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Thursday 5 February 2026
MediaTek charts data center ASIC expansion even as smartphone sales slow
MediaTek held its earnings briefing with investor focus centered on application-specific integrated circuits (ASICs) and the smartphone market outlook. CEO Rick Tsai said the company's...
Thursday 5 February 2026
Arm faces investor scrutiny as licensing miss collides with smartphone cost pressures

Arm Holdings shares fell approximately 8% in extended trading on February 4 after the chip IP provider reported the third-quarter fiscal 2026 licensing...

Thursday 5 February 2026
Infineon's Ams Osram sensor acquisition signals shift toward higher-value systems and AI-linked growth
Infineon's planned purchase of Ams Osram's non-optical sensor portfolio underscores a strategic move to deepen its systems capability, rebalance exposure away from cyclical automotive...
Thursday 5 February 2026
Infineon's fiscal 1Q26 resilience highlights AI-driven growth amid cyclical pressures
Infineon's first quarter of fiscal year 2026 showed that strong demand linked to artificial intelligence (AI) can cushion cyclical weakness in other markets, reinforcing the company's...
Thursday 5 February 2026
Infineon pivots capacity to AI power as automotive recovery drags
Infineon's decision to accelerate investment to expand AI power capacity is set to lift fiscal 2026 capital spending and intensify fab loading management, even as the company maintains...
Thursday 5 February 2026
Renesas reportedly to sell timing unit to SiTime in US$3 billion deal
According to Bloomberg and Nikkei, citing respective sources, Renesas Electronics is set to divest its clocks and timing device business to US chip design company...
Thursday 5 February 2026
MediaTek beats revenue forecast as 2025 sales near US$20b record
MediaTek posted fourth-quarter 2025 revenue of NT$150.2 billion (US$4.75 billion), marking a 5.7% quarter-on-quarter increase and an 8.8% rise from a year earlier. Gross margin slipped...
Thursday 5 February 2026
Japan's Ibiden channels US$3.3bn into IC substrate expansion for AI servers

Ibiden plans to invest JPY500 billion (about US$3.3 billion) over three years starting in fiscal 2026 to expand production of its core IC...

Thursday 5 February 2026
Networking equipment makers seek new businesses as they unlikely to avoid margin pressure
The networking industry is seeing a rebound in demand in 2026, but worsening imbalances in memory supply and demand have emerged as the biggest variable affecting operations this year...
Thursday 5 February 2026
Taiwan companies navigate supply chain gaps as India emerges as key manufacturing market
The US move to lower reciprocal tariffs on Indian goods to 18% is reshaping Taiwan manufacturers' India strategies, creating fresh opportunities in localization and import substitution...
Thursday 5 February 2026
Samsung sees net cash surpass KRW100 trillion, fueling semiconductor investment, M&As
Samsung Electronics has once again pushed its net cash above KRW100 trillion (US$68.97 billion), reaching KRW100.61 trillion at the end of 2025, up 7.8% from the same period in 2024...
Wednesday 4 February 2026
TI and NXP report strong results as AI data center power management boosts semiconductor packaging demand
Texas Instruments (TI), Infineon Technologies AG, STMicroelectronics, and NXP Semiconductors are expanding their manufacturing footprint in Malaysia as global customers accelerate...
Wednesday 4 February 2026
Nvidia's HBM4 tests near completion as SK Hynix ramps 1b DRAM
SK Hynix is accelerating production of 1b DRAM for high-bandwidth memory as quality testing of Nvidia's next-generation HBM4 nears its final stage, according to Korean media and industry...
Wednesday 4 February 2026
Nvidia shapes the HBM4 race as Samsung, SK Hynix jockey for position
Record demand for artificial intelligence applications propelled Samsung Electronics and SK Hynix to milestone financial results in 2025. On January 29, 2026, the two South Korean...
Wednesday 4 February 2026
Samsung, SK Hynix move into HBM4 as yields and policy risks loom
Samsung Electronics and SK Hynix have both secured production-ready technology for 16-layer stacks of sixth-generation high-bandwidth memory, known as HBM4, positioning the two South...