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NEWS TAGGED CHIPS + COMPONENTS
Tuesday 16 June 2026
AT&S to invest up to EUR2 billion in Malaysia to expand AI substrate capacity
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as...
Tuesday 16 June 2026
AI chip race sends WF6 prices soaring after Japan supply shock
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used...
Tuesday 16 June 2026
SK Hynix reportedly readies HBM4E samples for Nvidia as Samsung pulls ahead
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market....
Tuesday 16 June 2026
Apple leans on Google Cloud and Nvidia GPUs in a pragmatic AI reset
After Apple's WWDC 2026 keynote, online rumors claimed that only premium devices with 12GB of memory could run on-device AI, but DIGITIMES analyst Luke Lin said on a podcast that that...
Tuesday 16 June 2026
Rapidus signs UK chip pact in push for 2nm customers

Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

Monday 15 June 2026
Samsung foundry chief sees 2028 profit path as bonus costs mount

Samsung Electronics' foundry division chief told employees on June 12 that a return to profitability in the contract chipmaking business...

Monday 15 June 2026
Micron CEO turns visa rejection into US$1 trillion milestone
Nvidia CEO Jensen Huang's recent trip to South Korea put the spotlight on the rivalry between Samsung Electronics and SK Hynix, while memory giant Micron crossed the US$1 trillion...
Monday 15 June 2026
NPAQ pivots to AI infrastructure and satellite NTN amid memory market slump

INPAQ Technology, a unit of PSA Walsin Technology, reported that revenue and profit in the first quarter of 2026 fell year on year,...

Monday 15 June 2026
CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

Monday 15 June 2026
Walsin sees passive component crunch stretching into 2028 as memory shortages weigh

Walsin Technology expects the tight supply of passive components could last into 2028, as demand from AI infrastructure, automotive...

Monday 15 June 2026
Galatek opens Penang hub to meet surging semiconductor equipment demand

Galatek Technologies has opened a manufacturing, assembly, and delivery center in Penang, marking the AI-enabled automation and semiconductor...

Monday 15 June 2026
South Korea's chip equipment players ride the HBM4 wave

South Korea's semiconductor equipment supply chain saw a material pickup in orders in the first half of 2026 as Samsung Electronics...

Monday 15 June 2026
Taiwan's IC design sector posts sharpest gains in years; May data hints at further acceleration into 2H26
Taiwan's fabless semiconductor design sector posted its strongest year-over-year growth figures in years as of May 2026, with a cluster of memory-adjacent and storage chip makers leading...
Monday 15 June 2026
Southeast Asia shifts from test-and-pack to multi-center advanced packaging hub

As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient,...

Monday 15 June 2026
Wus Printed Circuit sees turnaround on high-end PCB demand

Wus Printed Circuit is pressing ahead with an AI-driven transformation, with its chairman and president outlining plans to move toward...