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Wednesday 26 July 2023
TSMC's new CoWoS packaging plant to start volume production in mid-2027
TSMC is planning to invest nearly NT$90 billion (US$2.85 billion) to establish an advanced chip packaging plant in Miaoli, northern Taiwan with the facility scheduled to begin volume...
Thursday 20 July 2023
Samsung reportedly eyes Nvidia orders as TSMC packaging capacity remains tight
As GPUs become essential components for artificial intelligence (AI) computing, orders for Nvidia GPUs are also garnering attention. Recently, there have been reports that Nvidia...
Wednesday 19 July 2023
RAMP-C program on Intel 18A adds 2 strategic defense industrial base customers
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
Tuesday 18 July 2023
Semiconductor suppliers turn to 2Q24 for PC and handset recovery
Seeing demand for handsets and PCs likely to remain sluggish for the second half of 2023, many semiconductor suppliers are now eyeing a recovery in the second quarter of 2024, according...
Tuesday 18 July 2023
Samsung Foundry reportedly received 4nm AI chip order; advanced packaging may become bottleneck
Reports stated that due to Samsung Foundry's massive improvement in its 4nm process yield rate, it has already secured an AI chip foundry order from a major data center client.
Friday 14 July 2023
Backend fab toolmakers see short lead-time orders from TSMC
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
Wednesday 12 July 2023
System vendors to strive for capacity at IC analysis labs
System vendors are seeking capacity support from IC analysis laboratories for 2024 through their contracted IP service providers, as they foresee high demand for advanced packaging,...
Wednesday 12 July 2023
Heat sink demand rising for advanced packaging, say distributors
IC materials distributors have enjoyed a ramp-up in orders for heat sinks, thanks to strong advanced packaging demand for HPC chips, according to industry sources.
Monday 10 July 2023
Harvatek expects LED packaging demand to stay weak in 2H23, but business to remain profitable for 2023
LED packaging house Harvatek is unlikely to see its revenue grow as strong as expected in the second half as its US-based clients were conservative about demand during the peak season,...
Friday 7 July 2023
AMD to secure available CoWoS packaging capacity at TSMC
One of AMD CEO Lisa Su's priorities for her planned mid-July visit to Taiwan will be securing TSMC's available CoWoS packaging capacity, according to sources with knowledge of the...
Friday 7 July 2023
Frontend manufacturing yield crucial for Samsung advanced packaging competitiveness
Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...
Monday 3 July 2023
MA-tek steps up overseas expansion
IC verification lab Materials Analysis Technology (MA-tek) plans to allocate NT$1.2 billion (US$38.6 million) in capital expenditures for 2023, of which nearly 80% will be used to...
Monday 3 July 2023
China-based JCET expands advanced packaging business to take on ASE and TSMC
As the geopolitical tensions between the US and China are leading to reshaping the global supply chain landscape, China-based JCET is looking to grab a bigger pie of the rising Chinese...
Thursday 29 June 2023
Niching sees clear demand visibility through end-2023
Niching Industrial, which distributes IC packaging materials, has seen a steady recovery in demand for display driver ICs (DDI) and a significant rise in demand for vapor chambers...
Thursday 29 June 2023
IC backend industry supply chains in Eastern Europe, Southeast Asia expanding
As semiconductor firms such as IDM Intel and OSAT ASE Technology increase their local investments, packaging and testing supply chains are expanding in Eastern Europe and Southeast...
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Summary of Tech Supply Chain News!
Taiwan foundry industry revenues to slip in 1Q24 before rising in 2Q24, says DIGITIMES Research
Research Insight: Intel obtains subsidies but faces challenges
South Korea-based makers lead transparent display as China-based competitors ramp up Inkjet investments, according to DIGITIMES Research