Taiwan's TSMC has urged the US Department of Commerce to avoid disrupting its record-setting US$165 billion chip investment in Arizona amid a national security probe into semiconductor...
According to an official press release, Deca Technologies has signed an agreement with IBM to deploy its M-Series and Adaptive Patterning technologies at IBM's advanced packaging...
During Computex 2025, Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These include Unimicron for CoWoS substrates,...
ASE Technology Holdings is witnessing strong order momentum in its advanced test materials (ATM) business, fueled by surging AI-related demand. Company executives revealed that testing...
As capex simultaneously rises across foundry, outsourced semiconductor assembly and test (OSAT), and printed circuit board (PCB) sectors, C Sun Manufacturing, a specialist in PCB...
MediaTek CEO Rick Tsai delivered a keynote speech at Computex 2025, revealing that MediaTek's first 2nm chip will officially be taped out in September 2025, signifying that the company's...
From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April,...
Semiconductor equipment manufacturer All-Ring Tech (ART) recently reported a significant cybersecurity incident involving the leakage of internal data by external hackers. ART stated...
South Korean authorities arrested a former subcontractor employee at Incheon International Airport for allegedly attempting to smuggle SK Hynix's proprietary high-bandwidth memory...
China's outsourced semiconductor assembly and test (OSAT) industry is gaining momentum, driven by surging demand for artificial intelligence (AI) and electric vehicles (EVs). As the...
The semiconductor industry's decades-long strategy of shrinking transistors faces diminishing returns, forcing companies to explore alternative technologies for competitive advantage...
In the surging global demand for AI applications, TSMC has announced a sweeping expansion of its advanced process and packaging capacity. In its latest disclosure, TSMC revealed plans...
Taiwan's ASE Technology Holdings and US-based Amkor Technology maintain their positions atop the global outsourced semiconductor assembly and test (OSAT) market, though both face...
ASE Holdings, a global leader in semiconductor packaging and testing, announced that its subsidiary ASE Test Limited will initiate a tender offer to acquire Advanced Microelectronic...
