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NEWS TAGGED CHIPS + COMPONENTS
Thursday 30 October 2025
Glass substrates edge toward prime time in PCB and chip packaging sector

As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of...

Thursday 30 October 2025
Pegatron eyes 1Q26 production launch for Texas plant with Nvidia GB300 servers
Pegatron has revealed progress on its US manufacturing expansion, announcing that its Texas factory is set to begin mass production in March 2026. The facility will produce Nvidia's...
Wednesday 29 October 2025
Skyworks–Qorvo tie-up signals new phase of US semiconductor consolidation
Skyworks Solutions and Qorvo have agreed to merge in a cash-and-stock transaction valued at about US$22 billion, forming a US-based leader in high-performance radio frequency (RF),...
Wednesday 29 October 2025
South Korean tycoons meet Nvidia CEO as part of APEC corporate diplomacy
Leading South Korean conglomerate heads are set to engage in intensive "corporate diplomacy" during the 2025 Asia-Pacific Economic Cooperation (APEC) summit, meeting with global leaders...
Wednesday 29 October 2025
WPG launches smart warehousing to strengthen semiconductor supply chain services
In response to the surge in AI- and HPC-driven market demand, WPG Holdings' board of directors has approved an adjustment to its investment structure to further advance its semiconductor...
Wednesday 29 October 2025
SK Hynix unveils new NAND line featuring HBF for AI
SK Hynix has launched a new NAND flash product family called "AIN Family," targeting the artificial intelligence (AI) market with a focus on overcoming storage bottlenecks in AI inference...
Wednesday 29 October 2025
Unified packaging standards seen as key to meeting AI and automotive demands
Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...
Wednesday 29 October 2025
Apple and Tesla orders fuel Samsung's recovery
Apple's mobile DRAM orders are expected to increase significantly in 2026, and the South Korean industry predicts that Samsung Electronics will be the largest beneficiary. News...
Wednesday 29 October 2025
Intel shifts assembly and testing to Vietnam, plans tech talent recruitment
Intel is planning to relocate part of its assembly, packaging, and testing capacity to Vietnam as part of a global strategic adjustment aimed at optimizing its manufacturing layout...
Wednesday 29 October 2025
Commentary: Lessons from Arm China and Nexperia’s unraveling

Over the past decade, China's tech sector has surged across chip design, foundry, and packaging. Yet beneath the slogan of "technological...

Wednesday 29 October 2025
A-SSCC to take place in South Korea, with 6 papers from Taiwan accepted
The IEEE Asian Solid-State Circuits Conference (A-SSCC), a major annual event in the semiconductor field, recently announced its paper selection results, with six papers from Taiwan...
Wednesday 29 October 2025
Powertech secures full FOPLP bookings ahead of US$1B expansion
Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
Wednesday 29 October 2025
Samsung secures Tesla AI5 chip order as 3nm yield gains boost profit outlook
Samsung Electronics has secured the foundry order for Tesla's AI5 chip, following its earlier win of the next-generation AI6 chip contract. Some industry observers believe this reflects...
Wednesday 29 October 2025
Hanmi eyes AI chip packaging amid HBM market challenges
Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system semiconductor equipment sector, driven by growing demand and technological...
Wednesday 29 October 2025
Commentary: With new AI chips, Qualcomm joins race to challenge Nvidia in the cloud

Qualcomm on Tuesday unveiled its latest AI accelerator cards, the AI200 and AI250, along with corresponding rack-level system designs,...