The global HBM market is undergoing a seismic shift, propelled by surging demand for AI and high-performance computing. South Korea's memory heavyweights—Samsung Electronics...
ASE has introduced a new packaging innovation—FOCoS-Bridge with through-silicon via (TSV) integration—designed to support the growing power and bandwidth needs of artificial...
Samsung Electronics is reportedly repurposing its existing facilities to bolster its advanced semiconductor packaging capabilities, aiming to enhance competitiveness in the rapidly...
Rising artificial intelligence chip demand has strained supplies of critical materials used in advanced semiconductor packaging, with Japan's Nittobo announcing price increases of...
Applied Materials has entered the semiconductor glass substrate market, reportedly developing the industry's most advanced lithography equipment dedicated to this emerging segment...
Samsung Electro-Mechanics announced that preparations for its glass substrate sample production line are nearing completion, with plans to begin supplying samples to two to three...
Fabless manufacturer AIchip Technologies held a shareholders' meeting on May 29, during which it held a reelection of directors and supervisors. Jerry Tzou, the director of advanced...
Hanmi Semiconductor has secured a major supply agreement with Taiwan's ASE Technology Holding Co., marking another strategic win in its global expansion drive. Under the contract,...
Mitsubishi Gas Chemical (MGC), the world's leading supplier of BT substrate base materials, has notified clients of delayed shipments due to tightening raw material supply. The growing...
As data transmission and exchange volumes skyrocket, high-speed connectivity has emerged as a defining trend in the tech landscape. FOCI Fiber Optic Communications, a leading player...
Hon. Precision (HPI), a leading IC test equipment manufacturer, is benefiting from robust AI chip demand. In the first quarter of 2025, its after-tax net profit surged to NT$2.568...
Semiconductor industry analysts project a bright future for TSMC's advanced packaging systems, driven by significant demand from the Middle East for AI-centric CoWoS chips and Apple's...
These are the most-read DIGITIMES Asia stories from the week of May 19 – May 25. Highlights include China's accelerating push for tech self-sufficiency with new AI...
