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    NEWS TAGGED CHIPS + COMPONENTS
    Monday 13 July 2026
    Huawei reportedly backs 12-inch DRAM fab to reduce memory dependence

    Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build...

    Monday 13 July 2026
    Applied Materials India eyes larger role in global chip equipment development
    Applied Materials India is preparing to take on broader ownership of selected semiconductor equipment product initiatives, as the US-based chipmaking equipment supplier expands its...
    Monday 13 July 2026
    US chip factory buildout faces possible delays as labor shortage nears 157,000 by 2030

    A shortage of skilled workers could slow construction of new US semiconductor plants, raise costs, and limit chip output for global...

    Monday 13 July 2026
    CPO mass production accelerates new four-stage test equipment market
    AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
    Monday 13 July 2026
    Nanya lifts long-term capacity to 50%, eyes 4x capex in 2027
    Memory chipmaker Nanya said its second-quarter 2026 operations hit a record high, with President Pei-Ing Lee saying signed long- and short-term agreements now account for 50% of total...
    Monday 13 July 2026
    Infineon urges TSMC to consider a second Dresden fab as demand outlook evolves

    A push by Infineon for TSMC to expand further in Dresden could reshape Europe's role in advanced chipmaking and ripple through the...

    Monday 13 July 2026
    Apple reportedly accelerates AI chip roadmap as next-gen Macs prioritize neural processing

    Apple is reshaping its Mac chip roadmap to prioritize AI, accelerating development of future processors as the company seeks to strengthen...

    Monday 13 July 2026
    Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

    AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

    Monday 13 July 2026
    India opens first CMP pad technology hub in Hyderabad
    India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local...
    Monday 13 July 2026
    MediaTek revenue beat lifts second-quarter outlook as seasonal demand builds
    MediaTek reported June 2026 revenue of NT$58.012 billion (US$1.81 billion), up 22.30% month over month and 2.80% year over year, and said second-quarter revenue reached NT$152.183...
    Monday 13 July 2026
    KYEC approves US$1.4 billion US plant to expand chip testing capacity
    King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing...
    Monday 13 July 2026
    India roundup: India's chip strategy tests its ability to build a competitive ecosystem

    India is moving from semiconductor planning to execution, using funding, tariff changes, foreign...

    Monday 13 July 2026
    Sitronix sees zero-capacitance TDDI and automotive DDI drive growth
    Sitronix Technology said this week that zero-capacitance touch with display driver integration (TDDI) and automotive display drive IC (DDI) will drive its growth in 2026, as the chipmaker...
    Monday 13 July 2026
    SK Hynix hybrid bonding push signals next phase of HBM packaging race
    SK Hynix is moving early to prepare hybrid bonding technology for next-generation high-bandwidth memory (HBM), as competition in AI memory shifts from stacking capacity toward packaging...
    Monday 13 July 2026
    Arm CEO: AI agents to drive CPU demand as infrastructure shifts beyond GPUs
    GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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