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NEWS TAGGED PACKAGING
Thursday 7 March 2024
Backend houses gearing up for AI chip boom
The arrival of the Artificial Intelligence (AI) age has underscored the increasing importance of semiconductor packaging and testing, with makers stepping up efforts to expand advanced...
Tuesday 5 March 2024
Taiwan CIS earnings calls show light at the end of the tunnel
Earning calls from Taiwan's CIS supply chain promise an uptick in demand in 2024.
Tuesday 5 March 2024
China sees withdrawals from foreign firms in chip packaging and testing business
Amid the global geopolitical tension and an indigenization endeavor, China has seen an outflow of investments in the chip packaging and test industry when a series of Taiwan-based...
Tuesday 5 March 2024
GenAI drives HBM memory demand
Generative AI has stimulated demand for High Bandwidth Memory (HBM), driving Taiwanese memory chipmakers to seize a share of the AI business opportunity.
Tuesday 27 February 2024
Back-end houses divided on whether to build Japanese facilities like TSMC
According to industry sources in Taiwan, IC back-end houses are divided as to whether they will establish facilities in Japan similar to Taiwan Semiconductor Manufacturing Company...
Monday 26 February 2024
ASE expands overseas production with acquisition of Infineon's backend plants in Philippines and South Korea
Taiwanese OSAT leader Advanced Semiconductor Engineering (ASE) has recently announced its plan to bolster overseas production by acquiring Infineon's backend assembly and testing...
Friday 23 February 2024
Foxconn adopts the 'system foundry' business model
Hon Hai Technology (Foxconn) is transitioning to a "solutions" provider rather than an electronics and semiconductor manufacturer. The firm said it is moving toward a "system foundry"...
Thursday 22 February 2024
Intel to adopt high-NA EUV in 14A process manufacturing
At the first conference for its burgeoning foundry business, Intel restated its aim to provide five advanced process nodes in four years. The company also disclosed plans for more...
Wednesday 21 February 2024
AI to boost advanced packaging demand
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
Friday 16 February 2024
Applied Materials sees faster recovery in semiconductors, to benefit from HBM and GAA equipment
Applied Materials reported an 18% growth in its profit and expected the semiconductor industry to recover faster than the macroeconomy. The company said it will likely benefit from...
Thursday 15 February 2024
Samsung embraces hybrid bonding for advanced non-memory packaging
Samsung Electronics is actively enhancing its semiconductor foundry capabilities by embracing hybrid bonding technology. The company has recently integrated equipment from BE Semiconductor...
Wednesday 7 February 2024
Another Taiwan-based firm announces OSAT partnership with Indian company
Taiwan-based Aptos Technology, a subsidiary of Taiwan Mask, announced a collaboration with India-based Kaynes Semicon Private Limited on training and technology licensing in semiconductor...
Tuesday 6 February 2024
Japan's semiconductor renaissance (2): advanced packaging and materials
The Japanese government's efforts to attract foreign semiconductor investment have been very effective, with almost every major international semiconductor manufacturer responding...
Monday 5 February 2024
Raytheon collaborates with AMD to build next-gen multi-chip package
Raytheon, an RTX company, has received a $20 million contract from the Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S2MARTS) consortium to develop a next-generation...
Friday 2 February 2024
OSAT ASEH to boost advanced packaging capability
ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...