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Thursday 27 August 2026
CXMT DDR5 closes in on SK Hynix at 8,000 MT/s, benchmark gap falls below 1%
CXMT is narrowing the performance gap with SK Hynix in high-speed DDR5 memory, with new benchmark tests showing CXMT chips running stably at 8,000 MT/s and delivering productivity...
Thursday 27 August 2026
CXMT lands early LPDDR6 opportunity with Xiaomi Xring O3, eyes China flagship phones
China's smartphone and memory supply chains are moving closer together, with Xiaomi's new Xring O3 processor potentially providing CXMT with an early commercial entry into the LPDDR6...
Thursday 27 August 2026
Analysis: From Starlink to Starmind, Nvidia deal reveals SpaceX's blueprint for an orbital AI economy
The recent disclosure of SpaceX's partnership with Nvidia to deploy Vera CPUs as part of the architecture behind SpaceXAI's Starmind AI satellite was an outright showcase of where...
Thursday 27 August 2026
AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp
Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
Thursday 27 August 2026
Google, MediaTek embrace advanced packaging diversification
Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
Thursday 27 August 2026
India's CG Power targets 70% utilization at larger semiconductor packaging plant
CG Power and Industrial Solutions is targeting 70% utilization at its larger semiconductor packaging facility within about four years, with the unit potentially generating around US$500...
Thursday 27 August 2026
Moody's lifts South Korea GDP forecast on hard-to-replace memory chips
Moody's has sharply raised its forecast for South Korea's 2026 economic growth to 3.5%, saying the country's semiconductor boom and export strength will last longer than expected and...
Thursday 27 August 2026
HTSI targets AI chip demand with SiPh, CPO, packaging push
Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...
Thursday 27 August 2026
Commentary: Nvidia bets on open models to lift GPU usage
Nvidia is aggressively expanding into open-source models and positioning itself as the world's largest open AI contributor, as CEO Jensen Huang reshapes the company from a supporter...
Thursday 27 August 2026
AI data center boom lifts Weltrend fan-control chip sales 64%
Weltrend Semiconductor said first-half 2026 revenue rose 28% from a year earlier to a record for the period, with growth driven almost entirely by cooling demand tied to AI data center...
Thursday 27 August 2026
Xiaomi's Xring O3, O100 and D100 define a three-tier AI chip strategy beyond smartphones
Xiaomi is expanding Xring from a smartphone chip program into a broader AI computing platform spanning consumer devices, vehicles, and edge inference, with three processors assigned...
Thursday 27 August 2026
Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

Thursday 27 August 2026
China's foundries have won the mature-node argument, not the self-sufficiency one
China's contract chipmakers spent the first half of 2026 proving something narrower than the headlines suggest. They demonstrated that domestic fabs can run at full capacity, raise...
Thursday 27 August 2026
Ligitek skips 800G, targets 1.6T silicon photonics
Ligitek Electronics, a Taiwan-based LED packaging maker, has expanded in recent years into semiconductor system-in-package (SiP) and silicon photonics. The company said AI-related...
Thursday 27 August 2026
Samsung Galaxy A1 DDI packaging shifts to Chipbond
Rising gold prices are squeezing Samsung Electronics' entry-level smartphone supply chain, with South Korean media reporting that back-end packaging and testing orders for display...