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NEWS TAGGED PACKAGING
Tuesday 9 September 2025
Aplex partners with Adirtek to enter CoWoS supply chain
Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process...
Tuesday 9 September 2025
China's ACM ships first KrF coater-developer to logic fab as local supply chain advances
As the global semiconductor industry undergoes rapid restructuring, Chinese equipment makers are racing to achieve breakthroughs and scale. ACM Research (Shanghai), Inc. has introduced...
Tuesday 9 September 2025
Taiwan's industrial PC firms expand role in semiconductor supply chain amid rising demand
Taiwan's semiconductor sector continues to assert its significance globally, with surging demand for advanced processing and packaging technologies driving industrial PC (IPC) manufacturers...
Tuesday 9 September 2025
TSMC and OSATs ramp up advanced semiconductor packaging amid AI-driven demand surge
TSMC and major OSAT firms are aggressively expanding their advanced packaging capacity in response to rising demand driven by AI applications. Once considered peripheral, advanced...
Tuesday 9 September 2025
ASE COO outlines Taiwan's semiconductor outlook amid post-AI era challenges
As SEMICON Taiwan 2025 nears, ASE Technology's COO Tien Wu highlighted the semiconductor industry's decade-long outlook, stressing challenges in reshaping the value chain in the post-AI...
Monday 8 September 2025
Semicon Taiwan 2025 sets new records, focusing on AI, advanced packaging, and memory
SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies...
Monday 8 September 2025
Skytech secures orders for self-developed PLP equipment as OSAT firms adopt CoPoS
Following TSMC's confirmation in February 2025 that it will include 310×310 mm panels in its chip-on-panel-on-substrate (CoPoS) mass production, supply chain players—including...
Monday 8 September 2025
Shenzhen's International Semiconductor Expo highlights AI and advanced packaging breakthroughs
Shenzhen International Semiconductor & IC Exhibition, known as SEMI-e 2025, will take place September 10-12 at the Shenzhen World Exhibition & Convention Center. The event...
Monday 8 September 2025
South Korea's MCP exports to Taiwan surge, debunking AI bubble concern and boosting SK Hynix outlook
South Korea's multi-chip packaging (MCP) exports continued to climb sharply in August 2025, with the share of high-bandwidth memory (HBM) exports to Taiwan steadily increasing.
Sunday 7 September 2025
France pushes into Taiwan's chip ecosystem with advanced packaging focus and new Foxconn tie-up

France is preparing its biggest foray yet into Asia's semiconductor heartland. At SEMICON Taipei next week, Paris will field its largest...

Saturday 6 September 2025
Micron bets on culture and ecosystem strength in high-stakes HBM battle
Micron is sharpening its case in the high-bandwidth memory (HBM) market, where it faces entrenched rivals and rising competition.
Friday 5 September 2025
Tech Forum 2025: AI chip testing seen as necessary evil amid heterogeneous integration challenges, says National Instruments
As AI chip manufacturing technology rapidly evolves, US test equipment manufacturer National Instruments (NI) points out that many view the testing phase as a "necessary evil." Customers...
Friday 5 September 2025
Asahi Kasei to double chip insulating material output by 2030 as AI data centers soar
Japan's semiconductor materials suppliers are racing to expand capacity as the AI data center build-out drives unprecedented demand for advanced chips and packaging inputs. Nikkei...
Friday 5 September 2025
Aoi Electronics acquires Sharp's Mie factory to produce data center and packaging products
Aoi Electronics, a Japanese outsourced semiconductor assembly and test (OSAT) provider, has purchased Sharp's factory in Taki, Mie Prefecture, and will convert the site into a new...
Friday 5 September 2025
Commentary: Advanced AI packaging driving semiconductor industry toward 'virtual integration'
Advanced packaging is rewriting the rules of the semiconductor industry. According to DIGITIMES Research, in 2024, global AI data center accelerators (covering GPUs and ASICs)...