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    Samsung aims for 2026 HBM4 mass production after customer validation
    10min ago
    Smartphones and notebook prices could increase as memory lead times extend
    13min ago
    SanDisk, Micron vie for PSMC's Tongluo fab capacity
    18min ago
    South Korea's semiconductor bill risks weakening competitiveness as rivals roll out cash subsidies
    22min ago
    Chunghwa Telecom upgrades certificate governance, applies for Chrome root trust list
    27min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Tuesday 16 December 2025
    Samsung Chairman Lee Jae-yong meets with Lisa Su and Elon Musk to discuss potential collaboration
    Samsung Electronics Chairman Lee Jae-yong has returned to South Korea after a week-long business trip to the US. Lee reportedly met with Tesla CEO Elon Musk in Austin, Texas, with...
    Tuesday 16 December 2025
    Samsung nears deal to supply over 30% of Nvidia's HBM4 memory in 2026
    Samsung Electronics is close to finalizing negotiations with Nvidia to supply more than 30% of its sixth-generation high-bandwidth memory (HBM4) for 2026, aiming to regain market...
    Tuesday 16 December 2025
    Samsung steadies 12-Layer HBM3E, eyes larger Google TPU orders
    Samsung Electronics has reportedly stabilized the performance of its 12-layer high-bandwidth memory, a development that could allow the company to expand shipments to Google's artificial...
    Tuesday 16 December 2025
    China's chip resilience: Naura M&A, ACM's HBM push defy US export controls
    Escalating US-China tech rivalry and the politicization of the supply chain are accelerating a structural transformation in the global semiconductor equipment sector. While the US...
    Tuesday 16 December 2025
    Acer CEO urges firms to boost resilience amid memory price surge
    Acer chairman and CEO Jason Chen has pointed out that soaring memory prices have triggered ripple effects across the market, driving up costs and retail prices, which in turn impact...
    Tuesday 16 December 2025
    Apple braces for DRAM cost surge as Korean suppliers reprice contracts
    Apple is facing renewed cost pressure as its long-term DRAM supply contracts with South Korean memory makers approach expiry in January 2026, heightening concerns that higher component...
    Tuesday 16 December 2025
    Smartphone industry faces cost challenges in 2026 amid memory shortages and rising prices
    The smartphone industry is facing considerable cost challenges in 2026 amid ongoing memory supply shortages and rising prices. This situation is expected to lead to a 1.6% decrease...
    Tuesday 16 December 2025
    Notebook market may see second consecutive year of seasonal demand distortion in 2026
    The notebook market is expected to encounter an unusual shift in seasonal demand for a second consecutive year, with 2026 poised to replicate the disruption seen in 2025. While geopolitical...
    Tuesday 16 December 2025
    SenseTime's Seko 2.0 ties AI video breakthrough to Cambricon chips, signaling China's multimodal push

    SenseTime has released Seko 2.0, which it describes as the industry's first multi-episode video generation agent, marking a step beyond...

    Tuesday 16 December 2025
    South Korea lures global chip capital at COMEUP 2025 as Middle East investors step in

    South Korea is emerging as a focal point for global semiconductor investment as domestic AI chip startups attract growing interest from...

    Monday 15 December 2025
    Qualcomm sharpens RISC-V influence with Ventana acquisition
    Qualcomm's acquisition of Ventana Micro Systems signals a clear push to deepen its commitment to RISC-V and accelerate the maturation of the surrounding ecosystem.
    Monday 15 December 2025
    Samsung chair, Musk reportedly meet at Texas fab as chip output looms
    Samsung Electronics chairman Jay Y. Lee reportedly met Tesla CEO Elon Musk on December 11, 2025, local time at Samsung's semiconductor plant in Texas, underscoring a deepening partnership...
    Monday 15 December 2025
    SK Hynix taps ASMPT for HBM4 TC bonders amid Hanmi-Hanwha patent clash

    SK Hynix has reportedly placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT as it accelerates preparations...

    Monday 15 December 2025
    SK Hynix leads Samsung by 3-4 months, begins supplying paid HBM4 samples
    Latest media reports state that SK Hynix has completed the final verification phase for customer samples of its 12-layer sixth-generation high-bandwidth memory (HBM4) prior to mass...
    Monday 15 December 2025
    TASC partners with Itochu Taiwan to deepen compound semiconductor and smart medical ventures
    Taiwan-Asia Semiconductor Corporation (TASC) is advancing its layout in compound semiconductors and non-invasive blood glucose monitoring technology through the signing of a memorandum...
    18/332 pages
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