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Sunday 31 May 2026
WinWay to double test capacity with NT$3.5B southern Taiwan plant
WinWay Technologies, a major test interface provider, followed ASE Holdings in holding a groundbreaking ceremony for its new plant at the Renwu Industrial Park in southern Taiwan....
Sunday 31 May 2026
Aspeed and Lattice announce partnership on programmable server management chip
Aspeed Technology and Lattice Semiconductor have formed a strategic partnership that could reshape how servers are managed in data centers worldwide. The collaboration aims to combine...
Sunday 31 May 2026
United Integrated Services sees AI capex boom extending fab order visibility to 2030
United Integrated Services, a key fab-building partner for TSMC and Micron, said the global artificial intelligence (AI) boom is continuing to drive semiconductor capital spending...
Sunday 31 May 2026
Formosa Plastics outlines semiconductor push with NT$29.2 billion investment to add NT$30 billion annual output
Formosa Plastics disclosed on May 28 that it would expand into semiconductor chemicals, green energy and healthcare, announcing plans to invest NT$292 billion (approx. US$9.2 billion)...
Sunday 31 May 2026
GIS takes AR and optical communication opportunities to pave transformation
Facing memory shortages and Sharp's plan to shut down its Guishan K2 plant by the end of 2026, GIS chairman Hsien-Ying Chou said the company faces greater operational challenges in...
Sunday 31 May 2026
Winbond accelerates custom memory transition
Winbond Chairman Arthur Chiao said market sentiment in the second half of 2026 would carry the strong momentum seen in the first half, with the overall market remaining in a supply...
Sunday 31 May 2026
Nan Ya Plastics targets three new business pillars to lift electronic materials to 60% by 2026
Nan Ya Plastics announced at its May 29 shareholders meeting that it would pivot into three new business areas — medical materials, semiconductor materials, and comprehensive...
Saturday 30 May 2026
AUO Micro LED CPO enters sampling stage
AUO's entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing...
Saturday 30 May 2026
Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
Saturday 30 May 2026
AI boom strains optical supply chain as Nvidia, Corning expand fiber output
The global AI boom is pushing supply-chain pressure beyond memory chips and CPUs into optical communications, creating shortages across a less visible but increasingly critical layer...
Saturday 30 May 2026
Innolux turns to packaging, smart cockpits in higher-margin push
Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin...
Saturday 30 May 2026
Terafab explained: SpaceX outlines space-optimized chips and AI megafab plan in IPO filing
SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty,...
Saturday 30 May 2026
'You're so rich now': Jensen Huang toasts Taiwan supply chain partners as Vera Rubin ramp begins
At the Nvidia AI Factory MGX Ecosystem Showcase in Taipei, Taiwan, on May 29, Nvidia CEO Jensen Huang said that to meet the strong demand and support the production ramp for the next-generation...
Saturday 30 May 2026
Samsung tops Micron in automotive memory as AI tightens supply

Samsung Electronics has overtaken Micron Technology to become the world's largest supplier of automotive memory chips for the first...

Saturday 30 May 2026
TSMC's test arm Xintec ramps wafer testing capacity for 2H26 growth
Xintec, TSMC's packaging and testing unit, is preparing for a broader testing-led expansion that could affect global chip supply chains. The company said capacity gains, new equipment...