LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early...

China AIoT chip designer Rockchip posted record first-half 2026 results, with revenue rising 40.6% year on year to CNY2.88 billion (US$427...

VeriSilicon posted record first-half 2026 revenue of CNY1.86 billion (US$276 million), up 91.37% year-on-year, as AI computing demand...

TSMC is expanding cooperation with packaging and testing affiliate Xintec as it develops next-generation power delivery and advanced packaging...

Topco Scientific (TSC) said at its second-quarter 2026 earnings conference that rising upstream petrochemical costs are pushing up...

SK hynix's second-largest customer generated KRW17.19 trillion (approx. US$12.4 billion) in sales in the first half of 2026, nearly...

Chinese AI chipmaker Biren expects first-half 2026 revenue to reach CNY1.15-1.3 billion (US$171-193 million), up about 1,852% to 2,107%...

Nvidia has reached a deal with OpenAI to provide up to US$105 billion in credit guarantees for the AI startup's upcoming 8GW data center...

Samsung Electronics' semiconductor chief has told executives not to treat the company's HBM4 comeback as proof that its recovery is...

Arm Holdings' expansion from asset-light IP licensing into finished data center processors is putting the company into direct competition...

Niche printed circuit board (PCB) manufacturer Eiso Enterprise has officially opened the second-phase expansion of its new plant in...