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Thursday 20 August 2026
Chinese SiC substrate maker SICC hits record Q2; 8-inch wafers top 50% of core revenue

SICC reported stronger first-half 2026 revenue and margins as its 8-inch silicon carbide substrate business gained scale, highlighting...

Thursday 20 August 2026
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...
Thursday 20 August 2026
Kenmec subsidiaries target SiC, AIDC growth

Kenmec Group founder and president Frank Hsieh said on August 19 that two of the company's new businesses have taken shape, with Taisic...

Thursday 20 August 2026
Marvell issues Google warrant worth US$12.2B at exercise — custom chip work spans five TPU-related categories

Marvell Technology has issued Google a warrant to purchase up to 58,970,907 shares of its common stock at US$206.58 per share, according...

Thursday 20 August 2026
Asia Optical eyes Metalens, CPO, and AI cooling opportunities; digital camera shipments to surpass 4 million units
Asia Optical delivered strong second-quarter financial results while accelerating its strategic expansion across optical technologies. Key growth drivers include Metalens and Co-Packaged...
Thursday 20 August 2026
Fudan Microelectronics profit jumps 339%, FPGA localisation gains traction
Shanghai Fudan Microelectronics Group reported a sharp first-half earnings increase in 2026, helped by stronger semiconductor demand, rising sales across its chip portfolio and investment...
Thursday 20 August 2026
CXMT planned to use Samsung process data to develop DRAM, ex-engineer says
A former Samsung Electronics researcher has testified that ChangXin Memory Technologies (CXMT) intended from its earliest days to develop DRAM using Samsung process data, an account...
Thursday 20 August 2026
Robotics leaders present future of physical AI, but also deployment challenges
Tech leaders converged at the 2026 International Robotic Forum on August 19, where they laid out their visions for the evolution and next stages of physical AI. They noted that a robot's...
Thursday 20 August 2026
Intel Malaysia packaging expansion draws HBM flows from Taiwan

South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according...

Thursday 20 August 2026
Gujarat's 12-hour shift approval for Micron shows how India is rewriting labour rules to court chipmakers

The Gujarat government's approval of 12-hour work shifts at Micron Technology's Sanand assembly and test plant is more than just a single-factory...

Thursday 20 August 2026
Samsung repays 20 trillion won SDC loan early as memory demand surges

Samsung Electronics fully repaid a KRW20 trillion unsecured loan from Samsung Display ahead of schedule in the second quarter of 2026,...

Thursday 20 August 2026
YMTC parent advances IPO as NAND share hits 14% and AI storage scales
Yangtze Memory Technologies Holding, the parent of Chinese NAND flash maker YMTC, has completed a key stage of its pre-IPO process just as the memory maker gains global market share,...
Thursday 20 August 2026
Innolux turns panel fabs into FOPLP capacity, banking on sticky advanced packaging ties

Innolux is accelerating its dual-track transformation and asset-light strategy, with second-quarter 2026 earnings per share rising 185%...

Thursday 20 August 2026
WPG sees chip supply remaining tight into 2027, plans NT$15 billion convertible bond sale

Taiwan-based IC distributor WPG Holdings expects AI-driven semiconductor demand to remain strong into 2027, with capacity tight across...

Thursday 20 August 2026
High-end PCB supply tightens as CCL expansions face delays
As AI applications demand faster data transmission from PCBs, M8 and higher-grade copper-clad laminate (CCL) materials are becoming increasingly mainstream in server boards. The shift...