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    Shanghai HiSilicon expands DDI push across all display sizes
    4h 53min ago
    Applied Materials CEO outlines a trio of innovation priorities for AI chip race
    4h 53min ago
    China’s domestic AI chips target 3D packaging, optical interconnects and software ecosystems
    4h 53min ago
    AI accelerator growth shifts toward value, not volume
    4h 53min ago
    Analysis: China’s EV exports shift from volume to value as rebates shrink
    4h 54min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Friday 2 October 2026
    JCET Group partners with Wuxi to advance 2.5D advanced packaging facilities
    JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
    Friday 2 October 2026
    DIGITIMES Insight: Intel, TSMC, Samsung converge on backside power — packaging becomes the next divide
    Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
    Friday 2 October 2026
    Micron expands global fabs, calls on Taiwanese suppliers to go overseas
    AI-driven memory demand is surging, and Micron has recently accelerated capacity expansion across multiple regions worldwide, including Taiwan, the US, Japan, Singapore, and India...
    Friday 2 October 2026
    Micron eyes NVHBM profits with TSMC custom HBM push
    Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...
    Friday 2 October 2026
    Commentary: Broadcom's US$42 billion Anthropic loan exposes AI's emerging chip-financing loop
    When the underlying economics of infrastructure commitments meet the financing muscle of the companies supplying foundational compute, the traditional boundary between supplier and...
    Friday 2 October 2026
    China chip talent tensions surface in Cambricon's US$4.15 billion ex-CTO dispute

    Cambricon Technologies' equity dispute with former deputy general manager and chief technology officer Liang Jun has escalated sharply, with Liang...

    Friday 2 October 2026
    JSR completes South Korean EUV facility as Japanese suppliers localize next-gen resists
    JSR Micro Korea, the local subsidiary of Japan-based JSR, officially completed construction of a new semiconductor materials plant on September 30 in the Ochang Foreign Investment...
    Friday 2 October 2026
    TSMC, NTU deepen R&D ties through nearly 50 projects a year
    National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...
    Friday 2 October 2026
    Advanced packaging race expands beyond chipmakers as display, materials, equipment suppliers chase new footholds
    The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED...
    Friday 2 October 2026
    Hygon, Sugon deepen integration under one chairman after US$17.3B merger collapse

    Chinese AI chipmaker Hygon Information Technology has appointed Jun Li as its new chairman following a recent board reshuffle. Li only took over...

    Friday 2 October 2026
    Japan power semiconductor deal stalls as Rohm, Toshiba, Mitsubishi haggle
    Japan's three major power semiconductor makers — Rohm Semiconductor, Toshiba, and Mitsubishi Electric — have failed to complete integration talks on the original schedule,...
    Friday 2 October 2026
    Southern Taiwan Science Park approves three new companies, pushing 2026 investment over NT$100 billion
    The Southern Taiwan Science Park (STSP) has approved the entry of three new companies—Fangsco, Nanya Technology, and South Korea's Hansol Chemical—pushing the park's cumulative...
    Friday 2 October 2026
    Onsemi revises Synaptics takeover deal after rival bid
    Onsemi has amended its agreement to buy Synaptics in an all-cash deal, a move that could reshape semiconductor competition and affect global technology supply chains. The revised cash...
    Friday 2 October 2026
    Nanya Technology wins approval for Southern 3D packaging plant
    The Science Park Review Committee under Taiwan's National Science and Technology Council (NSTC) approved 13 investment projects at its 35th meeting on the 1st, including Nanya Technology's...
    Friday 2 October 2026
    CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era
    Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note...
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