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Wednesday 24 June 2026
JEDEC reportedly approves SPHBM4 standard to broaden HBM4 packaging and boost glass substrate prospects
JEDEC finalized a new HBM4 packaging specification called SPHBM4 that aims to broaden high bandwidth memory (HBM) use cases by reducing packaging complexity and cost, industry sources...
Tuesday 23 June 2026
Nippon Sanso raises helium prices over 30% on Middle East instability-driven supply crunch

Industrial gas manufacturer Nippon Sanso Holdings announced it will raise prices for all helium products in the Japanese market starting...

Tuesday 23 June 2026
Fulltech sees low DK2 shipments rising, starts M9 quartz cloth certification
Fulltech, a glass fiber yarn and cloth maker, said at its 2026 annual general meeting that demand for next-generation AI servers and high-speed switches is lifting specifications and...
Tuesday 23 June 2026
Smartphone demand and chip supply pressures cloud 2H26 peak season outlook
Market sentiment toward the smartphone industry remains subdued. On the demand side, global smartphone sales have declined for several consecutive weeks during the second quarter of...
Tuesday 23 June 2026
Intel deepens ties with Taiwan's chip supply chain as October talks expand
Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...
Tuesday 23 June 2026
India reportedly plans to launch fresh chip incentive in fiscal 2027
The Indian government plans to disburse INR71 billion in semiconductor incentives in fiscal year 2027 to expand its local chip supply chain, according to anonymous government officials...
Tuesday 23 June 2026
Infineon and InnoScience's GaN patent fight hardens market split

Infineon and InnoScience are escalating their global GaN patent dispute across the US, Germany, and China, with each side scoring wins...

Tuesday 23 June 2026
Nearfield Instruments raises US$380M in record Dutch deep-tech funding round

Dutch semiconductor metrology specialist Nearfield Instruments has secured US$380 million in Series D funding, marking the largest...

Tuesday 23 June 2026
Samsung Electro-Mechanics rides Qualcomm's data center push into servers

Samsung Electro-Mechanics has begun mass production of advanced package substrates for Qualcomm's first data center AI accelerator,...

Tuesday 23 June 2026
YMTC Holdings exits XMC as state-backed Optics Valley investor takes control
China's memory industry is undergoing another round of ownership restructuring. According to a recent merger review case disclosed by China's State Administration for Market Regulation...
Tuesday 23 June 2026
Thailand approves semiconductor strategy, targets investment and talent growth
Thailand's newly established National Semiconductor and Advanced Electronics Policy Committee has approved the framework for a national semiconductor strategy and a workforce development...
Tuesday 23 June 2026
SK Hynix Cheongju plant accidents raise HBM expansion safety concerns

SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over...

Tuesday 23 June 2026
Corsair's reported CXMT DDR5 move puts China DRAM on the global supply-chain map
China's DRAM supply chain is becoming a new variable in the global memory market. CXMT, China's largest DRAM manufacturer, is accelerating its DDR5 expansion. Recent reports stated...
Tuesday 23 June 2026
Taiwan OSAT sector's strongest 1H in years puts 2026 full-year revenue records in sight

Taiwan's semiconductor packaging and testing (OSAT) industry delivered strong year-over-year revenue growth in May 2026, with 21 of...

Tuesday 23 June 2026
MediaTek issues official price hike notice, products facing supply constraints likely to increase first
Taiwanese IC design leader MediaTek has sent a price hike letter to customers, signaling that the current wave of chip price increases is sweeping across the semiconductor market and...