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NEWS TAGGED PACKAGING
Friday 23 May 2025
TSMC urges caution in US semiconductor probe, highlights US$165B investment in Arizona
Taiwan's TSMC has urged the US Department of Commerce to avoid disrupting its record-setting US$165 billion chip investment in Arizona amid a national security probe into semiconductor...
Friday 23 May 2025
IBM and Deca boost North American chipmaking with new advanced packaging line in Quebec
According to an official press release, Deca Technologies has signed an agreement with IBM to deploy its M-Series and Adaptive Patterning technologies at IBM's advanced packaging...
Thursday 22 May 2025
Nvidia's Taiwan inner circle powers up for the Blackwell era
During Computex 2025, Nvidia CEO Jensen Huang highlighted key Taiwanese suppliers central to its AI chip packaging and testing ecosystem. These include Unimicron for CoWoS substrates,...
Thursday 22 May 2025
ASE’s advanced test unit surges on AI chip boom
ASE Technology Holdings is witnessing strong order momentum in its advanced test materials (ATM) business, fueled by surging AI-related demand. Company executives revealed that testing...
Thursday 22 May 2025
Advanced packaging fuels growth for C Sun
As capex simultaneously rises across foundry, outsourced semiconductor assembly and test (OSAT), and printed circuit board (PCB) sectors, C Sun Manufacturing, a specialist in PCB...
Wednesday 21 May 2025
From exit to OSAT: Foxconn's WLP comeback in Indian semiconductors
Last week, India cleared a proposal for a new chip plant to be developed by HCL Group and Taiwanese electronics giant Foxconn.
Wednesday 21 May 2025
MediaTek to tape out its first 2nm chip in September 2025
MediaTek CEO Rick Tsai delivered a keynote speech at Computex 2025, revealing that MediaTek's first 2nm chip will officially be taped out in September 2025, signifying that the company's...
Monday 19 May 2025
The beauty and sorrow of a one-man stage: TSMC's advanced process technology and packaging
From the Consumer Electronics Show (CES) 2025 at the beginning of the year, Nvidia's GPU Technology Conference (GTC) in March, to TSMC's North America Technology Symposium in April,...
Monday 19 May 2025
ART confirms normal operations after hacker attack, no confidential data compromised
Semiconductor equipment manufacturer All-Ring Tech (ART) recently reported a significant cybersecurity incident involving the leakage of internal data by external hackers. ART stated...
Monday 19 May 2025
South Korea intercepts SK Hynix HBM China-bound tech leak
South Korean authorities arrested a former subcontractor employee at Incheon International Airport for allegedly attempting to smuggle SK Hynix's proprietary high-bandwidth memory...
Monday 19 May 2025
AI, EV boom thrusts advanced packaging to forefront of China's chip strategy
China's outsourced semiconductor assembly and test (OSAT) industry is gaining momentum, driven by surging demand for artificial intelligence (AI) and electric vehicles (EVs). As the...
Monday 19 May 2025
Chipmakers seek edge beyond Moore's Law as computing power race escalates
The semiconductor industry's decades-long strategy of shrinking transistors faces diminishing returns, forcing companies to explore alternative technologies for competitive advantage...
Monday 19 May 2025
Made in America, finished in Taiwan: TSMC’s expansion highlights a lingering gap
In the surging global demand for AI applications, TSMC has announced a sweeping expansion of its advanced process and packaging capacity. In its latest disclosure, TSMC revealed plans...
Friday 16 May 2025
ASE maintains semiconductor packaging dominance despite Chinese surge
Taiwan's ASE Technology Holdings and US-based Amkor Technology maintain their positions atop the global outsourced semiconductor assembly and test (OSAT) market, though both face...
Thursday 15 May 2025
ASE to acquire AMPI in strategic bid to restructure 6-inch foundry ops, tap AI chip demand
ASE Holdings, a global leader in semiconductor packaging and testing, announced that its subsidiary ASE Test Limited will initiate a tender offer to acquire Advanced Microelectronic...