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Thursday 10 September 2026
Foxsemicon hits record 2Q26 revenue on Thailand ramp-up
Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter...
Thursday 10 September 2026
AUO matching glass substrate size stokes TSMC collab speculation
AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
Thursday 10 September 2026
Apple added flat US$100 to every iPhone and rebuilt A20 Pro around memory
Two things happened at Apple's September 9 launch that belong in the same story: the company raised the price of every iPhone it sells by exactly US$100, and it introduced a chip whose...
Thursday 10 September 2026
China's Nvidia rivals raise prices as HBM shortage bites
Chinese chipmakers challenging Nvidia are sharply raising prices for current and next-generation accelerators as high-bandwidth memory (HBM) becomes scarcer and more expensive, adding...
Thursday 10 September 2026
Intelligo targets double-digit 2027 revenue growth on AI IP, ASICs
Intelligo said it is aiming for double-digit revenue growth in 2027 as AI IP licensing and AI edge-computing ASICs expand its reach into smartphones, notebooks, earbuds, gaming consoles...
Thursday 10 September 2026
TSMC August 2026 revenue jumps 53.3% as AI chip demand drives record growth

TSMC reported strong revenue growth in August, underscoring continued momentum in AI-related semiconductor demand. TSMC said consolidated...

Thursday 10 September 2026
Taiwan chipmakers target humanoid robots beyond the 'brain,' focusing on vision, motor control

Taiwanese IC design companies have recently begun highlighting opportunities in physical AI and robotics. Arm's recently announced expansion...

Thursday 10 September 2026
Spirox TGV inspection capable of scanning entire substrate in 20 minutes
As advanced packaging moves toward higher-density stacking, demand is rising for glass through-glass via (TGV) and through-silicon via (TSV) inspection, while glass core substrates...
Thursday 10 September 2026
Hermes Testing ships membrane probe cards, targets SiPh and CPO
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
Thursday 10 September 2026
Elmos locks in SK keyfoundry wafer supply through 2037 as 8-inch capacity tightens

Germany's Elmos Semiconductor has secured wafer capacity from South Korea's SK keyfoundry through 2037, expanding an 18-year manufacturing...

Thursday 10 September 2026
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
Thursday 10 September 2026
DB HiTek completes reliability qualification for 8-inch SiC MOSFET process
DB HiTek said it has completed reliability qualification for its 1,200 V silicon carbide (SiC) MOSFET process on 8-inch wafers. The development could expand foundry capacity for next-generation...
Thursday 10 September 2026
Compute-in-memory returns to the spotlight with edge AI's power, memory squeeze
AI is shifting from data centers to PCs, personal AI systems, robots, and other edge devices, renewing a core semiconductor challenge: delivering enough compute and memory bandwidth...
Thursday 10 September 2026
JD Cloud plans 100,000-GPU cluster built on Moore Threads chips
JD Cloud said on September 9 that it plans to build a 100,000-card cluster of full-function GPUs supplied by Moore Threads, a deployment the company describes as the first time domestic...
Thursday 10 September 2026
SK Hynix says 3D DRAM will borrow from logic foundry playbook
SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...