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    Alibaba’s Zhenwu V900 and Huawei’s Ascend 960 move ahead, narrowing Nvidia’s compute gap
    1h 11min ago
    Qualcomm expands flagship SoC lineup to give OEMs more flexibility
    1h 11min ago
    United Renewable Power plans US plant, expands overseas sales and space solar business
    1h 11min ago
    Trump policies heighten US auto industry fears over Chinese EV makers
    1h 11min ago
    Interview: IMAPS chairman says TSMC’s CoWoS was a key lesson in advanced packaging
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    NEWS TAGGED CHIPS + COMPONENTS
    Tuesday 15 September 2026
    Interview: Corning sees CPO, glass core as new semiconductor battlegrounds

    As artificial intelligence applications accelerate, surging global semiconductor demand is pushing advanced packaging, co-packaged optics...

    Tuesday 15 September 2026
    Micron's record Taiwan payout fails to end union demand for 15% of profits
    Micron Technology's Taiwan union is pressing for a permanent profit-sharing formula despite the US memory chipmaker announcing its largest employee rewards package to date, leaving...
    Tuesday 15 September 2026
    Beyond H100: China's GPU makers chase scale, not just parity

    China's domestic GPU industry is entering a tougher phase: matching high-end accelerator performance is no longer enough. Vendors must...

    Tuesday 15 September 2026
    DIGITIMES Insight: AI sends the semiconductor market toward US$1.6T, with memory doing the heavy lifting
    DIGITIMES Intelligence forecasts the global semiconductor market will expand from US$791.7 billion in 2025 to US$1.6 trillion in 2026, representing year-on-year growth of 109.1%.
    Tuesday 15 September 2026
    China elevates HBM and HBF in five-year plan, opening a new front in AI memory
    China's Ministry of Industry and Information Technology (MIIT) and National Development and Reform Commission (NDRC) have jointly released the 15th Five-Year Plan for the Development...
    Tuesday 15 September 2026
    Samsung's Cheonan plant reallocates packaging capacity from Exynos to HBM
    Samsung Electronics is accelerating the restructuring of its semiconductor packaging footprint. Its Cheonan facility is gradually phasing out packaging operations for the Exynos mobile...
    Tuesday 15 September 2026
    Global semiconductor revenue hits record US$425B in 2Q26
    Global semiconductor revenue reached a record US$425 billion in the second quarter of 2026, surging 31.4% quarter-over-quarter, as AI demand and strong memory pricing continued to...
    Tuesday 15 September 2026
    Samsung, SK Hynix diverge on cell design for sub-10nm DRAM in 2028

    Samsung Electronics and SK Hynix are preparing to move DRAM below the 10nm threshold in 2028, with the two memory makers pursuing different...

    Tuesday 15 September 2026
    GlobalWafers partially resumes Italy plant, restarts EPI production
    GlobalWafers announced on September 14 that recovery work is continuing at its Novara plant in Italy following a fire that broke out on the facility's 8-inch line on July 20, 2026,...
    Tuesday 15 September 2026
    Sivers Semiconductors positions laser arrays as solution to copper's limits

    At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

    Tuesday 15 September 2026
    AI server tracker: CCL makers outpace PCB and substrate suppliers as server demand grows
    Taiwan's copper-clad laminate (CCL) makers significantly outpaced printed circuit board (PCB) and IC substrate suppliers in August, as stronger server demand, pricing and product-mix...
    Tuesday 15 September 2026
    TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
    TSMC's 3nm, 2nm, and CoWoS advanced packaging capacity remained in short supply in late 2026's third quarter, as changes in major customer orders and front-end and back-end supply...
    Tuesday 15 September 2026
    Chinese chip tools reach 35% of equipment installed at local fabs
    Chinese-made semiconductor equipment accounted for roughly 35% of tools installed at fabs in China in 2025, up from about 25% a year earlier, as domestic suppliers gain ground in key...
    Tuesday 15 September 2026
    Inside CIOE: takeaways from China's biggest optoelectronics show
    Last week, from September 9 to 11, thousands of vendors gathered for an enormous trade show in the Chinese tech hub of Shenzhen. At the China International Optoelectronic Expo (CIOE),...
    Tuesday 15 September 2026
    XPeng's Turing chip expands beyond cars
    XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical...
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    Macronix Secure Memories Build Hardware Defenses for EU CRA
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    GUC Announces 2nm 16 Gbps HBM4E IP
    Tuesday 22 September 2026
    AI Drones Advance Industrial Inspection, Suntek Unlocks New Market Opportunities
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