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    NEWS TAGGED CHIPS + COMPONENTS
    Friday 13 February 2026
    SEMICON Korea: Samsung pushes hybrid bonding HBM, SK Hynix bets on platform AI
    SEMICON Korea 2026, held in Seoul from February 11–13, brought senior executives from Samsung Electronics and SK Hynix to outline their AI-era memory R&D strategies. Samsung...
    Friday 13 February 2026
    Air cooling will dominate Trainium 3 rollout as Amazon targets 2Q26 production ramp
    Amazon Web Services' (AWS) Trainium 3 servers, slated for mass production in the second quarter of 2026, have sharply reduced their planned use of liquid cooling, supply chain sources...
    Friday 13 February 2026
    Commentary: NSTC chief’s reform remarks ignite debate over Taiwan’s research metrics
    Minister of the National Science and Technology Council (NSTC) Cheng-wen Wu has recently sparked a firestorm across Taiwan's academic community. His blunt critique of long-standing...
    Friday 13 February 2026
    Applied beats as AI chip spending nears $1tn tipping point
    On February 12, Applied Materials Inc. (AMAT) announced fiscal first-quarter 2026 financial results that exceeded the midpoint of its previous guidance, driven by a significant surge...
    Friday 13 February 2026
    Why Applied says the AI boom is real—just waiting for more cleanrooms
    Applied Materials used its fiscal first quarter 2026 earnings call to underscore that AI-related semiconductor demand is running ahead of earlier forecasts, with industry revenues...
    Friday 13 February 2026
    Samsung said to gain 8nm orders in Europe as 2nm plan advances

    Samsung Electronics is said to be expanding its 8nm foundry customer base into Europe following earlier contract wins in the US and Ja...

    Friday 13 February 2026
    A tariff truce with teeth: US–Taiwan pact shields chips from Section 232 shocks
    US Ambassador Jamieson Greer oversaw the signing of a comprehensive Agreement on Reciprocal Trade between the US and Taiwan on February 12, 2026. The agreement, reached under the auspices...
    Friday 13 February 2026
    E-glass capacity cuts trigger production shifts for Taiwan CCL makers
    The global AI data center boom is straining not only high-end computing chips but also adjacent industries such as memory and upstream glass fiber cloth, where significant capacity...
    Friday 13 February 2026
    Winbond's two-year sell-out signals memory cycle shift and US$1.35bn capex push

    Winbond Electronics is entering a powerful demand cycle, with tight supply conditions across DRAM, NOR flash, and SLC NAND extending beyond...

    Friday 13 February 2026
    Kioxia forecasts up to 77% operating profit surge on AI-driven NAND price rally
    Driven by expanding memory demand from AI servers and rising average selling prices, Japan-based NAND flash and SSD maker Kioxia expects solid growth in fiscal year 2025 (April 2025-March...
    Thursday 12 February 2026
    HBM4 first-mover fog: Samsung and Micron duel for supremacy amid Nvidia supply tension
    Samsung Electronics has officially commenced the mass production and commercial shipment of its HBM4 memory, marking a pivotal moment in the global semiconductor landscape.
    Thursday 12 February 2026
    Tower Semiconductor revamps strategy after Intel deal collapses
    Intel's decision to walk away from its September 2023 agreement for Fab 11X in New Mexico has prompted Tower Semiconductor to revamp its manufacturing roadmap, scrap the facility from...
    Thursday 12 February 2026
    GlobalFoundries accelerates silicon photonics targets; eyes US$1 Billion revenue run rate by 2028

    GlobalFoundries is aggressively pulling forward its financial targets for silicon photonics (SiPh), betting that the "insatiable" demand for AI...

    Thursday 12 February 2026
    Tariff shifts and supply-chain realignment set to make Taiwan top US PCB supplier
    Geopolitical tensions stemming from the US-China trade war and global tariff barriers are driving major changes across the printed circuit board (PCB) industry, prompting structural...
    Thursday 12 February 2026
    Applied Materials settles with BIS for US$252.5 million over SMIC shipments
    Applied Materials, a Santa Clara-based semiconductor equipment maker, has reached a US$252.5 million settlement with the US Department of Commerce's Bureau of Industry and Security...
    16/351 pages
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook