AI data center demand for LPDDR5X DRAM has continued to expand through 2026 and is expected to remain strong into 2027, tightening supply for PCs and smartphones and keeping device...
Samsung Electronics is reportedly seeking 2027 prices for its next-generation high-bandwidth memory (HBM) that are more than three times the price of its current HBM3E product, industry...
Samsung Electronics plans to buy DRAM from Taiwan's Winbond Electronics starting in 2027 and is considering using it in about half of its televisions, South Korean publication The...
Micronex Technology plans to build a semiconductor lead-frame factory in Sanand, Gujarat, seeking to localize a packaging component as India expands its chip assembly and testing industry...
Applied Materials and BE Semiconductor Industries (Besi) are expanding their partnership to address the increasingly complex connections between AI chips, extending joint development...
Across the week, Taiwan-linked semiconductor groups and their partners continued expanding capacity, while AI demand, export controls, and financing structures shaped the industry...
As the number of AI computing transistors integrated within a single CoWoS package rises rapidly, DIGITIMES observes that moving massive volumes of data to compute chips fast...
As AI develops rapidly across both cloud and edge environments, major chipmakers are devoting less attention to chip specifications and more to system-level design and ecosystems....
Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...
This excerpt from DIGITIMES analyst Luke Lin's podcast looks at TSMC's rumored Texas expansion, Intel's 14A and 18A process debate, and Qualcomm's high bandwidth compute (HBC) push...
Elon Musk has confirmed that Terafab, the chipmaking venture backed by his SpaceX and Tesla, is in discussions with TSMC. The confirmation followed a report that the Taiwanese foundry...
While ASML executives explore how to scale extreme ultraviolet (EUV) lithography output beyond 110 units by 2028, China is pursuing indigenous advanced lithography systems. ASML plans...
Biren Technology is preparing its next-generation GPU for mass production, advancing a domestic AI accelerator roadmap built around broader low-precision support and locally available...
MediaTek announced on September 30 that its flagship Dimensity 9500 chip powers Samsung's new Galaxy Tab S12 Ultra and Galaxy Tab S12+ tablets. The deal continues a long-running partnership...
