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NEWS TAGGED CHIPS + COMPONENTS
Tuesday 23 June 2026
Japan puts robotics at heart of US$2.3 trillion chip revival

Japan is preparing a sweeping public-private investment strategy totaling more than JPY370 trillion (US$2.3 trillion) by fiscal 2040,...

Tuesday 23 June 2026
Commentary: Google defines AI path to ASI, validates chip boom
Google released a 30,000-word AI roadmap on June 14 that, for the first time, clearly defines AI having the capability of 100 million humans as a key milestone on the path to artificial...
Tuesday 23 June 2026
High-end fiberglass cloth supply tightens; shortages to persist through 2027

Demand for high-end fiberglass cloth is surging on the AI boom, and orders from copper-clad laminate (CCL) customers are leaving the...

Tuesday 23 June 2026
AI power systems drive snap-in capacitor demand; Chinsan gains from order spillover

Demand in the passive component market has rebounded alongside the rapid buildout of AI data centers. While Japanese suppliers continue...

Tuesday 23 June 2026
Wafer Works unveils golden triangle expansion to boost AI, optical, and SiC wafer capacity
Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing...
Monday 22 June 2026
AI demolishes traditional tech: how NPUs and AI RAN are rewriting European infrastructure

AI is no longer a localized software novelty. It is now aggressively wiping out traditional hardware infrastructure across Europe....

Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
SK Hynix overtakes Samsung as HBM boom reshapes Korea's chip industry

SK Hynix briefly overtook Samsung Electronics on June 22 to claim the top spot by common-share market capitalization on South Korea's...

Monday 22 June 2026
Soaring contract prices put memory's big three on course for blockbuster 2026 profits

The memory industry is entering a super cycle as prices keep soaring, with industry sources saying third-quarter 2026 contract price...

Monday 22 June 2026
TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...

Monday 22 June 2026
Groq CEO sees GPU and LPU as complementary as AI compute demand grows
Nvidia's planned US$20 billion strategic deal with Groq is built on a simple logic: as compute gets cheaper, demand keeps expanding. In a recent interview, Groq co-founder and CEO...
Monday 22 June 2026
Panjit upgrades hot swap tech to drive 2H26 growth
AI data centers are driving growth in demand for power management and power semiconductor components. Hot swap products, in particular, require a wide safe operating area (SOA) to...
Monday 22 June 2026
Global suppliers race accelerates: TSMC's first CoPoS demo tools enter validation
TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next...
Monday 22 June 2026
Memory costs push Samsung Galaxy A37 pricier as S26 holds steady

AI-driven memory price spikes are presenting a challenge for Samsung's smartphone business, with rising component prices eroding the...

Monday 22 June 2026
Toto reportedly bets bigger on semiconductor materials as AI pushes industry toward 1nm era

Japanese bathroom fixture maker Toto is deepening its commitment to the semiconductor industry, unveiling plans to invest JPY80 billion...