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NEWS TAGGED PACKAGING
Wednesday 4 June 2025
South Korea maintains HBM chip lead while China faces tech and trade hurdles
The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
Wednesday 4 June 2025
ASE bets on new chip tech to handle AI’s rising power and speed needs
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Tuesday 3 June 2025
Samsung upgrades capacity layout, reportedly transforming old memory lines into packaging mainstay
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Tuesday 3 June 2025
Chip packaging material shortage deepens as top supplier raises prices 20%
Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...
Monday 2 June 2025
Applied Materials reportedly partners with Absolics in glass substrate
Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced lithography equipment dedicated to this emerging segment...
Monday 2 June 2025
Samsung Electro-Mechanics to supply glass substrate samples to US firms, Korean giants target TSMC's packaging lead
Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...
Monday 2 June 2025
AIchip goes all in on CoWoS advanced packaging
Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced...
Thursday 29 May 2025
Hanmi Semiconductor wins US$5.8 million ASE supply contract
Hanmi Semiconductor has secured a major supply agreement with Taiwan's ASE Technology Holding Co., marking another strategic win in its global expansion drive. Under the contract,...
Tuesday 27 May 2025
TSMC's CoWoS boom squeezes substrates, stirs NAND pricing
Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing...
Tuesday 27 May 2025
FOCI advances 1.6T optical module validation as LPO and CPO poised to coexist
As data transmission and exchange volumes skyrocket, high-speed connectivity has emerged as a defining trend in the tech landscape. FOCI Fiber Optic Communications, a leading player...
Tuesday 27 May 2025
Malaysia bets on advanced chip design to power US$270 billion semiconductor ambition
Southeast Asian nation pivots from assembly hub to IC design powerhouse amid global supply chain tensions, but faces talent and scaling challenges
Tuesday 27 May 2025
AI chips and CoWoS orders keep HPI’s outlook running hot
Hon. Precision (HPI), a leading IC test equipment manufacturer, is benefiting from robust AI chip demand. In the first quarter of 2025, its after-tax net profit surged to NT$2.568...
Monday 26 May 2025
TSMC's advanced packaging booms on Middle East AI orders, boost by Apple's WMCM
Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's...
Monday 26 May 2025
Weekly news roundup: Huawei's 5G lead, DeepSeek's LLM moves, and TSMC's packaging gap
These are the most-read DIGITIMES Asia stories from the week of May 19 – May 25. Highlights include China's accelerating push for tech self-sufficiency with new AI...
Monday 26 May 2025
As Nvidia deepens roots in Taipei, Taiwan launches push to attract global talent

Nvidia CEO Jensen Huang delivered a powerful message at the company's GTC global press conference in Taipei this week: the key to Nvidia's...