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Friday 13 March 2026
Innolux posts small 2025 profit during ongoing factory sale drama
Panel maker Innolux posted a small profit in 2025, but compared with its earnings performance, the "factory sale drama" that has drawn market attention is escalating. In addition to...
Friday 13 March 2026
GlobalWafers sees 1Q26 silicon wafer prices bottoming as global capacity boosts revenue
GlobalWafers chairman Doris Hsu said rising adoption of artificial intelligence (AI) and high-performance computing (HPC) is sustaining long-term demand for advanced 12-inch silicon...
Friday 13 March 2026
Taiwan PCB output reaches $43B in 2025, TPCA says
The Taiwan Printed Circuit Board Association (TPCA) held its annual member meeting, where chairman Lawrence Chang announced projections for the industry through 2026. The announcement...
Friday 13 March 2026
FOCI targets CPO with automated lines, eyes revenue surge in 3 years
Fiber Optic Communications Inc. (FOCI) is deploying high-precision automated production lines for fiber array units to accelerate the production of co-packaged optics products and...
Friday 13 March 2026
Flexium eyes 30% revenue from AI servers and smart glasses in 2026
After a challenging 2025, flexible printed circuit (FPC) giant Flexium Interconnect is optimistic about its revenue and profit outlook, driven by accelerated transformation in high-speed...
Friday 13 March 2026
Samsung targets 2nm process for HBM4E base die to boost AI chip edge
Samsung Electronics is reportedly planning to adopt a 2-nanometer (nm) process for the base die of its next-generation high-bandwidth memory (HBM), HBM4E, aiming to enhance its technological...
Friday 13 March 2026
Monthly Chart: memory surge vs logic slump creates polarized February in Taiwan

The Taiwanese semiconductor sector reported a starkly bifurcated performance for February 2026, as a massive cyclical rebound in the memory market...

Friday 13 March 2026
Apple's Mac Neo gambit: when volume alone can't hold the TSMC crown
The semiconductor landscape is undergoing a fundamental shift, moving from a mobile-first volume game to an AI-driven value competition.
Thursday 12 March 2026
UMC, HyperLight to mass-produce TFLN photonics chiplets for AI data centers
United Microelectronics Corporation (UMC) has partnered with startup HyperLight to mass-produce thin-film lithium niobate (TFLN) chiplets, aiming to improve data transmission speeds...
Thursday 12 March 2026
Semco seen supplying ABF substrates for Tesla AI chips via Samsung foundry
Samsung Electro-Mechanics (Semco) is expected to supply ABF substrates for Tesla's next-generation artificial intelligence chips that Samsung Electronics plans to manufacture at its...
Thursday 12 March 2026
Nvidia expands GPU market share as AIB shipments rise despite increased costs
Nvidia strengthened its dominance in the add-in-board (AIB) GPU market in the fourth quarter of 2025, capturing a record 94% market share even as overall shipments dipped amid rising...
Thursday 12 March 2026
Ardentec launches ASIC wafer test collaboration; new Longtan capacity to be ready by 2H26
Semiconductor testing firm Ardentec is optimistic about its future operations, driven by sustained strong orders in communication applications. The company expects a resilient first...
Thursday 12 March 2026
Middle East conflict rattles energy markets, squeezes IC distributors
The ongoing Middle East conflict is disrupting global oil and natural gas supplies and triggering an energy crisis that has pushed up international crude prices. Market expectations...
Thursday 12 March 2026
Middle East conflict raises helium supply risks for South Korean chipmakers
Samsung Electronics and SK Hynix are reviewing their helium supply strategies as tensions in the Middle East disrupt key logistics routes, raising concerns over the availability of...
Thursday 12 March 2026
Samsung reportedly wins foldable iPhone DRAM supply deal; 12GB LPDDR5X prices double
Samsung has reportedly secured an order to supply 12GB LPDDR5X DRAM for Apple's first foldable iPhone, negotiating a sharply higher price than in previous memory contracts.