CONNECT WITH US

Samsung develops glass interposer as TSMC expands packaging capacity

, DIGITIMES, Taipei
0

TSMC’s RDL interposer and CoWoS platform. Samsung is developing a potentially lower-cost glass alternative. Credit: TSMC

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging high-performance chips, with prototypes potentially ready by the end of this year, The Elec reported, citing...

The article requires paid subscription. Subscribe Now