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NEWS TAGGED CHIPS + COMPONENTS
Wednesday 9 September 2026
OpenAI's deeper Samsung tie-up lands on a foundry that is running out of capacity
For Samsung Electronics' two loss-making logic businesses, OpenAI's declaration that it is jointly producing and researching next-generation chips with the Korean company matters less...
Wednesday 9 September 2026
Samsung, LG secure roles as key suppliers for Apple's foldable iPhone

Apple's expected first foldable iPhone is set to channel a significant share of its component value to South Korean suppliers, with Samsung...

Wednesday 9 September 2026
Cambricon wins PyTorch Foundation board seat in bid to strengthen China AI chip software ecosystem
Chinese AI chip developer Cambricon said on September 8 that it has formally joined the PyTorch Foundation as a platinum member, the organisation's highest membership tier, securing...
Wednesday 9 September 2026
Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

Wednesday 9 September 2026
Ample Electronic hits 120% utilization as MLCC customers step up copper paste orders
Ample Electronic Technology said strong demand for passive components and artificial intelligence (AI) server-related products is boosting business momentum, as multi-layer ceramic...
Wednesday 9 September 2026
Kioxia rules out deeper SK Hynix ties, resists further NAND price hikes

Kioxia has ruled out deeper manufacturing ties with SK Hynix while resisting another round of aggressive NAND price increases, leaning...

Wednesday 9 September 2026
Update: US finalizes US$775 million in CHIPS quantum awards, with equity attached
Washington has converted the largest federal bet yet on quantum computing from a promise into a contract, and it is taking ownership in return. On Sept. 8, the US Department of Commerce...
Wednesday 9 September 2026
Amkor expands Arizona chip campus with phase 2 plan
Amkor Technology's latest Arizona expansion underscores how advanced packaging capacity is becoming a strategic issue for the US semiconductor supply chain. The larger campus aims...
Wednesday 9 September 2026
China's up to 99.2% anti-dumping duty on Japan DCS boosts local chip material suppliers
China has imposed provisional anti-dumping measures on Japanese dichlorosilane (DCS), a semiconductor material used in thin-film deposition, potentially accelerating Chinese wafer...
Wednesday 9 September 2026
CXMT's 10% DRAM share intensifies debate over South Korea's 52-hour workweek

China's rapid advance in DRAM is intensifying debate in South Korea over whether rigid working-hour rules could make it harder to preserve...

Wednesday 9 September 2026
Asia Vital revenue hits record as US CSP ASIC server demand climbs
Asia Vital said August 2026 revenue rose to NT$512 million, up 29.10% year over year, as shipments of ASIC servers to a US cloud service provider customer continued to increase. The...
Wednesday 9 September 2026
Axcelis to build new Korea manufacturing site in US$35 million expansion
Axcelis Technologies plans to invest US$35 million in a new semiconductor equipment manufacturing facility in Pyeongtaek, South Korea, a move that could help strengthen global chip...
Wednesday 9 September 2026
China's AI meets photonics: CIOE, IICIE, and elexcon open together in Shenzhen
The 27th China International Optoelectronic Exposition (CIOE) opened at the Shenzhen World Exhibition & Convention Center, taking place alongside the International Integrated Circuit...
Wednesday 9 September 2026
Huawei orchestrates China's DUV lithography push to cut reliance on ASML
Huawei is emerging as a central organiser of China's effort to build a domestic semiconductor equipment supply chain, backing critical lithography suppliers and helping connect them...
Wednesday 9 September 2026
Commentary: Huawei's Kirin comeback, Xiaomi's Xring entry widen China's chipmaking race
In September 2020, Huawei's smartphone business suffered a severe blow.