When Nvidia CEO Jensen Huang stepped off a plane in Taipei on Saturday, May 23, he had already begun documenting the trip on X — night markets, fried food, and family. By the...
The building where Saeed Amidi runs his global venture empire was once one of the most important semiconductor facilities on the West Coast. Philips Electronics operated a fabrication...
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...
Airoha Technology is sharpening its strategy around global networking and edge AI chips, aiming to expand its customer base and strengthen its competitive moat. The MediaTek subsidiary...
Foxconn chairman Young Liu said the company is preparing to break ground on its advanced packaging plant in France while continuing to explore sovereign-AI opportunities in Africa,...
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge...
MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below...
Genius Electronic Optical (GSEO) held its shareholders meeting on May 29, with chairman Jones Chen and president Ying-Li Guo in attendance. GSEO reported standalone revenue of NT$20.89...
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that...
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At...
Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect...
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging...
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development...
The European Commission wants governments to buy chips from EU startups as Brussels seeks to reduce the bloc's reliance on US and East Asian suppliers, Reuters reported, citing...
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI...
