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Monday 14 September 2026
Samsung, SK Hynix reject US$19 billion power prepayment as Korea speeds chip expansion

Samsung Electronics and SK Hynix have rejected a proposal to prepay KRW25 trillion (approx. US$18.7 billion) in electricity bills, highlighting...

Monday 14 September 2026
STMicro lead times top 1 year, boosting Taiwan chip makers
AI crowd-out effects are rippling through the supply chain, with lead times for microcontroller units (MCUs) from STMicroelectronics reportedly stretching beyond 1 year and triggering...
Monday 14 September 2026
DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...
Monday 14 September 2026
DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
Monday 14 September 2026
China optical firms target photonics with mixed high-end, lower-cost push
The 2026 China International Optoelectronic Exposition (CIOE) closed on September 11. While near-eye display applications such as AR/VR and smart glasses drew attention, vendors' latest...
Monday 14 September 2026
DIGITIMES Insight: China's GaN challengers are no longer playing catch-up
Chinese GaN power semiconductor maker Innoscience gained direct access to capital markets after listing in Hong Kong at the end of 2024, giving it fresh funding to expand GaN capacity...
Monday 14 September 2026
Sandisk recruits engineers in Korea as memory talent race heats up

Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND...

Monday 14 September 2026
South Korea broadens espionage law to counter rising tech leaks
South Korea's revised Criminal Act took effect September 13, extending the scope of espionage offenses from acts benefiting North Korea to those benefiting any foreign country or equivalent...
Monday 14 September 2026
Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a...
Monday 14 September 2026
Gritek to take full control of 12-inch silicon wafer venture in major restructuring
Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company...
Monday 14 September 2026
AI's energy demand ignites global nuclear rush, straining Taiwan's restart
A worldwide nuclear comeback, fueled by artificial intelligence data centers and semiconductor demand, is tightening supply chains and labor markets just as Taiwan considers restarting...
Monday 14 September 2026
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues

Google Cloud CEO Thomas Kurian recently revealed that Google's overall payback period for AI server investments is less than two years,...

Monday 14 September 2026
India semiconductor deals hit a multi-year high ahead of SEMICON India 2026
India's semiconductor companies have raised nearly half of their all-time equity funding since the start of 2025, and deal activity this year is already at a multi-year high. The figures...
Monday 14 September 2026
Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake

Hua Hong Grace (HHGrace) has completed the share issuance for its acquisition of a 97.4988% stake in Huali Microelectronics (HLMC),...

Monday 14 September 2026
CPO nears mass production — next battle about interfaces, yield and maintenance
As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...