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    How a misread partnership exposed Nissan’s deeper uncertainties
    1min ago
    SEMICON West 2025: Chip leaders urge policy stability to counter China
    14min ago
    New H-1B fee surge forces Indian tech firms to rethink global workforce plans
    14min ago
    China's top-four TV brands dominate 90% of surging miniLED market
    15min ago
    FuriosaAI leads South Korea's physical AI push
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    First of Taiwan's FORMOSAT-8 satellite heads to the US for launch into orbit
    19min ago
    NEWS TAGGED PACKAGING
    Friday 22 August 2025
    Nvidia to adopt CoWoP advanced packaging for 2027 AI GPU, reshaping PCB supply chain
    Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in...
    Thursday 21 August 2025
    Research Insights: UCIe 1.1 upgrade aims at auto industry, boosts chiplet adoption
    As automotive computing platforms increasingly demand higher performance, longer lifespans, and near-zero defect rates, chip architecture faces the challenge of balancing system reliability...
    Thursday 21 August 2025
    Taiwan's MPI grabs first-mover advantage in MEMS probe cards for AI chips

    Taiwan's MPI Corporation is set to benefit from a major shift in semiconductor testing, as global cloud providers ramp up custom AI chip...

    Thursday 21 August 2025
    SJ Semiconductor advances 3D packaging as key Huawei partner, climbs global OSAT rankings
    China's semiconductor packaging and testing firm SJ Semiconductor (SJ Semi) has made significant headway with the completion of its third production facility, J2C, in Jiangyin's high-tech...
    Thursday 21 August 2025
    Chinese firms enter advanced hybrid bonding race as global chipmakers accelerate
    With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely...
    Wednesday 20 August 2025
    Why TSMC's CoWoS bottleneck could lock AI memory makers into Nvidia's orbit
    The AI chip market is expected to stay under Nvidia's dominance in 2026, as Samsung Electronics, SK Hynix, and Micron battle to win sixth-generation high-bandwidth memory (HBM4) orders...
    Monday 18 August 2025
    Strong demand for advanced nodes drives Topco's 1H25 revenue growth
    Topco Scientific (TSC) stated during an earnings call on August 14, 2025, that current semiconductor market conditions are on par with the first quarter of 2025, adding that advanced...
    Sunday 17 August 2025
    TSMC’s top wafer testing partner posts 78% surge as new facility ramps
    Xintec Inc., TSMC's backend packaging and testing unit, posted a strong second-quarter 2025 rebound in wafer probe revenue, driven by increased outsourcing from TSMC and the accelerated...
    Friday 15 August 2025
    Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp
    TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...
    Friday 15 August 2025
    ChipMOS rebounds after first loss, raises memory chip prices in 3Q25
    Memory packaging and testing company ChipMOS faced a net loss of NT$533 million (US$17.8 million) after tax in the second quarter of 2025, impacted by rising overall costs and New...
    Thursday 14 August 2025
    Samsung reportedly plans US$170M in Japan packaging hub to challenge TSMC
    Samsung Electronics is reportedly investing JPY25 billion (approx. US$170 million) to set up an advanced packaging research institute in Yokohama and acquire a major office tower...
    Thursday 14 August 2025
    AblePrint seizes AI packaging edge with early WMCM, CoPoS deployment

    AblePrint Technology (APT), a key supplier of advanced degassing equipment to major chipmakers such as TSMC, reported strong second-quarter...

    Thursday 14 August 2025
    Samsung aims to meet Tesla's chip packaging demand with new panel-level technology
    Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible...
    Wednesday 13 August 2025
    China's chip equipment spending surges in 1H25, defying global downturn
    China's semiconductor industry posted CNY455 billion (approx. US$63.3 billion) in total investment during the first half of 2025, down 9.8% from a year earlier, according to a new...
    Wednesday 13 August 2025
    Zhen Ding bullish on CoWoP despite long road to mass production
    Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...
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    SpecialReports
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Wednesday 1 October 2025
    Wise Integration Launches First Digital Controller, WiseWare 1.1, for GaN Totem Pole PFC with High Switching Frequency Up to 2 MHz
    Wednesday 1 October 2025
    AI Applications, Innovation Empowered! The Fourth GMIF2025 Innovation Summit Successfully Concluded
    Wednesday 1 October 2025
    Embracing WP.29 R155 and R156-Winbond Secure Flash Memory Accelerates Automotive Compliance and Differentiation
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