Tesla CEO Elon Musk has revealed in a post on X that the company is close to taping out its next-generation AI5 chip while simultaneously beginning development of AI6. Tesla plans...
Micron has rejected reports claiming it is redesigning its HBM4 product due to failure to meet Nvidia's data transfer requirements. The company stated that HBM4 will be launched as...
Taiwan Semiconductor Manufacturing Co.(TSMC)'s chairman and chief executive, C.C. Wei, used one of the industry's most high-profile stages to restate the company's commitment to expanding...
Despite Nvidia's strong third quarter of fiscal 2026 performance, surpassing forecasts for 12 consecutive quarters, global market concerns over AI remain. According to supply chain...
The memory shortage is rippling through the PC supply chain, prompting vendors to scramble for DRAM allocations at upstream suppliers. Industry sources say senior Asus executives...
Qualcomm announced the winners of the 7th Qualcomm Innovate in Taiwan Challenge (QITC) on November 21. First place went to MoBagel, which provides high-efficiency, energy-saving,...
TSMC's advanced CoWoS packaging capacity has become extremely tight, resulting in only a few leading AI chipmakers having the means to book capacity in large quantities. Other ASIC...
Although South Korea has seen its semiconductor exports hit record highs, concerns are mounting that over-reliance on specific products could heighten risks for the country's manufacturing...
India has renewed its push to become a global semiconductor hub, setting an ambitious target to match the manufacturing capabilities of leading producers by 2032. Technology Minister...
Japanese ceramics firm NGK Insulators has announced plans to triple its production capacity of support wafers by fiscal year 2027 (April 2027-March 2028). More specifically, these...
Doosan Electronic Business Group (Doosan Electro-Materials) is on track to become the exclusive supplier of copper-clad laminate (CCL) for Nvidia's next-generation AI chip, Rubin,...
SK Hynix is reportedly preparing a major ramp-up of its next-generation 1c DRAM production, with plans to increase capacity eightfold in 2026 to meet rising demand for high-performance...
The 2025 Intel Technology Innovation and Industry Ecosystem Conference was held from November 19 to 21, 2025, in Chongqing, China. At the event, Intel CEO Lip-Bu Tan and newly appointed...
