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    Hyundai Motor Group expands US research unit ahead of EREV and HEV push
    Sep 3, 18:26
    LB Semicon begins shipments to Qualcomm after two-year partnership
    Sep 3, 18:26
    Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
    Sep 3, 18:26
    Kyocera opens first new Japan plant in 21 years to tap Kyushu chip supply chain
    Sep 3, 18:26
    CPO testing shifts upstream as equipment makers vie for integration lead
    Sep 3, 18:26
    NEWS TAGGED CHIPS + COMPONENTS
    Wednesday 29 July 2026
    AI, memory clients lock in long-term orders for Leading Technology
    Leading Technology, the IC substrate arm of PCB giant Zhen Ding Technology Group, is pressing ahead with plans for a Hong Kong listing as AI and memory customers sign long-term supply...
    Wednesday 29 July 2026
    Samsung and SK Hynix hold back on 3D IC; CXMT and Winbond gain
    AI demand is driving a sharp rise in inquiries about 3D IC, but some in South Korea say the new technology is unlikely to become a fresh growth engine for Samsung Electronics and SK...
    Wednesday 29 July 2026
    Qualcomm's Snapdragon price hikes test Apple, MediaTek flagship phone demand
    Qualcomm has reportedly notified customers that it will raise prices across its Snapdragon system-on-chip portfolio from September 2026, including its next flagship mobile platform...
    Wednesday 29 July 2026
    South Korea unveils US$950 billion AI partnerships with Nvidia, Samsung, SK Group
    South Korea announced a US$950 billion package of AI cooperation initiatives in Silicon Valley on July 24, 2026, as President Lee Jae-Myung led a delegation of government and business...
    Tuesday 28 July 2026
    Nvidia says smuggling is a 'nonstarter' as Taiwan arrests its employee in GB300 server scheme
    A senior sales manager allegedly helped route GB300-equipped servers through Japan and Hong Kong over three years, in a scheme prosecutors value at up to $300 million
    Tuesday 28 July 2026
    Magnitude 7.1 quake strikes Japan's Kumamoto; TSMC says JASM staff safe, recovery underway
    A powerful earthquake struck Japan's Kyushu region at 4:27 p.m. on July 28. The Japan Meteorological Agency initially estimated the quake at magnitude 7.1 with a depth of 6.2 miles...
    Tuesday 28 July 2026
    Nvidia invests in Ilya Sutskever's SSI, providing access to Vera Rubin compute platform
    Nvidia has made a strategic investment in Safe Superintelligence Inc. and announced a long-term partnership with the secretive AI lab founded by OpenAI co-founder Ilya Sutskever, giving...
    Tuesday 28 July 2026
    Display industry earnings season shifts spotlight from panel prices to transformation strategies

    Taiwan's display supply chain enters second-quarter earnings season this week, with Coretronic reporting results on July 28, followed...

    Tuesday 28 July 2026
    Google TPU surge and Meta capacity push fuel CSP capex wave
    AI demand and whether the boom is heading into a bubble are back in focus, and capital expenditure by cloud service providers (CSPs) and their supply chains is emerging as a key gauge...
    Tuesday 28 July 2026
    CXMT's record IPO and Apple talks collide with US curbs as DRAM tightens

    AI-driven demand is tightening the global memory market just as China's leading DRAM producer, ChangXin Memory Technologies, or CXMT,...

    Tuesday 28 July 2026
    SK Hynix enters LPDDR6 production race with Xiaomi first in line
    SK Hynix reportedly plans to begin mass production and shipments of LPDDR6 in the second half of 2026, with Xiaomi expected to become its first customer for mobile devices. Industry...
    Tuesday 28 July 2026
    AI memory demand lifts WF6 prices as PERIC Special Gases adopts market-based pricing
    Surging demand for AI servers and advanced memory devices is tightening the global supply of tungsten hexafluoride (WF6), drawing increased attention to one of the semiconductor industry's...
    Tuesday 28 July 2026
    Samsung eyes Chinese DRAM sourcing to cut costs, expand budget-phone share in China
    Samsung Electronics is evaluating the use of lower-cost Chinese DRAM in some smartphones as it seeks to offset rising component costs and regain momentum in China's highly competitive...
    Tuesday 28 July 2026
    SK Hynix's HBM paradox: DDR5 surge builds leverage for HBM4 price hikes

    AI spending is broadening the memory upcycle beyond high-bandwidth memory, lifting prices for conventional DRAM, NAND flash and enterprise...

    Tuesday 28 July 2026
    Eiso raises NT$300M to accelerate AI, aerospace, defense PCB expansion

    Printed circuit board (PCB) manufacturer Eiso Enterprise has completed its annual fundraising plan. To strengthen working capital for...

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    biz
    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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