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Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...

Wednesday 5 August 2026
Smartphone makers brace for lower volumes, higher prices, and deeper market split
Apple, Qualcomm, and MediaTek delivered similar warnings last week: the global smartphone market is entering a more expensive, more polarized phase. For users, this means fewer affordable...
Wednesday 5 August 2026
Nanya Technology July revenue hits record as DDR4 contract prices surge

Nanya Technology Corporation reported July 2026 revenue of NT$43.868 billion(US$1.353 billion), up 49.27% from June and marking a new...

Wednesday 5 August 2026
FMS 2026 opens with major memory makers present, but CXMT missing from exhibitor list
FMS 2026 opened in Santa Clara with Samsung, SK Hynix, and Micron highlighting AI memory plans, while China's CXMT was absent from the official roster. The omission is drawing attention...
Wednesday 5 August 2026
Manz opens Tainan R&D center for advanced packaging equipment

Manz has applied to establish a branch in the Tainan Science Park and plans to set up an R&D center there for advanced packaging...

Wednesday 5 August 2026
AMD leans on Helios and hyperscaler deals to press its case against Nvidia in AI chips
AMD used its second-quarter 2026 results to reinforce a broader argument: that it can replicate in AI accelerators the market-share gains it has already made in server central processing...
Wednesday 5 August 2026
Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026
Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models —...
Wednesday 5 August 2026
Cloud AI chipmakers race to secure capacity with long-term deals
Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no...
Wednesday 5 August 2026
Research Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply
Samsung Electronics' memory business was the clear focus of its second quarter 2026 earnings call, accounting for about one-third of the Q&A session. DIGITIMES Intelligence said...
Wednesday 5 August 2026
Hanwha Semitech expands packaging tools as TCB turns profitable

South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging...

Wednesday 5 August 2026
Aurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26

Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second...

Wednesday 5 August 2026
Powerchip says family succession plan remains unchanged
Powerchip Semiconductor Manufacturing Corporation said on August 4, 2026, that the death of chairman Frank Huang has not changed the group's ownership structure, management team, or...
Wednesday 5 August 2026
South Korea's KRW500B SiC push stalls as low returns deter major companies

South Korea's planned KRW500 billion(US$349,398) research and development initiative for silicon carbide (SiC) power semiconductors...

Wednesday 5 August 2026
From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era
Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global...
Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...