CONNECT WITH US
NEWS TAGGED CHIPS + COMPONENTS
Saturday 1 August 2026
AUO commits US$721M to TGV, glass core and CPO expansion
AUO sold three factories within two days, with disposal gains expected to reach NT$17.7 billion (approx. US$548 million). Chairman Paul Peng said the proceeds would be reinvested in...
Saturday 1 August 2026
Obituary: Powerchip chairman Frank Huang dies after reshaping Taiwan's DRAM and foundry industry

Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned...

Saturday 1 August 2026
Posiflex revenue rises 46% in the second quarter on Europe and Asia demand
Posiflex Technology reported a sharp sequential rebound in the second quarter of 2026, with consolidated revenue climbing 46% to NT$5.183 billion (US$160.3 million). The industrial...
Saturday 1 August 2026
Elite Material posts record 2Q result on strong AI-related demand
Elite Material Co. said booming demand for advanced materials used in AI hardware kept its factories fully loaded in the second quarter of 2026, lifting revenue and profit to record...
Saturday 1 August 2026
Realtek, Elan, and Parade set the tone for PC chip demand
As the second half of the year begins, major Taiwanese IC design firms including Realtek Semiconductor, Elan Microelectronics, and Parade Technologies are holding earnings briefings...
Saturday 1 August 2026
Silicon Motion posts record Q2 revenue and 2026 sales growth over 100%
NAND controller maker Silicon Motion Technology reported record second-quarter 2026 revenue of US$451 million, up 32% quarter-on-quarter and 127% from a year earlier, as profit and...
Saturday 1 August 2026
Thintronics wins proposed US CHIPS incentives for advanced substrate technology
Thintronics, a semiconductor interconnect company, said in a press release on July 29 that it had signed a letter of intent with the US Department of Commerce and the CHIPS Research...
Saturday 1 August 2026
At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging

When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest,...

Friday 31 July 2026
Powerchip founder Frank Huang dies at 76; vice chair steps in as acting chief

Powerchip Semiconductor Manufacturing Corp. (PSMC, TWSE: 6770) said in a material-information filing on July 31 that its chairman,...

Friday 31 July 2026
Analysis: The AI buildout stopped being a demand story

For three years, the constraint on artificial intelligence was how much compute the hyperscalers wanted to buy. The June-quarter filings...

Friday 31 July 2026
Exclusive: Asian chipmakers' shift to US helium raises concentration risk
Chipmakers in Taiwan, South Korea, and Japan have avoided broad helium-related production disruptions so far, but their rapid shift toward US supply is creating a new concentration...
Friday 31 July 2026
ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

Friday 31 July 2026
Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
CXMT's IPO marks a shift in China's DRAM strategy from capacity building towards mainstream products, process upgrades, and global competition, according to DIGITIMES Intelligence.
Friday 31 July 2026
Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco,...
Friday 31 July 2026
Tokyo Electron raises outlook as AI data center spending lifts memory demand
Tokyo Electron lifted its operating profit outlook for April-September 2026 on July 30, citing continued investment in AI data centers and stronger semiconductor capital spending....