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Friday 11 September 2026
AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and...
Friday 11 September 2026
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Friday 11 September 2026
China's DRAM supply chain clears another materials hurdle
China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...
Friday 11 September 2026
CIOE 2026: Hitachi relies on partnerships, not proprietary tech, to ride China's optical boom

At an optoelectronics trade expo in China, Hitachi High-Tech used its booth not to unveil a flagship product of its own, but to showcase...

Friday 11 September 2026
Samsung's Exynos gains ground as Galaxy S26 lifts share to 9%

Samsung Electronics is regaining ground in the global smartphone processor market, with its Exynos share rising to 9% in the second...

Friday 11 September 2026
Taiwan govt boosts EDA R&D to target global gaps
Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...
Friday 11 September 2026
AI packaging turns to glass, with TGV metallisation persisting as key technical hurdle
Taiwan supply-chain sources said low-CTE glass fibre cloth used in high-end substrates remains tight, while glass-core substrates for next-generation packaging are still in technical...
Friday 11 September 2026
Micron pays Taiwan fab workers up to 68 months' salary in memory upturn
Micron has announced its FY26 pay package for more than 60,000 employees worldwide, the largest in the company's history. For the first time, every employee will receive merit-based...
Friday 11 September 2026
Apple's new chip packaging boosts A20 Pro AI power, pushing MediaTek, Qualcomm to follow suit
Apple has unveiled its latest iPhone 18 Pro and the A20 Pro, its first 2nm chip. According to Apple's official specifications, the A20 Pro features a six-core CPU, seven-core GPU,...
Friday 11 September 2026
Altera eyes $2B IPO, from Intel carve-out to public debut
Chipmaker Altera is laying the groundwork for an initial public offering (IPO) that could raise over US$2 billion as early as late 2026. According to sources familiar with the matter...
Friday 11 September 2026
SK Hynix raises cash portion of bonuses after 25-vote union rejection

SK Hynix has increased the cash portion of its profit-sharing bonus in a revised tentative wage agreement, after production workers...

Friday 11 September 2026
Taiwan tech minister in Europe to advance semiconductor cooperation

National Science and Technology Council (NSTC) Minister Cheng-Wen Wu visited the UK and Belgium in early September to advance Taiwan-Europe...

Friday 11 September 2026
ASPEED plans December BMC price hikes to fuel server security footprint

As demand for AI servers intensifies and supply chain bottlenecks continue to ease, shipment momentum for baseboard management controller...

Friday 11 September 2026
Jensen Huang bets Nvidia's next leg of growth on turning AI compute into an investable asset

Jensen Huang used a Goldman Sachs conference appearance to argue that the constraints on AI's build-out are expanding from silicon into...

Friday 11 September 2026
AI server tracker: Taiwan's August filings say demand is still accelerating
The clearest read yet on whether the AI build-out is still accelerating arrived this week in a batch of unaudited Taipei filings, and it accelerated. The 49 Taiwan-listed companies...