASE Holdings at SEMICON Taiwan 2025, according to South...
As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled...
The global boom in artificial intelligence is creating a stark divide in the semiconductor industry, with Taiwan's TSMC solidifying its dominance while rival Samsung Electronics falls...
After two years of falling prices and sluggish commercialization in the 8-inch silicon carbide (SiC) wafer market, the industry is pinning new hopes on advanced packaging for AI chips...
The semiconductor industry is experiencing its most dramatic transformation in decades, driven by artificial intelligence's relentless demand for computing power. Traditional boundaries...
The explosive growth in AI computing demand is driving increased needs for GPUs, ASICs, and other components, accelerating the rapid development of global data center infrastructure...
Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...
Chinese AI chipmaker Cambricon Technologies is seizing what chairman and CEO Chen Tianshi describes as an "unprecedented opportunity" in intelligent computing. Surging domestic demand...
The surge of 12-inch silicon carbide (SiC) materials entering advanced packaging processes has drawn significant market attention to Episil Technology, which spans first- and third-category...
Nvidia and Intel on Thursday detailed a sweeping product roadmap that links their CPU and GPU platforms, while underscoring continued collaboration with Taiwan Semiconductor Manufacturing...
