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NEWS TAGGED CHIPS + COMPONENTS
Thursday 18 June 2026
Samsung, SK Hynix weigh first chip packaging plants in South Korea's Honam region

Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants,...

Thursday 18 June 2026
Taiwan chip makers signal durable upcycle as memory prices and AI demand align

Taiwan's listed semiconductor manufacturers reported strong May revenue figures, with a sweeping recovery in DRAM prices and rising...

Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
Analysis: Chinese firms tap Singapore-Malaysia model to shed 'Made in China' label — but hurdles remain

The global semiconductor and high-tech manufacturing landscape continues to undergo structural realignment. An increasing number of...

Thursday 18 June 2026
Nichicon raises e-cap prices as supply tightens, costs increase
Japanese capacitor manufacturer Nichicon has announced a broad price hike for aluminum electrolytic capacitors (e-cap), as order volumes for some products have exceeded the company's...
Thursday 18 June 2026
SMIC narrows Intel's metal pitch gap, but Kirin 9030 teardown shows China's chip limits remain

A teardown of Huawei's latest Mate 80 Pro Max smartphone has put China's semiconductor progress back under scrutiny, after analysis...

Thursday 18 June 2026
Samsung advances 1d DRAM roadmap; pilot production eyed by end-2027
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin...
Thursday 18 June 2026
Samsung to offer 2nm prototype runs as South Korea pushes chip design

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South...

Thursday 18 June 2026
TSMC, ASML and Imec push 2D transistors toward manufacturing

Imec, ASML and TSMC have demonstrated a 300mm integration route for 2D-material n-type and p-type field-effect transistors, marking a...

Thursday 18 June 2026
SK Hynix ships HBM4E samples to customers
SK Hynix has begun shipping samples of HBM4E, its next-generation high-bandwidth memory, to major customers. The South Korean chipmaker said the 12-layer product was delivered on s...
Thursday 18 June 2026
Samsung pushes vertical transistor design as chip scaling hits limits

Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends...

Thursday 18 June 2026
Taiyo Yuden to boost AI server MLCC capacity, resists price hikes

Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers...

Thursday 18 June 2026
Samsung said to open fab data to suppliers in AI factory push

Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers,...

Thursday 18 June 2026
Taiwan 2026 GDP could top 10%, says Minister of Economic Affairs
Taiwan's 2026 GDP growth is on track to exceed 10% as AI demand powers the island's economy, Minister of Economic Affairs Ming-hsin Kung said, adding that this level of growth may...
Thursday 18 June 2026
SK Hynix scraps degree rules to court AI chip talent

SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks...