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    H200 China clearance to benefit SK Hynix directly, Samsung gradually
    7h 51min ago
    Samsung's Trifold phone launch in China to challenge Huawei dominance
    7h 51min ago
    Foxconn and Luxshare expand Vietnam production amid game console supply chain reshuffle
    7h 51min ago
    Commentary: China's tech mergers face setbacks amid valuation and integration challenges
    7h 51min ago
    China's tech barriers on auto creates new cross-border opportunities for Taiwan
    7h 51min ago
    China's PCB industry maintains dominance amid US decoupling
    7h 51min ago
    NEWS TAGGED PACKAGING
    Wednesday 8 October 2025
    India approves NaMo Semiconductor Lab at IIT Bhubaneswar
    Union Minister for Electronics and Information Technology Ashwini Vaishnaw has approved the establishment of the NaMo Semiconductor Laboratory at the Indian Institute of Technology...
    Tuesday 7 October 2025
    Upstream substrate and leadframe price hikes pressure IC packaging costs
    Since early 2025, rising costs of precious metals such as gold and silver have triggered price increase signals in the supply chain for key materials like substrates and leadframes...
    Tuesday 7 October 2025
    Taiwan's silicon shield under siege as US accelerates chip onshoring
    A US proposal to evenly split advanced semiconductor production between Taiwan and the United States has sparked deep concern in the industry and triggered a political debate in Taipei,...
    Monday 6 October 2025
    India roundup: Number of Apple suppliers in India likely reaches 45
    Despite bottlenecks, including culture, Taiwan-India bilateral ties are expanding. The number of Apple suppliers in India is likely to reach 45 amid production diversification.
    Monday 6 October 2025
    Indian state courts SK Hynix with investment proposal amid global expansion plans
    The government of Andhra Pradesh is stepping up efforts to attract SK Hynix, one of the world's leading memory chipmakers, to establish a facility in India. According to The Deccan...
    Monday 6 October 2025
    Amkor breaks ground on Arizona packaging facility near TSMC
    US-based semiconductor packaging and test services provider Amkor Technology announced it will hold a groundbreaking ceremony on October 6, 2025, to officially begin construction...
    Friday 3 October 2025
    ASE Technology launches new factory in Kaohsiung to expand advanced semiconductor packaging
    ASE Technology Holding has initiated construction of a new K18B factory at the Nanzi Science Park in Kaohsiung to address growing demand in artificial intelligence (AI), automotive...
    Friday 3 October 2025
    SAS subsidiary signs 10-year green power deal with Amkor
    Amid the semiconductor supply chain's ongoing push for green transformation, Sustainable Energy Solution, a renewable power sales company under the Sino-American Silicon Products...
    Friday 3 October 2025
    Intel courts billions from big tech and Musk
    Intel's ambitious revival remains far from fully financed, even after securing investments from SoftBank, the US government, and Nvidia. Analysts estimate the chipmaker still needs...
    Thursday 2 October 2025
    Intel bets its future on Nvidia's CUDA
    When Intel and Nvidia announced their partnership on September 18, 2025, the US$5 billion equity stake dominated headlines. But beneath the financial fanfare lies a far more consequential...
    Tuesday 30 September 2025
    Qualcomm engages with India's chip packaging sector, open to partnerships with local players
    Qualcomm is in active discussions with multiple Indian suppliers, including the Tata Group, to leverage the country's semiconductor packaging capacity and is open to collaborating...
    Tuesday 30 September 2025
    Non-China supply chain pushes 12-inch SiC into advanced packaging, but China stands to gain
    The surge in AI chips fueling CoWoS packaging demand has put silicon carbide (SiC), a third-generation semiconductor, on the verge of entering this high-value arena. The shift is...
    Sunday 28 September 2025
    SEA emerges as key hub amid shifting PCB supply chains
    Taiwan-based Ampoc, a distributor and manufacturer of PCB wet process equipment and semiconductor materials, anticipates increasing overlap between PCB and semiconductor industries...
    Sunday 28 September 2025
    TSMC’s 2nm gamble stretches from Hsinchu to Arizona

    Taiwan Semiconductor Manufacturing Company (TSMC), the world's leading contract chipmaker, has begun ramping up production of its cutting-edge...

    Sunday 28 September 2025
    Hanmi Semiconductor expands into advanced chip packaging for AI era

    Hanmi Semiconductor, a rising force in semiconductor equipment manufacturing, is rapidly expanding its influence in the AI hardware ecosystem...

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    BIZ FOCUS
    Dec 8, 08:00
    SK hynix Honored with Two Major Titles at GSA Awards 2025
    Monday 8 December 2025
    LitePoint 2025: Shaping the Future with Wi-Fi 8 and Optical Communication Testing
    Friday 5 December 2025
    Navigating Semiconductor Demand and Supply Challenges in 2026
    Thursday 4 December 2025
    ASIC Shift for High-Speed Computing: PGC's Design Service Turnkey Platform Speeds Time-to-Market
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