During its second-quarter 2025 earnings call, Texas Instruments (TI) underscored the pivotal role China played in driving the company's industrial segment growth.
Texas Instruments' management struck a cautious tone during its second-quarter 2025 earnings call, highlighting signs of cyclical recovery across most end markets while acknowledging...
Dixon Technologies has decided to pause plans to enter bare PCB manufacturing, citing limited financial upside despite government incentives. During its fiscal first-quarter 2025...
On July 22, Texas Instruments (TI) reported a strong set of second-quarter results, buoyed by a rebound in analog chip demand and signs of stabilization in its industrial business...
The second half of 2025 is shaping up to be a pivotal period in the global semiconductor industry, as the race for technological supremacy intensifies. At the forefront are Samsung...
As the smartphone industry enters the second half of 2025, attention is turning toward the final chapter of 3nm system-on-chip (SoC) flagships. Apple, MediaTek, and Qualcomm are all...
Taiwanese Vice President Bi-khim Hsiao has expressed her stance on the US imposition of Section 232 tariffs for the first time, pointing out that the US and Taiwan ultimately have...
As the US prepares to impose steep tariffs on imported copper, global copper prices have rebounded, raising concerns about rising costs across copper-intensive industries. Among the...
As TSMC expands its presence in Japan, Taiwan and Japan are deepening academic collaboration to address the growing demand for semiconductor talent. National Yang Ming Chiao Tung...
Taiwan's passive component industry is positioned for growth driven by AI adoption across cloud servers, AI PCs, and smartphones, alongside rising automotive electrification. Industry...
Samsung Electronics has reportedly succeeded in developing its sixth-generation 10nm class DRAM, known as 1c DRAM, and is preparing for mass production despite internal tensions that...
Yageo, Taiwan's leading passive component manufacturer, said its third meeting with Japan's Shibaura Electronics concluded successfully in Taipei, marking a key step in Yageo's ongoing...
Competition in bonding equipment for the high bandwidth memory (HBM) market is intensifying, especially for the new generation of hybrid bonding (HB) technology. Following the current...
Chinese memory giant CXMT is actively advancing its DDR5 and LPDDR5 DRAM process upgrades. According to supply chain sources, although CXMT has yet to enter mass production, recent...
