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Saturday 16 August 2025
SK Hynix expands EUV in 1c DRAM, launches faster low-power chips for AI PCs

SK Hynix is stepping up its use of extreme ultraviolet (EUV) lithography in next-generation DRAM, increasing the number of EUV layers...

Friday 15 August 2025
Weltrend sees strong 2025 growth on AI server cooling chip demand
Weltrend Semiconductor projects strong double-digit revenue growth in 2025, fueled by rising demand for motor driver ICs in AI server cooling systems and an improving product portf...
Friday 15 August 2025
GlobalFoundries folds MIPS into AI, edge computing ambitions
GlobalFoundries (Nasdaq: GFS) has finalized its acquisition of MIPS, a US-based supplier of AI and processor IP, in a bid to fortify its position in differentiated semiconductor manufacturing...
Friday 15 August 2025
China's CXMT resumes big-ticket chip investments to expand DDR5, fast-track HBM3 output
ChangXin Memory Technologies (CXMT) has restarted major facility investments to ramp up DRAM output and fast-track high-bandwidth memory (HBM) development, highlighting Beijing's...
Friday 15 August 2025
Tariff exemption for semiconductors and ICT products prioritized in negotiations for Taiwanese government
The US government, under Section 232 of the Trade Expansion Act, has imposed tariffs on imports such as steel and aluminum products, automobiles, auto parts, and copper products,...
Friday 15 August 2025
Apple is seen gaining tariff exemption as Samsung faces 25% levy threat, potentially reshaping global smartphone market
The US government is expected to announce its tariff policy this week on semiconductor-related products—including smartphones, laptops, and surveillance devices—sending...
Friday 15 August 2025
Can Tesla's chip shift uplift Samsung foundry services?
Over the past two weeks, Tesla CEO Elon Musk has promoted his company's new partnership with Samsung Foundry for manufacturing its AI chips. At one point, South Korean media speculated...
Friday 15 August 2025
Minebea Mitsumi raises Shibaura Electronics tender offer, matching Yageo's bid
Minebea Mitsumi has increased its tender offer bid (TOB) for shares of Shibaura Electronics to JPY6,200 (US$41.99) per share, matching the bid made by Taiwanese company Yageo Corporation...
Friday 15 August 2025
Taiwan's motor driver IC makers capture AI server market share
Taiwan's IC design houses are seeing steady returns from years of investment in motor driver ICs, with demand rising across a wider set of applications and competition intensifying...
Friday 15 August 2025
China pushes back against Nvidia H20 chip exports amid US trade tensions
Chinese authorities have recently voiced concerns about the reauthorization of shipments for Nvidia Corporation's H20 AI chips, highlighting fears that these chips could be remotely...
Friday 15 August 2025
Commentary: China's chip equipment underdog stands up to Applied Materials as local substitution wave rises
Beijing E-Town Semiconductor Technology has sued US chipmaking equipment leader Applied Materials in a Chinese court, seeking nearly CNY100 million (approx. US$13.9 million) in damages...
Friday 15 August 2025
Taiwanese firms secure M9-grade CCL certifications as ASIC server demand surges
In response to the global surge in large-scale AI computing power deployment, the usage and value of PCBs for AI servers have significantly increased. High-end copper-clad laminate...
Friday 15 August 2025
Samsung plays the long game on DDR4 as rivals exit for DDR5
Samsung Electronics is again at the center of speculation over a potential end to DDR4 DRAM production, as fresh industry reports indicate it may keep the older-generation memory...
Friday 15 August 2025
Fire at Kanto Denka Kogyo in Japan raises concerns over semiconductor supply chain disruption
A fire broke out early on August 7, 2025, at the nitrogen trifluoride (NF3) plant of Japanese industrial gas manufacturer Kanto Denka Kogyo in Shibukawa City, Gunma Prefecture. The...
Friday 15 August 2025
Exclusive: TSMC primes CoPoS supplier network for Chiayi, US fabs ahead of 2028 ramp
TSMC is pushing its advanced packaging roadmap beyond its CoWoS platform and the wafer-level multi-chip module (WMCM) — an enhanced InFO-PoP due in 2026 — with a new integration...