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    ASML and Applied Materials enter advanced packaging, challenging South Korea's HBM edge
    Jan 22, 18:32
    Samsung aims to boost foundry utilization rate to over 60% in first half of 2026
    Jan 22, 18:32
    Samsung's Taylor fab reportedly orders South-Korean-made EUV pellicle equipment
    Jan 22, 18:31
    Taiwanese firms remain cautious amid AI bubble debate
    Jan 22, 18:31
    Europe's fuel engine phase-out challening with strict carbon regulations and talent lost to China
    Jan 22, 18:31
    BOE production issues with iPhone OLED give Samsung Display chance to take over
    Jan 22, 18:30
    Tesla's BEV moat faces challenges from Europe's depth and China's speed
    Jan 22, 18:30
    TSMC and Samsung reduce 8-inch wafer capacity, but oversupply still remains
    Jan 22, 18:30
    NEWS TAGGED CHIPS + COMPONENTS
    Tuesday 6 January 2026
    CES 2026: SK Hynix showcases next-gen AI memory solutions
    SK Hynix Inc. said it will showcase its next-generation AI memory solutions at CES 2026, where it plans to operate a customer exhibition booth at the Venetian Expo in Las Vegas from...
    Tuesday 6 January 2026
    CES 2026: Intel's 18A Panther Lake narrows the gap between iGPUs and discrete graphics
    At CES 2026, Intel unveiled its first mobile processor built on the 18A advanced process node, the Core Ultra Series 3, code-named Panther Lake. The launch marks Intel's first large-scale...
    Tuesday 6 January 2026
    Samsung, SK Hynix reportedly reject long-term DRAM contracts and raise prices by up to 70%

    Reports in Korean business media say Samsung Electronics and SK Hynix are raising quoted prices for server DRAM by 60% to 70% for the...

    Tuesday 6 January 2026
    CES 2026: Qualcomm unveils Dragonwing IQ10 robotics processor and general-purpose physical AI stack
    Qualcomm Technologies introduced a next-generation robotics architecture at CES 2026, featuring the Dragonwing™ IQ10 Series processor for advanced industrial autonomous mobile...
    Tuesday 6 January 2026
    TSMC reportedly set to build 12 Arizona fabs as Japan, Germany expansions stall
    Recent market reports highlight ongoing challenges for TSMC's wafer fabs in Arizona, including high costs and low profits. Industry sources cite supply chain issues, talent shortages,...
    Tuesday 6 January 2026
    CES 2026: Nvidia unveils 'Vera Rubin' architecture with 10x cost efficiency, lays out roadmap to Kyber
    Nvidia CEO Jensen Huang officially introduced the "Vera Rubin" platform at CES 2026 on January 6, 2026. The launch marks a pivotal shift in the company's hardware innovation cycle...
    Tuesday 6 January 2026
    Samsung to restart construction of Pyeongtaek P5 chip plant

    Samsung Electronics will resume structural construction at its Pyeongtaek P5 semiconductor plant next month. The company halted the project last...

    Tuesday 6 January 2026
    CHPT 2025 revenue jumps more than 30% year-over-year to hit record high
    Chunghwa Precision Test Tech (CHPT) said that although revenue in December 2025 and the fourth quarter both declined compared with the same period in 2024, overall full-year performance...
    Tuesday 6 January 2026
    DCC Technology rebrands as Nexora, subsidiary targets military and aerospace
    Field-programmable gate array (FPGA) designer DCC Technology recently held a shareholders' meeting and approved a company name change. After completing administrative procedures, the...
    Tuesday 6 January 2026
    Nvidia showcases end-to-end AI stack from deskside supercomputers to autonomous driving
    At CES 2026, Nvidia unveiled a suite of AI innovations spanning data center, enterprise, robotics, and autonomous vehicles. Highlights include the Rubin six-chip AI platform, DGX Spark...
    Tuesday 6 January 2026
    CES 2026: Qualcomm unveils Snapdragon X2 Plus platform to power next-generation Copilot+ PCs

    Qualcomm unveiled the Snapdragon X2 Plus platform at CES 2026, expanding its Snapdragon X Series lineup for Windows 11 Copilot+ PCs. The...

    Tuesday 6 January 2026
    Nvidia at CES: Alpamayo, Rubin, and the rise of reasoning AI
    On January 5, Nvidia CEO Jensen Huang opened the company's CES keynote in Las Vegas by welcoming the live and global audience, wishing attendees a Happy New Year, and setting expectations...
    Tuesday 6 January 2026
    China accelerates semiconductor self-sufficiency through foundry M&A: updates on Hua Hong, SMIC
    China's semiconductor sector is entering a new phase of domestic consolidation, as leading foundries Hua Hong Semiconductor and SMIC move to tighten control over key manufacturing...
    Tuesday 6 January 2026
    Taiwan leverages AI export surge to boost tourism, domestic demand
    At the start of 2026, Taiwan's electronic components and AI server industries continue to post strong export momentum, driven by surging demand for artificial intelligence (AI), high-performance...
    Tuesday 6 January 2026
    China Mobile, CNBM anchor Huaxin Micro-Nano's 8-inch MEMS expansion
    China's drive to localize high-value sensor manufacturing gained momentum this week, as China Mobile and China National Building Material (CNBM) Group became core shareholders of Anhui...
    21/338 pages
    biz
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook