Flexium Interconnect held its 2026 annual shareholders meeting on May 28 and outlined a strategic shift toward technology upgrades, higher-value products and improved operational efficiency...
A defense industry forum in Taiwan signaled growing interest among US military tech companies in Taiwan's supply chain, particularly as a new era of warfare defined by AI and unmanned...
AI data centers are driving increased demand for faster transmission worldwide, prompting compound semiconductor foundries to shift toward optical communications. Advanced Wireless...
AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...
Niching Industrial Corp. said on May 28 that it will acquire an 82% stake in Ming Chun Yuan Precision Technology for NT$508 million, with the transaction expected to close on July...
WinWay Technologies, a major test interface provider, followed ASE Holdings in holding a groundbreaking ceremony for its new plant at the Renwu Industrial Park in southern Taiwan....
Aspeed Technology and Lattice Semiconductor have formed a strategic partnership that could reshape how servers are managed in data centers worldwide. The collaboration aims to combine...
United Integrated Services, a key fab-building partner for TSMC and Micron, said the global artificial intelligence (AI) boom is continuing to drive semiconductor capital spending...
Formosa Plastics disclosed on May 28 that it would expand into semiconductor chemicals, green energy and healthcare, announcing plans to invest NT$292 billion (approx. US$9.2 billion)...
Facing memory shortages and Sharp's plan to shut down its Guishan K2 plant by the end of 2026, GIS chairman Hsien-Ying Chou said the company faces greater operational challenges in...
Winbond Chairman Arthur Chiao said market sentiment in the second half of 2026 would carry the strong momentum seen in the first half, with the overall market remaining in a supply...
Nan Ya Plastics announced at its May 29 shareholders meeting that it would pivot into three new business areas — medical materials, semiconductor materials, and comprehensive...
AUO's entry into Micro LED co-packaged optics sampling could give the display maker a new growth path as it seeks to expand beyond panels. Chairman Paul Peng said the company is preparing...
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
