China's power semiconductor makers are lifting prices again as demand from artificial intelligence (AI) servers and new energy vehicles strengthens. The moves may signal a broader...
Compound semiconductor epitaxial wafer maker IntelliEPI said AI-driven high-speed transmission demand continues to lift the indium phosphide (InP) market, and it expects revenue to...
Kioxia is preparing to enter the US capital market through American depositary shares (ADS) in the first quarter of fiscal 2027, just as its latest annual report points to accelerating...
The European Commission has given the green light to a EUR76 million (approx. US$86.3 million) German subsidy supporting QuantumDiamonds' plan to build a new semiconductor testing...
Hua Hong Grace Semiconductor (HHGrace) is seeing gains from both process technology and capacity expansion, with industry research showing its 40nm ultra-low-power specialty process...
Sigurd is expanding testing and packaging capacity as AI demand and steady customer orders keep its facilities fully utilized. For global readers, the move underscores how supply chains...
AI chipmaker SambaNova could raise between US$800 million and US$1 billion in a new funding round, according to its executive chairman and Intel CEO Lip-Bu Tan. This would raise SambaNova's...
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company...
ADATA Technology is stepping up discussions in Thailand amid rising global demand for AI computing centers. Chairman Simon Chen's visit highlights how Southeast Asia could benefit...
Optical lens manufacturer Calin Technology stated at its shareholders' meeting on June 24 that global market growth has been weakened by economic volatility and US tariff policies...
Micron Technology is turning the AI memory boom into a new Wall Street story: not just record DRAM, NAND and HBM demand, but stronger free cash flow, long-term customer commitments...
Micron Technology expects the global memory market to remain supply-constrained beyond 2027, driven by surging artificial intelligence demand and structural limits on new manufacturing...
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...
