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Monday 22 December 2025
Memory supercycle exposes T-Glass constraint, tightening BT substrate supply
As the global memory industry enters a supercycle driven by structural supply shortages, BT substrates for memory chips are also tightening. Taiwan-based IC substrate makers Kinsus...
Monday 22 December 2025
AP Memory sets 2026 mass production timeline for S-SiCap discrete silicon capacitors

AP Memory is expanding into AI servers and high-performance computing, with its S-SiCap roadmap delivering concrete progress. Fourth-generation...

Monday 22 December 2025
China’s AMEC broadens chip equipment reach with Sizone acquisition

AMEC, China's leading semiconductor equipment vendor, has sent its clearest signal yet that it no longer intends to remain a single-discipline...

Monday 22 December 2025
Apaq Technology sees strong growth in solid capacitors driven by AI demand
Apaq Technology reported a sharp rise in demand for solid capacitors, fueled primarily by AI servers and AI PCs, during an investor briefing on December 17. General Manager ST Lin...
Monday 22 December 2025
South Korea examines challenges in building a strong AI semiconductor industry
The National Academy of Engineering of Korea (NAEK) recently convened a seminar, gathering industry and academic experts to assess South Korea's position in the AI semiconductor sector...
Monday 22 December 2025
Column: 2D materials struggle to deliver on semiconductor scaling promise
The isolation of graphene in 2004 sparked widespread expectations that two-dimensional (2D) materials could fundamentally reshape electronic devices. Graphene and transition metal...
Monday 22 December 2025
Rafael Micro pivots to optical links and ASICs for 2026 growth

Rafael Microelectronics is positioning optical communications and custom ASIC services as the twin pillars of its growth strategy heading into 2026,...

Monday 22 December 2025
AI servers now compete as much on heat management as on computing power

As AI workloads reshape data center design, performance is no longer defined solely by computing power. Thermal management has emerged...

Sunday 21 December 2025
Notebook shipments expected to defy slow season in 1H26

Rising memory prices are prompting end customers to procure notebooks early, a shift that is expected to keep shipments steadier than...

Sunday 21 December 2025
TSMC's US expansion stirs security debate as Taiwan government reaffirms N-2 rule

TSMC's plan to sharply expand its US footprint has reignited debate in Taiwan over technology security, even as the government insists...

Sunday 21 December 2025
Biren targets Hong Kong's first GPU listing after US$890M losses

Shanghai-based Biren Technology has cleared its Hong Kong listing hearing, positioning itself as Hong Kong's first listed domestic GPU...

Sunday 21 December 2025
Taiwan academics seek to break through SiPh yield bottlenecks
Cloud computing, GenAI, and high-performance computing continue to drive bandwidth and energy efficiency demands. Line rates have now been pushed beyond 100–200Gbps. The intense...
Saturday 20 December 2025
Foxconn's quantum advancement earns UNESCO recognition
Marking the 100th anniversary of quantum mechanics, the United Nations General Assembly (UNGA) proclaimed 2025 as the International Year of Quantum Science and Technology (IYQ). The...
Saturday 20 December 2025
Samsung reveals sub-10nm DRAM breakthrough targeting 0a, 0b nodes
Samsung Electronics has unveiled a key technology pathway for sub-10nm DRAM, offering a rare public look at how the company plans to push memory scaling beyond current 10nm-class limits...