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    Hyundai Motor Group expands US research unit ahead of EREV and HEV push
    2h 27min ago
    LB Semicon begins shipments to Qualcomm after two-year partnership
    2h 27min ago
    Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
    2h 27min ago
    Kyocera opens first new Japan plant in 21 years to tap Kyushu chip supply chain
    2h 27min ago
    CPO testing shifts upstream as equipment makers vie for integration lead
    2h 28min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Friday 21 August 2026
    Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM
    Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation...
    Friday 21 August 2026
    SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
    SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized...
    Friday 21 August 2026
    Lee Jae-myung meets SK chief Chey Tae-won with US chip investment pressure in focus
    South Korean President Lee Jae-myung has begun a fresh round of talks with the country's leading business figures, starting with a private dinner with SK Group chairman Chey Tae-won,...
    Friday 21 August 2026
    Research Insight: Upstream memory giants eye threefold 2026 revenue as 2027 capacity eases price surge
    The global memory market is entering a sharp upcycle as cloud providers boost capital spending and demand for AI infrastructure lifts DRAM, NAND, and HBM prices. According to DIGITIMES,...
    Friday 21 August 2026
    CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
    Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...
    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    Friday 21 August 2026
    JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

    JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

    Friday 21 August 2026
    SK Hynix weighs Japan memory fab in Miyagi, but says no investment is final
    SK hynix is considering a large-scale memory semiconductor investment in Japan, with Miyagi Prefecture emerging as a potential site, although the company has stressed that no decision...
    Friday 21 August 2026
    AI paid user conversion rate in US only 3% as rising token costs fuel edge AI server demand
    At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES, industry experts highlighted that the massive volume of tokens consumed by AI services has become a growing...
    Friday 21 August 2026
    Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
    As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...
    Friday 21 August 2026
    FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

    Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

    Friday 21 August 2026
    Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
    The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
    Friday 21 August 2026
    SK hynix outlines CPO roadmap as AI computing shifts from chips to systems
    SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...
    Friday 21 August 2026
    Micron launches long-horizon research hub to push memory and AI development
    Micron's new US research hub could influence how future AI systems are built, stored, and scaled, with implications that extend well beyond America. The planned US$10 billion effort...
    Friday 21 August 2026
    Charts: TSMC's share of Taiwan chip manufacturing revenue falls to 81.8% as memory makers scale up
    Foundry leader Taiwan Semiconductor Manufacturing Company (TSMC) grew 37% year to date — and still lost four percentage points of the sub-sector's revenue share, because the...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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