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    NEWS TAGGED CHIPS + COMPONENTS
    Saturday 3 January 2026
    Analysis: Chip boom squeezes device makers as surging component costs threaten margins
    The global semiconductor market is projected to reach US$1 trillion as early as 2026, significantly ahead of previous industry forecasts targeting 2030. The World Semiconductor Trade...
    Friday 2 January 2026
    Memory shortages to persist through 2026 as AI server demand surges

    Global memory markets are expected to remain tight through 2026 as aggressive spending by cloud service providers (CSPs) on AI infrastructure...

    Friday 2 January 2026
    Asus to pause new smartphone launches in 2026, maintain mobile operations
    Smartphone distributors in Taiwan have recently said they are no longer able to obtain Asus handsets through local agents and claimed they had received information indicating that...
    Friday 2 January 2026
    IC substrates and networking PCBs grow; materials and equipment face shortages
    The PCB industry is making large upgrades. The largest beneficiaries of the AI boom are IC substrate makers that are part of the advanced chip packaging supply chain, such as Unimicron...
    Friday 2 January 2026
    Baidu's AI chip unit Kunlunxin confidentially files for Hong Kong IPO
    Baidu is moving forward with plans to spin off its AI chip unit, Kunlunxin, and list it in Hong Kong, highlighting the company's push for semiconductor self-sufficiency. On January...
    Friday 2 January 2026
    CXMT logs first annual profit on DRAM price rebound

    ChangXin Memory Technologies (CXMT) returned to profitability in 2025, recording its first full year of net income after a rebound in global...

    Friday 2 January 2026
    Samsung gains edge in AI memory race after reportedly leading Broadcom system-level tests
    Samsung Electronics' sixth-generation high-bandwidth memory, HBM4, has reportedly posted the fastest operating speeds in a key technology test run by Broadcom. The results strengthen...
    Friday 2 January 2026
    Vietnam urges Intel to boost semiconductor backend capacity
    The Vietnamese government is urging Intel to further grow its semiconductor packaging and testing capabilities in the country, seeking to strengthen the nation's role in the global...
    Friday 2 January 2026
    US approval of TSMC equipment exports to China reflects strategy shift
    Following reports that the US government had granted annual export licenses to South Korea's Samsung Electronics and SK Hynix, the US Department of Commerce (DOC) has also approved...
    Friday 2 January 2026
    China's CXMT moves toward IPO with global DRAM share nearing 4%
    China's leading DRAM producer, ChangXin Memory Technologies (CXMT), has entered the initial public offering phase as it targets a rapid increase in global market share, aiming to surpass...
    Friday 2 January 2026
    Samsung reportedly seals land deal, paving way for Yongin semiconductor complex
    Samsung Electronics has taken a key step toward building a massive semiconductor manufacturing complex in Yongin after finalizing a land purchase for a national industrial park, moving...
    Friday 2 January 2026
    Samsung rolls out 7,200Mbps DDR5 samples as SK Hynix, CXMT intensify competition
    Samsung Electronics has reportedly begun sampling next-generation DDR5 memory, delivering speeds that are approximately 30% faster than current mass-produced offerings. Industry observers...
    Friday 2 January 2026
    Samsung aims for 2026 HBM4 mass production after customer validation
    Samsung Electronics plans to begin mass production of its sixth-generation high-bandwidth memory chips in 2026, citing positive feedback from customers as the South Korean tech giant...
    Friday 2 January 2026
    Smartphones and notebook prices could increase as memory lead times extend
    Demand for high-bandwidth memory (HBM) is crowding out production capacity for consumer memory. Despite capacity expansions by major memory makers, including Micron, Samsung, and SK...
    Friday 2 January 2026
    SanDisk, Micron vie for PSMC's Tongluo fab capacity
    Market rumors and formal statements indicate two major memory companies, SanDisk and Micron, have approached PSMC about capacity cooperation at PSMC's new 12-inch fab in Tongluo, Taiwan...
    54/348 pages
    biz
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    Special Report
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook