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    Compal lifts profit on AI PCs and servers as component costs rise
    13min ago
    Chinese analog chipmaker Novosense returns to profit on AI server, auto demand
    14min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Thursday 6 August 2026
    Samsung pitches 5nm as HBM4, Nvidia orders push 4nm lines to full capacity
    Samsung Electronics' foundry arm is stepping up sales of its 5nm process as its more advanced 4nm capacity is expected to remain fully booked through 2027, driven by HBM4 base-die...
    Thursday 6 August 2026
    Apple's CXMT play reportedly backfires on DUV limits, giving Samsung and SK Hynix more DRAM leverage

    Apple's attempt to use China's ChangXin Memory Technologies (CXMT) as leverage against Samsung Electronics and SK Hynix has backfired...

    Thursday 6 August 2026
    SpaceX earnings strengthen Win Semiconductors' outlook for satellite-driven GaN demand

    SpaceX's first quarterly earnings release has offered fresh evidence that Starlink's expansion is moving beyond subscriber growth and...

    Thursday 6 August 2026
    Machvision July revenue hits record as AI and PCB demand strengthens
    Machvision reported consolidated revenue of about NT$359 million (US$11.1 million) in July 2026, a record monthly high that was up 1.28% from June and 31.84% from a year earlier. The...
    Thursday 6 August 2026
    Sandisk leans on multi-year supply deals as it bets on AI-driven NAND supercycle
    Sandisk closed its fiscal 2026 with record revenue, gross margin, and earnings per share. Still, the bigger story for investors is how much of the company's future business is now...
    Thursday 6 August 2026
    WD points to HAMR ramp and long-term contracts as pricing power builds
    At its fiscal fourth-quarter 2026 earnings call on August 5, Western Digital (WD) laid out a near-term growth strategy centered on higher-capacity hard disk drives and multiyear customer...
    Thursday 6 August 2026
    Sandisk's data center pivot drives record quarter as AI-fueled NAND shortage reshapes storage market
    Sandisk reported fiscal fourth-quarter and full-year 2026 results on August 5 that underscore how thoroughly artificial intelligence (AI) demand has reshaped the NAND flash memory...
    Thursday 6 August 2026
    WD posts record fiscal fourth quarter as AI-driven demand for high-capacity drives accelerates
    On August 5, Western Digital (WD) closed its fiscal 2026 with a fourth quarter that underscored how thoroughly artificial intelligence buildouts have reshaped the hard-disk-drive (HDD)...
    Thursday 6 August 2026
    FOPLP leads production as CoPoS advances glass packaging
    AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
    Thursday 6 August 2026
    DRAM price surge lifts Samsung and Micron as SK Hynix loses share
    Samsung Electronics and Micron Technology are benefiting more strongly from rising conventional DRAM and NAND prices than SK Hynix, whose focus on high-bandwidth memory (HBM) has slowed...
    Thursday 6 August 2026
    Interview: Ayar Labs CEO sees CPO scale-up volumes rising in 2028-2029
    The 2026 Open Compute Project (OCP) APAC Summit will be held in Taipei on August 11-12, bringing together global cloud service providers (CSPs), semiconductor firms, silicon photonics...
    Thursday 6 August 2026
    GlobalWafers says AI demand is lifting utilization and new LTA talks are underway
    GlobalWafers said semiconductor demand has rebounded as AI and high-performance computing applications expanded, keeping its factories highly utilized and prompting a new round of...
    Wednesday 5 August 2026
    Infineon sees AI demand outpacing supply as customers lock in long-term capacity

    Infineon said demand for its AI data center power semiconductors continues to exceed available supply, prompting leading customers to sign...

    Wednesday 5 August 2026
    Samsung, SK Hynix expansion puts Korea's chip supply chain to the test

    Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second...

    Wednesday 5 August 2026
    SK Hynix to hold late-August groundbreaking for US$3.9 billion Indiana chip packaging plant
    SK Hynix plans to hold a formal groundbreaking ceremony in late August for its US$3.9 billion advanced chip packaging facility in West Lafayette, Indiana, as the memory maker expands...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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