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    Low-cost cruise missiles drive a new drone cost race
    8h 7min ago
    Taiwan drone makers expand into Eastern Europe as Ukraine cuts China supply risk
    8h 7min ago
    China’s AI industry accelerates shift to Huawei’s Ascend ecosystem
    8h 7min ago
    Why did memory price surge hits Samsung mobile profits while Apple still posts record gains
    8h 7min ago
    Hyundai Motor Group pushes ecosystem strategy beyond humanoid robot hype
    8h 7min ago
    Nvidia and AMD deepens Taiwan-US strategic economic ties
    8h 10min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Thursday 23 April 2026
    SaiMemory wins NEDO backing for next-generation ZAM memory, partners with Intel

    SaiMemory, a next-generation memory developer established by SoftBank, said on April 22 that its development project has been selected...

    Thursday 23 April 2026
    Machvision targets 70% high-end equipment share, eyes record 2026 revenue
    Machvision's launch of advanced inspection tools for semiconductors and high-end printed circuit boards carries significant implications for global electronics supply chains, promising...
    Thursday 23 April 2026
    China hands 11.5-year sentence in rare earth, semiconductor data leak case
    China is intensifying investigations and enforcement against data leaks in critical sectors across its industrial supply chain, targeting areas such as rare earths, semiconductors,...
    Thursday 23 April 2026
    Taiwan's semiconductor equipment gap persists despite govt subsidies
    With government incentives, Taiwan has achieved significant success in localizing display equipment, though the competitiveness of the display industry has declined considerably in...
    Thursday 23 April 2026
    Former Samsung Electronics researcher sentenced to 7-year prison term for leaking DRAM trade secrets
    A former researcher at Samsung Electronics was sentenced to seven years in prison on April 22 by a South Korean court for leaking core semiconductor trade secrets to a Chinese competitor...
    Thursday 23 April 2026
    SK Hynix to shift over half of NAND output to 321-layer chips
    SK Hynix said it plans to expand production of its latest 321-layer NAND chips, as demand for AI applications leads to increased adoption of high-capacity enterprise storage.
    Thursday 23 April 2026
    SK Hynix dismisses peak fears, points to structural memory upcycle

    SK Hynix said the current strength in memory pricing reflects structural changes in demand, pushing back against concerns that recent...

    Thursday 23 April 2026
    SK Hynix flags persistent HBM shortage as demand outpaces supply
    SK Hynix said demand for high-bandwidth memory is expected to outpace supply for several years, underscoring persistent constraints in the AI memory market even as the company ramps...
    Thursday 23 April 2026
    Parade offsets weak PC demand with TTED, high-speed, and automotive growth
    Parade Technologies' first-quarter 2026 results and revised outlook carry broader supply-chain and demand implications for global PC and electronics markets. Memory shortages and price...
    Thursday 23 April 2026
    Tesla tap Intel's advanced 14A chip for Terafab project
    Tesla plans to use advanced semiconductor manufacturing technology from Intel in its ambitious Terafab project, a development that could mark a significant milestone in Intel's efforts...
    Thursday 23 April 2026
    LandMark sees profit soar 650% in 1Q26, secures deal for 5-year InP substrate supply
    Driven by strong artificial intelligence (AI) and silicon photonics (SiPh) demand, optical communications epitaxy manufacturer LandMark Optoelectronics reported a more than sixfold...
    Thursday 23 April 2026
    Samsung and SK Hynix race to upgrade China chip plants as NAND demand surges
    As the artificial intelligence boom reshapes global computing demand, the memory chip industry is entering a new phase of strain and restructuring — one in which both DRAM and...
    Thursday 23 April 2026
    TSMC to open Arizona packaging facility by 2029, signals caution on high-NA EUV
    TSMC is accelerating its advanced packaging expansion in the US while maintaining a conservative stance on next-generation lithography, as the company balances cost pressures, AI-driven...
    Thursday 23 April 2026
    Qualcomm mulls return to Samsung's 2nm as TSMC targets its LPU market
    Global semiconductor leaders are accelerating the restructuring of their supply chains. Qualcomm CEO Cristiano Amon recently made a quiet, low-profile visit to South Korea, signaling...
    Thursday 23 April 2026
    Japan's LSTC launches optoelectronic advanced packaging project around Rapidus cluster
    Research on optoelectronic integration — referring to the application of optical communication technology to computing — is gaining momentum. Its semiconductor packaging...
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    biz
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook