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    Hyundai Motor Group expands US research unit ahead of EREV and HEV push
    1h 29min ago
    LB Semicon begins shipments to Qualcomm after two-year partnership
    1h 29min ago
    Commentary: Apple shifts to smart vehicle software layer as Ternus era arrives
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    Kyocera opens first new Japan plant in 21 years to tap Kyushu chip supply chain
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    CPO testing shifts upstream as equipment makers vie for integration lead
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    NEWS TAGGED CHIPS + COMPONENTS
    Tuesday 25 August 2026
    Broadcom's debt push signals AI compute is becoming Wall Street asset class
    The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly...
    Tuesday 25 August 2026
    SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
    The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
    Tuesday 25 August 2026
    Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
    Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
    Tuesday 25 August 2026
    Inergy server share hits 47% on cooling, BBU demand

    Inergy Technology said strong demand for AI server cooling and power management pushed the share of server-related applications to 47%...

    Tuesday 25 August 2026
    Nvidia memory demand widens the gap between SK Hynix and Samsung

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

    Monday 24 August 2026
    Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
    Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC...
    Monday 24 August 2026
    Etron chair sees memory boom extending to 2028-2030
    The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
    Monday 24 August 2026
    TPK TGV pilot line to start by September, Thailand plant eyes 2027 ramp
    TPK Holding is accelerating its move from consumer touch panels into semiconductors, with its Through Glass Via (TGV) pilot line in Taoyuan, Taiwan set to begin operations in August...
    Monday 24 August 2026
    AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
    Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck...
    Monday 24 August 2026
    Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
    As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
    Monday 24 August 2026
    Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models
    Nvidia reportedly struck a US$6 billion deal with startup Poolside to license its technology and hire much of its staff. The technology and personnel will reportedly support the chipmaker's...
    Monday 24 August 2026
    Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

    Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

    Monday 24 August 2026
    Pixel 11 preorder surge lifts Google's Taiwan smartphone share
    Google's newly launched Pixel 11 series drew a strong preorder response in Taiwan after telecom carriers rolled out expanded promotions and sales plans. The early momentum has renewed...
    Monday 24 August 2026
    Taiwan semiconductor materials hit golden opportunity
    Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of...
    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
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    BIZ FOCUS
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    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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