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NEWS TAGGED PACKAGING
Wednesday 13 August 2025
India approves four chip projects under ISM
India has approved four additional semiconductor projects under the India Semiconductor Mission (ISM), further strengthening the country's semiconductor manufacturing ecosystem. These...
Wednesday 13 August 2025
TSMC adds US$10B to US subsidiary in strategic forex hedge
Taiwan Semiconductor Manufacturing Company (TSMC) held a board meeting on August 12, during which several key resolutions were made. Of particular interest was the approval to increase...
Tuesday 12 August 2025
ASMPT to wind down Shenzhen plant in China, cutting 950 jobs
Singapore-based semiconductor and electronics manufacturing equipment supplier ASMPT will shut down its wholly owned Shenzhen subsidiary, ASMPT Equipment (Shenzhen) Co. (AEC), as...
Tuesday 12 August 2025
ASE invests US$217 million to expand advanced packaging capacity in Kaohsiung
ASE Technology Holdings, a leading global semiconductor assembly and testing company, will invest approximately NT$6.5 billion (US$217 million) to purchase a factory and related facilities...
Tuesday 12 August 2025
HiSilicon ally SJ Semi taps domestic lithography to scale advanced packaging output
SJ Semiconductor (Jiangyin) Corp. (SJ Semi), a major packaging and testing partner of Huawei's chip design arm HiSilicon, has received domestically developed back-end steppers from...
Monday 11 August 2025
Samsung reportedly planning to produce iPhone image sensors in Texas, but keep packaging in Korea
Samsung Electronics will build a CMOS image sensor (CIS) production line at its Austin, Texas, semiconductor facility for Apple's next-generation iPhones, but the chips' back-end...
Monday 11 August 2025
TSMC fine-tunes advanced packaging, delays projects, and trims low-return ops
Taiwan Semiconductor Manufacturing Co. (TSMC) has undergone a reorganization of its advanced packaging capacity and workforce, even as it publicly emphasizes expansion efforts. The...
Monday 11 August 2025
Taiwan chipmakers sidestep HBM giants with tailored edge-AI memory
Taiwanese memory chipmakers are intensifying efforts to capture growth in customized AI applications, unveiling low-power, high-bandwidth alternatives to High Bandwidth Memory (HBM)...
Monday 11 August 2025
From cost burden to growth engine: AI revolutionizes advanced packaging
At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation...
Sunday 10 August 2025
Tesla's Dojo shutdown signals new alliances with Samsung and Intel in AI race

Tesla is dismantling its in-house AI supercomputer project "Dojo" and shifting gears toward a new external chip strategy involving Samsung...

Sunday 10 August 2025
Ample Electronic unveils advanced thermal paste for AI chip cooling

Ample Electronic Technology, a leading upstream supplier of conductive pastes and thick-film conductor materials for passive components,...

Friday 8 August 2025
Intel breaks from GPU-centric playbook as CEO Tan charts AI-focused overhaul
Intel is undergoing a sweeping strategic overhaul under CEO Lip-Bu Tan, signaling a decisive break from legacy structures and a bold push to reposition the company at the center of...
Thursday 7 August 2025
OSAT giants expand in US as Trump pushes for 100% tariff on chip imports
Amkor and ASE, two of the world's top semiconductor packaging and testing providers, are deepening their US presence following the return of Trump-era "Made in America" policies....
Thursday 7 August 2025
ASE challenges TSMC’s photonics play with CPO packaging push
At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
Wednesday 6 August 2025
OCP APAC 2025: ASE doubles down on co-packaged optics as AI reshapes semiconductor design
As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...