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Wednesday 10 September 2025
Advanced packaging battle intensifies as foundry, OSAT, and PCB sectors enter tripartite era
Driven by the growing demands of artificial intelligence (AI) and hyperscalers, advanced process technologies are accelerating innovation cycles. The supply chain indicates that in...
Wednesday 10 September 2025
NXP taps former TI China chief to steer Greater China amid rising competition
NXP Semiconductors has appointed Sandy Hu, a 25-year semiconductor veteran and former TI China president, as senior vice president of sales and marketing for Greater China. She will...
Wednesday 10 September 2025
Taiwan pushes immersion cooling, CoWoS tech into US AI server supply chain
Taiwan's Ministry of Economic Affairs has approved a NT$250 million (US$8.2 million) project spearheaded by Aewin Technologies, Kenmec Mechanical Engineering, and I-Chiun Precision...
Tuesday 9 September 2025
DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk

China's BOE Technology is moving to diversify Apple's iPhone display driver IC (DDI) supply chain, a shift that threatens South Korea's...

Tuesday 9 September 2025
TSMC and ASE form 3D IC alliance with 34 members to overcome advanced packaging bottlenecks
To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established...
Tuesday 9 September 2025
Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift
Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure...
Tuesday 9 September 2025
Kemflo International expands into activated carbon regeneration for semiconductor industry
Kemflo International has completed its activated carbon regeneration plant in Pingtung and is moving forward with environmental certification and licensing as it shifts focus toward...
Tuesday 9 September 2025
Czech Minister of Research and Innovation visits Taiwan; NSTC highlights complementary technologies
Czech Minister for Science, Research and Innovation Marek Ženíšek recently visited Taiwan to meet with National Science and Technology Council (NSTC) minister Cheng-wen...
Tuesday 9 September 2025
RongSemi denies fab halt as YMTC Veteran takes key role in Ningbo expansion
Simon Yang, the former YMTC CEO and later deputy chairman, has joined Rong Semiconductor (Ningbo) Co. (RongSemi) as head of its technical expert committee. The announcement came alongside...
Tuesday 9 September 2025
Malaysian IC design house Oppstar and Inventec to develop AI chips together
Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with...
Tuesday 9 September 2025
Over 50 Taiwan IC design houses compete for govt subsidies
The government has long provided research and development subsidies to share the risks of innovation among manufacturers, a key strategy driving Taiwan's industry. As many as 53 companies...
Tuesday 9 September 2025
HBM race intensifies: Micron’s yield confidence fuels supply chain bets
The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position...
Tuesday 9 September 2025
Samsung to double GDDR7 output following Nvidia B40 order
Nvidia has reportedly placed an order with Samsung Electronics for GDDR7 graphics memory, with the supply volume doubling compared to previous orders. Samsung's GDDR7 was previously...
Tuesday 9 September 2025
L&T Semiconductor Technologies acquires Fujitsu General Electronics' power module design assets
India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics...
Tuesday 9 September 2025
Globalwafers chief warns materials, not process nodes, will decide chip industry's future
Speaking ahead of SEMICON Taiwan 2025, Globalwafers chairperson Doris Hsu said competition in semiconductors is shifting from process nodes and capacity to control of critical materials...