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NEWS TAGGED PACKAGING
Monday 22 September 2025
Sunengine enters CPO advanced packaging supply chain
The explosive growth in AI computing demand is driving increased needs for GPUs, ASICs, and other components, accelerating the rapid development of global data center infrastructure...
Sunday 21 September 2025
Huawei patents SiC cooling tech to power next-gen AI chips
Huawei has disclosed two new patents in China targeting advanced cooling solutions for AI chips, highlighting the rising urgency around thermal management as chip power consumption...
Sunday 21 September 2025
China's Cambricon taps into unprecedented boom in AI chips
Chinese AI chipmaker Cambricon Technologies is seizing what chairman and CEO Chen Tianshi describes as an "unprecedented opportunity" in intelligent computing. Surging domestic demand...
Sunday 21 September 2025
Non-China market opportunities remain despite no involvement in advanced packaging, say Episil and EPI
The surge of 12-inch silicon carbide (SiC) materials entering advanced packaging processes has drawn significant market attention to Episil Technology, which spans first- and third-category...
Saturday 20 September 2025
Intel-Nvidia's twin strategy faces speed test, but PC path leads, says DIGITIMES analyst
Nvidia and Intel on Thursday detailed a sweeping product roadmap that links their CPU and GPU platforms, while underscoring continued collaboration with Taiwan Semiconductor Manufacturing...
Saturday 20 September 2025
Arizona emerges as a semiconductor hub with TSMC and Intel's 12 fabs
Initial market skepticism doubted whether new fabs from TSMC and Intel in Arizona could ramp up production on schedule. However, TSMC's first 4nm fab began mass production at the...
Saturday 20 September 2025
TSC expands overseas presence, optimistic for double-digit growth in 2026
Topco Scientific (TSC) is actively expanding its global footprint. Chairman Jeffery Pan stated that following the layout of global semiconductor clusters, besides establishing locations...
Friday 19 September 2025
Intel–Nvidia pact fuses x86 and RTX, bolstering Tan’s turnaround strategy
Intel and Nvidia have struck a landmark deal, with Nvidia investing US$5 billion for about 4% of Intel. The two will co-develop SoCs integrating Intel's x86 CPUs and Nvidia's RTX...
Friday 19 September 2025
STMicroelectronics to build PLP pilot line in Tours, aiming for 3Q26 production
STMicroelectronics (STM) has announced a US$60 million investment to establish a panel-level packaging (PLP) technology pilot production line at its Tours facility in France, with...
Thursday 18 September 2025
Hanwha E-ssential challenges Ajinomoto's ABF monopoly with 2026 launch
Hanwha E-ssential, a subsidiary of Hanwha Solutions, has successfully localized the production of semiconductor packaging insulation materials in South Korea. The company plans to...
Thursday 18 September 2025
CoPoS emerges as successor to CoWoS: K&S aligns with AI chip demands
Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS)...
Thursday 18 September 2025
FPT eyes leadership in Vietnam's semiconductor packaging and testing sector
Vietnamese technology giant FPT Corporation is intensifying its push into the semiconductor industry with plans to establish a new backend semiconductor manufacturing facility in...
Thursday 18 September 2025
Kaynes Semicon, Mirrorcle Technologies sign MoU to produce MEMS mirrors in India
Bengaluru-based Kaynes Semicon has signed a memorandum of understanding with California's Mirrorcle Technologies to manufacture MEMS mirrors and optical systems in India.
Wednesday 17 September 2025
Taiwan's MPI, WinWay, and Chunghwa Precision join advanced chip test race
SEMICON Taiwan 2025 gathered a wide range of packaging and test equipment suppliers, all unveiling their latest technologies and solutions. Central to the event was the emerging "advanced...
Wednesday 17 September 2025
China's Big Fund Phase III opens with Piotech Jianke investment in hybrid bonding technology
Chinese chip equipment maker Piotech said on September 12 its unit Piotech Jianke (Haining) Semiconductor Equipment has kicked off a new funding round at a CNY2.5 billion (approx...