News tagged packaging at DIGITIMES

NEWS TAGGED PACKAGING

Friday 1 August 2025

AI talent's potential to revive Taiwan's traditional industries

As Taiwan's AI server production and shipments continue to expand, high-performance computing chips are driving strong demand in manufacturing, packaging, and testing, making Taiwan's...

Friday 1 August 2025

Horng Terng fully booked with orders amid AI chip cooling demand surge

Horng Terng Automation, a leading manufacturer of advanced semiconductor packaging equipment, has leveraged its joint development efforts with packaging clients and mastery of critical...

Friday 1 August 2025

ASE maxes out Taiwan backend capacity on AI, automotive demand

ASE Holdings posted solid growth in advanced packaging and testing in the first half of 2025, fueled by robust demand for AI-related high-performance computing (HPC) chips. However,...

Thursday 31 July 2025

China's third central automaker revs up EV-chip cluster in Chongqing

As China moves to curb domestic EV overcompetition and prioritize industrial upgrading, China Changan Automobile Group (CCAG) officially...

Thursday 31 July 2025

Samsung's Lee Jae-yong visits DC with US tariff negotiations ongoing, eyes further Texas investment

Samsung Electronics Chairman Lee Jae-yong recently made a spontaneous trip to Washington, DC, to assist South Korea in ongoing reciprocal tariff negotiations with the US. As AI semiconductors...

Wednesday 30 July 2025

From substrate to system: A deep dive into Nvidia's CoWoP packaging shift

As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...

Wednesday 30 July 2025

China unveils first optical-interconnect GPU supernode in AI infrastructure push

As demand for computing power accelerates alongside the rise of large-scale and multimodal AI models, China is ramping up efforts to expand...

Wednesday 30 July 2025

PTI overcomes awkward phase with FOPLP, expects major growth from 2026

Memory packaging and testing company Powertech Technology Inc. (PTI) has heavily invested in fan-out panel-level packaging (FOPLP) in recent years. Chairman DK Tsai stated that the...

Tuesday 29 July 2025

Phison warns of BT substrate shortages, partial supply constraints expected from August 2025

As raw materials for IC substrates face shortages, the supply of BT substrates continues to tighten. This has led to material shortages in flash and SSD packaging ICs. Phison CEO...

Tuesday 29 July 2025

Cadence expands beyond China with 3D IC momentum from TSMC ecosystem

Cadence Design Systems expressed confidence in its second-half 2025 outlook despite lingering geopolitical uncertainties. In its second-quarter 2025 earnings call, executives affirmed...

Monday 28 July 2025

TSMC issues official response regarding heavy rain floods at Chiayi AP7 plant

Due to the influence of a low-pressure system and southwest airflow, a heavy rain advisory was issued for the Yunlin, Chiayi, and Tainan regions on July 28, 2025. Chiayi County urgently...

Monday 28 July 2025

Intel to spin off Network and Edge Group as part of strategic refocus

Intel has announced plans to spin off its Network and Edge Group (NEX) as an independent company, continuing a wave of restructuring aimed at sharpening the company's focus on core...

Friday 25 July 2025

Rebellions partners with CoAsia SEMI to deliver AI chiplets to data centers worldwide

South Korean AI semiconductor startup Rebellions has inked a strategic partnership with system-on-chip (SoC) design house CoAsia SEMI...

Friday 25 July 2025

Rapidus touts threefold boost in chipmaking speed over TSMC with unified 2nm process

Rapidus is developing an innovative semiconductor production system designed to significantly speed up the manufacturing process of 2nm and sub-2nm chips by combining wafer fabrication...

Wednesday 23 July 2025

Samsung starts hybrid bonding shift with HBM4E; will it stick before HBM5?

Samsung Electronics plans to introduce hybrid bonding technology with its 16-layer HBM4E (7th-generation high-bandwidth memory), marking a pivotal shift in advanced memory packaging...

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Aug 5, 11:49

Cultivating OCP, embracing open source

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