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    ASML and Applied Materials enter advanced packaging, challenging South Korea's HBM edge
    Jan 22, 18:32
    Samsung aims to boost foundry utilization rate to over 60% in first half of 2026
    Jan 22, 18:32
    Samsung's Taylor fab reportedly orders South-Korean-made EUV pellicle equipment
    Jan 22, 18:31
    Taiwanese firms remain cautious amid AI bubble debate
    Jan 22, 18:31
    Europe's fuel engine phase-out challening with strict carbon regulations and talent lost to China
    Jan 22, 18:31
    BOE production issues with iPhone OLED give Samsung Display chance to take over
    Jan 22, 18:30
    Tesla's BEV moat faces challenges from Europe's depth and China's speed
    Jan 22, 18:30
    TSMC and Samsung reduce 8-inch wafer capacity, but oversupply still remains
    Jan 22, 18:30
    NEWS TAGGED CHIPS + COMPONENTS
    Tuesday 6 January 2026
    SK Hynix says HBM3E to dominate memory in 2026 as HBM4 ramps up

    SK hynix announced on Jan. 5 that it expects its fifth-generation high-bandwidth memory, HBM3E, to remain the dominant product in the...

    Tuesday 6 January 2026
    Chinese chipmakers confront yield challenges despite localization push
    China is speeding up efforts to localize its semiconductor supply chain to overcome US restrictions on high-end technology exports. Supply chain sources acknowledge that while Chinese...
    Tuesday 6 January 2026
    Chang Wah interview: strong lead frame growth despite precious metals shortage
    Post-pandemic inventory digestion for mature semiconductor processes has come to an end. Market conditions have rebounded amid tariff-hedging and precautionary stocking, driving Taiwan's...
    Monday 5 January 2026
    TSMC 2nm leak probe leads to additional indictments for three people and Tokyo Electron

    Taiwan's High Prosecutors' Office has filed a supplementary indictment against three additional suspects and the Japanese chip equipment maker Tokyo...

    Monday 5 January 2026
    Chunghwa Precision Test Tech to build new plant in Taoyuan amid growing semiconductor demand
    Chunghwa Precision Test Tech (CHPT), a subsidiary of Chunghwa Telecom, plans to start construction of its third Pingzhen plant in Taoyuan in early 2026, with completion expected by...
    Monday 5 January 2026
    Inpaq CEO Pei-Jen Chen launches resource realignment plan
    Inpaq Technology, a passive components maker under the Walsin Technology Group, has launched an internal resource realignment plan. Newly appointed CEO and president Pei-Jen Chen stated...
    Monday 5 January 2026
    TSMC kicks off 2nm production with Samsung in hot pursuit
    The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as...
    Monday 5 January 2026
    Lee Jae-myung's first China visit signals warming South Korea-China ties
    According to Bloomberg and The Korea Economic Daily, South Korean President Lee Jae-myung made a four-day trip from January 4-7, 2026, to Beijing and Shanghai, including...
    Monday 5 January 2026
    Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026
    Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial production...
    Monday 5 January 2026
    China memory makers' IPO line up: CXMT seeks US$4.2 billion, YMTC prepares filing
    Strong AI demand has pushed the memory sector into a rare upcycle. China's leading DRAM maker CXMT is advancing an IPO application on the STAR Market, targeting CNY29.5 billion (US$4.21...
    Monday 5 January 2026
    Samsung reportedly pitches bundled solutions to Google and AMD
    As major corporations expand investments in artificial intelligence (AI), memory suppliers have seen a flood of orders. According to the latest reports from South Korean media, Samsung...
    Monday 5 January 2026
    Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

    China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing...

    Monday 5 January 2026
    Weekly news roundup: TSMC widens 2 nm edge as South Korea boosts chip spending; Huawei eyes memory bottlenecks
    These are the most-read DIGITIMES Asia stories in the week of Dec 29 - Jan 4.
    Monday 5 January 2026
    ITC launches formal investigation into Samsung and Google over Netlist patent dispute
    The US International Trade Commission (ITC) announced it has launched an investigation into alleged semiconductor patent infringement involving Samsung Electronics, Google, and Supermicro,...
    Monday 5 January 2026
    Memory price surge drives profit windfall across sector
    Memory demand remains elevated, with supply shortages driving prices sharply higher and triggering a broad profit surge across the sector. Memory module makers Adata and Team Group...
    22/338 pages
    biz
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook