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Friday 31 July 2026
Powertech bets on AMD FOPLP mass production in 2027
Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to...
Friday 31 July 2026
Auto chip demand recovers, but restocking remains elusive

Automotive chip sales are improving across Europe and the US, but major suppliers say global carmakers and their suppliers are still...

Friday 31 July 2026
Memory shortages deepen as prices climb into the second half of 2026

Memory shortages are tightening across the supply chain, and higher contract prices are set to ripple through global electronics markets...

Friday 31 July 2026
Amazon lifts 2026 capex to US$220 billion, pins the increase on memory prices

Amazon has raised its 2026 capital expenditure plan by roughly US$20 billion and attributed the increase to a single input cost: me...

Friday 31 July 2026
Shanghai rises as China's lithography hub, powered by SMEE, Huawei and rising DUV rivals

China's lithography equipment sector has returned to the global semiconductor spotlight following reports that a domestically developed...

Friday 31 July 2026
Kioxia begins sampling 1TB 3D flash memory for AI devices
Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage...
Friday 31 July 2026
TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026
AI server boom reshapes MLCC pricing as capacity shifts upmarket

The rapid expansion of AI infrastructure is reshaping one of the semiconductor industry's most overlooked component markets. Soaring...

Friday 31 July 2026
Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

Friday 31 July 2026
Intel's rare Atom IP deal gives RosaicLabs a shortcut to custom x86 chips

Intel has granted stealth chip startup RosaicLabs access to parts of its Atom processor technology, potentially including register-transfer...

Friday 31 July 2026
AI strains mature-node and packaging capacity, leaving chip designers with orders but no supply

AI demand is tightening semiconductor capacity beyond TSMC's advanced nodes, with mature-process foundries and backend packaging providers...

Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...

Friday 31 July 2026
Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry
TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach...
Friday 31 July 2026
SPIL AI packaging investment boosts CTSP Erlin Park as first standard factory opens in 2H26
The Central Taiwan Science Park's (CTSP) Erlin Park is set to reach a long-awaited milestone when its first standard factory building begins operations in the second half of 2026,...
Friday 31 July 2026
UMC raises capex to US$2B, eyes AI SiPh
UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while unveiling expansion plans in Singapore and a new fab in STSP. The foundry also disclosed...