The explosive growth in AI computing demand is driving increased needs for GPUs, ASICs, and other components, accelerating the rapid development of global data center infrastructure...
Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...
Chinese AI chipmaker Cambricon Technologies is seizing what chairman and CEO Chen Tianshi describes as an "unprecedented opportunity" in intelligent computing. Surging domestic demand...
The surge of 12-inch silicon carbide (SiC) materials entering advanced packaging processes has drawn significant market attention to Episil Technology, which spans first- and third-category...
Nvidia and Intel on Thursday detailed a sweeping product roadmap that links their CPU and GPU platforms, while underscoring continued collaboration with Taiwan Semiconductor Manufacturing...
Initial market skepticism doubted whether new fabs from TSMC and Intel in Arizona could ramp up production on schedule. However, TSMC's first 4nm fab began mass production at the...
Topco Scientific (TSC) is actively expanding its global footprint. Chairman Jeffery Pan stated that following the layout of global semiconductor clusters, besides establishing locations...
Intel and Nvidia have struck a landmark deal, with Nvidia investing US$5 billion for about 4% of Intel. The two will co-develop SoCs integrating Intel's x86 CPUs and Nvidia's RTX...
STMicroelectronics (STM) has announced a US$60 million investment to establish a panel-level packaging (PLP) technology pilot production line at its Tours facility in France, with...
Hanwha E-ssential, a subsidiary of Hanwha Solutions, has successfully localized the production of semiconductor packaging insulation materials in South Korea. The company plans to...
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Vietnamese technology giant FPT Corporation is intensifying its push into the semiconductor industry with plans to establish a new backend semiconductor manufacturing facility in...
Bengaluru-based Kaynes Semicon has signed a memorandum of understanding with California's Mirrorcle Technologies to manufacture MEMS mirrors and optical systems in India.
SEMICON Taiwan 2025 gathered a wide range of packaging and test equipment suppliers, all unveiling their latest technologies and solutions. Central to the event was the emerging "advanced...
Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx...
