Universal Scientific Industrial (USI), a wholly-owned subsidiary of ASE Technology (ASEH), has disclosed that it is committed to integrating the production of powertrain systems,...
IC leadframe demand is expected to grow sharply in the next several years, as a result of expansions of packaging capacity. Texas Instruments (TI), for example, has recently announced...
Micron Technology Inc. is close to an agreement to commit at least $1 billion toward setting up a semiconductor packaging factory in India, according to people with knowledge of the...
Siliconware Precision Industries (SPIL) with its 2.5D and fan-out packaging technology has cut into the supply chain of network processor vendor Marvell, according to industry sour...
Lockheed Martin and GlobalFoundries (GF) have announced a strategic collaboration to advance semiconductor manufacturing and innovation in the United States and to enhance the security,...
According to IDC Worldwide Industrial Printer Tracker, a total of 52 units of digital label and packaging printers were shipped in the first quarter of 2023 for Asia Pacific excluding...
Integrated Service Technology (iST), a specialist in IC materials analysis, has reported a 10.2% increase in revenue year-over-year from January to May, thanks to robust reliability...
Taiwan-based CMOS imagery sensor (CIS) packaging giant Tong Hsing Electronics, an affiliate of the Yageo Group, has been working actively to make adjustments to its shareholding in...
Most Taiwan-based LED chipmakers and packaging houses, including Ennostar and Everlight, posted sequential revenue gains in May as demand from downstream customers began to warm up,...
TSMC's Advanced Backend Fab 6, the foundry's first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration,...
IC packaging leadframe supplier Chang Wah Technology (CWTC), which saw its monthly revenue exceed NT$1 billion (US$32.5 million) for the second consecutive month in May, is likely...
TSMC held its shareholders' meeting today, where chairman Mark Liu stated that the company has faced various global challenges in recent years, including the US-China trade war, climate...