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Friday 3 April 2026
Taiwan tackles CPO testing bottlenecks to scale SiPh for AI data centers
The surge in AI computing power is driving explosive demand for high-speed optical interconnects in data centers. Forecasts show that by 2026, over 50% of data center transceiver sales...
Friday 3 April 2026
Memory stocks rattled by TurboQuant, but demand outlook holds
Google Research's TurboQuant memory-compression algorithm has raised concerns that demand for AI-related memory could weaken, but South Korean experts and analysts say the market reaction...
Thursday 2 April 2026
IBM and Arm collaborate on dual‑architecture hardware to broaden enterprise AI deployment
IBM and Arm announced a collaboration to build dual‑architecture hardware aimed at running AI and data‑intensive workloads with more flexibility, reliability, and security,...
Thursday 2 April 2026
Copper price surge drives quarterly lead frame price hikes
Lead frame packaging suppliers are hiking prices to pass along rising costs sweeping through the semiconductor supply chain. Gold, silver, and copper prices continue to climb sharply,...
Thursday 2 April 2026
South Korea reportedly advances GaAs localization with 95% yield on 4-inch process
South Korea is moving closer to localizing high-performance compound semiconductor components long reliant on imports after achieving a key manufacturing milestone, according to ET...
Thursday 2 April 2026
Samsung reportedly supplies Exynos modem chips to Fibocom for 5G module mass production
Samsung Electronics has supplied its Exynos modem chipset to Chinese wireless module maker Fibocom, marking a notable expansion of its system semiconductor business into external clients,...
Thursday 2 April 2026
South Korea exports hit record US$86bn, chip demand drives breakout above US$80bn
South Korea's exports climbed to a record US$86.1 billion in March 2026, marking the first time monthly shipments have exceeded the US$80 billion threshold, even as the Middle East...
Thursday 2 April 2026
Intel expands SambaNova stake, governance questions surface

Intel plans to invest a further US$15 million in AI chip startup SambaNova Systems, lifting its stake to about 9% pending regulatory...

Thursday 2 April 2026
Asahi Kasei enters AI chip fiberglass market to challenge Nittobo's dominance
Japan's Asahi Kasei has announced its official entry into the AI chip supply chain with fiberglass cloth as an insulating substrate material, targeting the current global leader Nittobo,...
Thursday 2 April 2026
Samsung ramps Texas fab as engineers gather for 2nm push

Samsung Electronics has reportedly moved into the equipment installation and testing phase at its foundry in Taylor, Texas, transitioning...

Thursday 2 April 2026
Topco maintains stable shipments despite Middle East conflict, builds safety stock as AI demand accelerates
As the US-Iran conflict enters its second month, concerns are mounting over potential disruptions to global energy supplies and petrochemical feedstocks. Against this backdrop, Jeffery...
Thursday 2 April 2026
Ajinomoto faces stakeholder pressure to raise ABF prices
UK-based fund Palliser Capital announced on March 31 that it has become one of the top 25 shareholders of Ajinomoto and has requested a price increase of more than 30% for its semiconductor...
Thursday 2 April 2026
Nvidia invests US$2 billion in Marvell to integrate NVLink Fusion with ASICs
On March 31, Nvidia announced a US$2 billion investment in Marvell and plans to further integrate its NVLink Fusion technology with Marvell's XPU services for customer use. Although...
Thursday 2 April 2026
Samsung, SK Hynix reportedly ramp hybrid bonding push for next-gen HBM

Samsung Electronics and SK Hynix are reportedly stepping up efforts to advance hybrid bonding for next-generation high-bandwidth memory...

Thursday 2 April 2026
TSMC's US expansion held ransom as JASM takes flight
TSMC is winning quietly in Japan and losing loudly in Washington — and the reason may have nothing to do with chips.