CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Friday 12 June 2026
Google weighs Samsung's role in next AI chip as TSMC capacity tightens
Google is considering using Samsung Electronics to manufacture part of a future artificial intelligence (AI) chip, a move that would mark a notable shift in the US tech group's supply...
Friday 12 June 2026
PCIM 2026: Accepting local component deficits for system-level benefits

In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth),...

Friday 12 June 2026
Sigurd revenue hits record as AI and chip demand lift operations

Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related...

Friday 12 June 2026
TSMC hit by US patent suit, Taiwan ministry pledges support
TSMC has been drawn into a patent infringement complaint in the US by Ireland-based patent licensing firms Longitude Licensing and Marlin Semiconductor. The companies have claimed...
Friday 12 June 2026
Hanmi Semiconductor to invest in SpaceX as Terafab bets grow
Hanmi Semiconductor plans to invest KRW50 billion (US$32.81 million) in SpaceX, highlighting how space, satellites, and artificial intelligence infrastructure are increasingly linked...
Friday 12 June 2026
MediaTek May 2026 revenue rises nearly 5% ahead of ASIC ramp

MediaTek reported May 2026 revenue of NT$47.43 billion (approx. US$1.5 billion), up 1.49% from the previous month and 4.99% from a...

Friday 12 June 2026
Cadence deepens Intel Foundry partnership on next-generation chip design
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The...
Friday 12 June 2026
Malaysia, Japan expand rare earth and energy cooperation

Malaysian Prime Minister Anwar Ibrahim concluded a three-day visit to Japan, during which he met with Japanese Prime Minister Sanae...

Friday 12 June 2026
HPSP reportedly receives test equipment order for Musk's Terafab

Elon Musk's planned Terafab chipmaking project has taken an early equipment-sourcing step, with South Korean equipment maker HPSP reportedly...

Friday 12 June 2026
SK Hynix readies 375-layer NAND as US listing plan advances

SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead...

Friday 12 June 2026
SuperAI 2026: From turbine backlogs to copper limits, AMD maps infrastructure walls closing in on AI
The artificial intelligence (AI) industry is expanding at a pace that the physical world cannot match, and the gap between digital demand and real-world supply is widening across every...
Friday 12 June 2026
Chinese chip foundry United Nova bets US$3B on AI power, optical interconnects
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch...
Friday 12 June 2026
Powerlogic says AI server demand and rising memory costs hit May 2026 revenue
Powerlogic reported that a surge in demand for AI servers, a reallocation of supply-chain resources, higher memory prices, and delayed consumer upgrade cycles reduced short-term sales,...
Friday 12 June 2026
Official think tank lays out 2035 roadmap to reduce India's reliance on imported chips
India's official think tank NITI Aayog has outlined a 2035 roadmap for India to become a more central part of the global semiconductor industry, warning that continued reliance on...
Friday 12 June 2026
PCIM 2026: Overcoming thermal warping in direct-cooled EV power modules
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing...