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    US export restrictions reshape China's semiconductor equipment imports in 3Q25
    11h ago
    Global EV market shifts to multi-axis growth in 2024-25
    11h ago
    The unexpected benificary of China's rare earth curbs: Taiwan's recycling and refining industry
    11h ago
    Foxconn's AI transformation and strategic partnerships highlighted at GTC DC 2024
    11h 1min ago
    Major CSPs boost AI server supply chain with increased capital expenditure
    11h 3min ago
    Commentary: Trump-Xi meeting leaves core tech conflicts unresolved
    11h 3min ago
    NEWS TAGGED PACKAGING
    Friday 29 August 2025
    AEMC, Nanpao, and Trusval form JV targeting high-end semiconductor packaging adhesives
    AEMC, Nanpao, and Trusval, on August 28, 2025, announced the establishment of a joint venture (JV) with a capital of NT$500 million (US$16.4 million). The shareholding is divided...
    Friday 29 August 2025
    India-based boAt, HrdWyr unveil indigenously designed chip with Tata Electronics support
    boAt has partnered with semiconductor startup HrdWyr to launch the HrdWyr Indus 1011, a high-volume chip fully designed in India, with assembly, packaging, and testing enabled by...
    Friday 29 August 2025
    CG Semi launches $870m OSAT facility in Gujarat to boost India’s chip ambitions
    According to BusinessWire, CG Semi Private Limited, a subsidiary of CG Power and Industrial Solutions Limited and part of the Murugappa Group, has inaugurated its first Outsourced...
    Thursday 28 August 2025
    CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips
    Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...
    Thursday 28 August 2025
    Samsung is reportedly considering a stake in Intel to boost chip packaging and challenge TSMC

    Samsung Electronics is reportedly considering a strategic investment in Intel to strengthen its foundry business, according to South...

    Wednesday 27 August 2025
    Nvidia's CoWoP PCB architecture targets ABF substrates but faces warpage risk
    Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification...
    Wednesday 27 August 2025
    Nvidia's Huang meets Samsung, SK leaders at US summit as HBM battle escalates
    The South Korea-US summit offered a rare gathering of tech heavyweights, as Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won...
    Tuesday 26 August 2025
    ASMPT exhibits at SEMICON Taiwan, enabling chips for AI
    ASMPT will be exhibiting at SEMICON Taiwan from September 10 to 12, 2025. The theme of the presentation at Booth L0716 at Level 4, TaiNEX 1 in Taipei is: "Empower the Intelligence...
    Monday 25 August 2025
    Semco revamps IC substrate supply chain amid AI accelerator push
    Samsung Electro-Mechanics (Semco) has recently adjusted its IC substrate supply chain, appointing Mitsubishi and Resonac as the primary suppliers for key materials such as copper-clad...
    Sunday 24 August 2025
    Samsung snaps up Intel engineers as layoffs flood market with talent
    Intel is grappling with accelerating staff departures as CEO Pat Gelsinger pushes through sweeping restructuring efforts and cancels projects championed by his predecessor. The financially...
    Friday 22 August 2025
    TSMC's gross margin nears 60% as equipment allies shine
    TSMC's strong second-quarter results demonstrated resilience amid global challenges, posting a 58.6% gross margin and NT$759.83 billion (US$24.93 billion) revenue in the first half...
    Friday 22 August 2025
    Nvidia to adopt CoWoP advanced packaging for 2027 AI GPU, reshaping PCB supply chain
    Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in...
    Thursday 21 August 2025
    Research Insights: UCIe 1.1 upgrade aims at auto industry, boosts chiplet adoption
    As automotive computing platforms increasingly demand higher performance, longer lifespans, and near-zero defect rates, chip architecture faces the challenge of balancing system reliability...
    Thursday 21 August 2025
    Taiwan's MPI grabs first-mover advantage in MEMS probe cards for AI chips

    Taiwan's MPI Corporation is set to benefit from a major shift in semiconductor testing, as global cloud providers ramp up custom AI chip...

    Thursday 21 August 2025
    SJ Semiconductor advances 3D packaging as key Huawei partner, climbs global OSAT rankings
    China's semiconductor packaging and testing firm SJ Semiconductor (SJ Semi) has made significant headway with the completion of its third production facility, J2C, in Jiangyin's high-tech...
    11/36 pages
    Research Report Database
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Thursday 30 October 2025
    Asian Power Devices Officially Launches New Vietnam Factory, Setting a New Global Production Milestone
    Thursday 30 October 2025
    BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'
    Thursday 23 October 2025
    APD: Technology-Driven Innovation Powering Global Growth
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