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NEWS TAGGED CHIPS + COMPONENTS
Tuesday 6 October 2026
Apple, Qualcomm renew patent deal, iPhone modem shift deepens
Qualcomm announced on September 24 that it has renewed its global patent licensing agreement with Apple, with the new contract set to take effect on April 1, 2027. The terms and value...
Tuesday 6 October 2026
Nittobo expands glass cloth output as AI chip demand strains global supply
Nittobo is expanding production of its T-Glass glass cloth as demand from AI chip makers tightens a critical part of the global semiconductor supply chain. The move matters beyond...
Tuesday 6 October 2026
Skyworks closes Qorvo deal, forming US RF and analog powerhouse
Skyworks Solutions (Nasdaq: SWKS) has completed its combination with Qorvo, creating a US-based supplier of high-performance radio frequency (RF), power management, and analog and...
Tuesday 6 October 2026
Huawei's Kirin 9050 Pro reveals new logic folding chip design
Huawei's Kirin 9050 Pro has been fully broken down by Chinese and overseas researchers, giving the market a closer look at the company's "LogicFolding" approach. Analysis from Geekerwan...
Tuesday 6 October 2026
3.2T optical upgrade triggers PCB redesign, shrinking supplier pool to 3
As AI computing clusters continue to expand, performance requirements for scale-out interconnects between racks are rising rapidly. This is pushing traditional pluggable optical transceivers...
Tuesday 6 October 2026
Samsung steps up HBM cooling as TSMC expands CoWoS
Samsung Electronics is expanding its thermal-management efforts for high-bandwidth memory (HBM) beyond the memory stack as increasingly large chip packages raise heat-management ch...
Tuesday 6 October 2026
Solidigm expands Taiwan SSD production base to tap AI server supply chain
Solidigm, SK Hynix's NAND subsidiary, is expanding its Taiwan production base for data center solid-state drives (SSDs), underscoring the island's growing role in the global AI server...
Tuesday 6 October 2026
Jedec unveils new standard for silicon photonics reliability qualification and testing
Jedec released a new standard for silicon photonics (SiPh) testing and manufacturing controls to promote consistent reliability practices. The standard comes as SiPh experiences rapid...
Tuesday 6 October 2026
Qualcomm takes Arm to trial again, with billions in royalties at stake
Qualcomm and Arm opened a five-day trial in US federal court in Delaware on October 5, with Qualcomm seeking to stop paying Arm royalties for up to five years, a remedy potentially...
Tuesday 6 October 2026
Qualcomm says Huawei patent deal not tied to LogicFolding, rejects net-payer claims
Correction, Oct. 6, 2026: An earlier version of this story, citing Bloomberg, reported that Qualcomm had agreed to license patents related to Huawei's LogicFolding...
Tuesday 6 October 2026
TSMC expansion pushes Da Yi Cheng Technology's orders over NT$10 billion, visibility through 2028
Da Yi Cheng Technology (DYC) has rapidly expanded in recent years, benefiting from the global semiconductor capacity expansion wave, which has driven demand for second-phase electrical...
Tuesday 6 October 2026
HBM4 prices to nearly triple in 2027, memory makers see windfall margins spread
Memory supply and demand will tighten further in 2027. According to supply chain sources, South Korean memory makers have recently quoted aggressive long-term contract prices for sixth-generation...
Tuesday 6 October 2026
MIPS deepens RISC-V ties with China despite US-China tech tensions
Despite intense technology competition between the US and China, cooperation between the two sides on the open-standard RISC-V architecture continues to deepen, with US intellectual...
Tuesday 6 October 2026
Nanya Technology, Winbond Electronics hit record highs for 10 consecutive months in September 2026
Taiwan memory suppliers Nanya Technology and Winbond Electronics have set new monthly revenue records for 11 and 10 consecutive months, respectively, as their September 2026 consolidated...
Tuesday 6 October 2026
LB Semicon expands power chip capacity as Qualcomm production ramps up
South Korean outsourced semiconductor assembly and test (OSAT) provider LB Semicon is expanding power semiconductor backend capacity at its Gumi plant as it steps up efforts to reduce...