TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

, Hsinchu

Jul 10, 2026, 12:59 0

Credit: DIGITIMES

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a...

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