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NEWS TAGGED CHIPS + COMPONENTS
Wednesday 16 September 2026
Kepler bets HBM can scale without EUV — chip giants are buying in

US memory chip startup Kepler Computing has emerged from stealth after seven years, disclosing US$468 million in total funding and a...

Wednesday 16 September 2026
Astera says customers are rethinking HBM needs for AI accelerators

AI infrastructure customers are starting to reconsider how much high-bandwidth memory (HBM) needs to be placed alongside accelerators...

Wednesday 16 September 2026
AI efficiency fuels Jevons Paradox debate over HBM demand
As artificial intelligence (AI) models move from answering questions to autonomously completing multi-step tasks, OpenAI's new model GPT-6 Astra, or Astra, is drawing fresh market...
Wednesday 16 September 2026
Altera confidentially files for US IPO as AI chip demand fuels listing boom

Altera, the programmable-chip maker backed by Silver Lake and Intel, has confidentially filed for an initial public offering (IPO) in the...

Wednesday 16 September 2026
MediaTek keeps Dimensity 9600 Pro on HBPoP as cost drives decisions

MediaTek officially unveiled the Dimensity 9600 Pro on September 15, 2026, drawing significant industry attention to its choice of packaging...

Wednesday 16 September 2026
Apple, Intel links sharpen focus on Lens Technology's next glass growth markets
Lens Technology is pushing its precision-glass expertise into two higher-value markets that could reshape its growth profile: Apple-linked foldable devices and Intel-linked through-glass-via...
Wednesday 16 September 2026
US-based Teradyne opens Bengaluru office to support India's semiconductor push
Teradyne has opened a new office in Bengaluru as India expands its chipmaking ambitions, which could affect supply chains, pricing, and manufacturing capacity worldwide. The move gives...
Wednesday 16 September 2026
Advanced processes have no ready-made answers, says TSMC's COO

Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer Y.J. Mii participated in the "Cross-Generational...

Wednesday 16 September 2026
Interview: Forget transistors — speed is what's choking the chip supply chain, says Qnity exec
The global surge in AI demand is accelerating change across the semiconductor industry, and as Moore's Law scaling faces physical limits, chipmaking is no longer only about shrinking...
Wednesday 16 September 2026
Novel 2D materials offer quantum breakthroughs as research ecosystem targets sub-1nm era
Taiwan's National Science and Technology Council (NSTC) is accelerating efforts to advance chip manufacturing beyond the 1nm node, targeting key breakthroughs in next-generation materials,...
Wednesday 16 September 2026
Beyond 2nm: Dimensity 9600 Pro gives MediaTek a bigger role in mobile AI
MediaTek has officially launched the Dimensity 9600 Pro, introducing a major architectural overhaul for its 2026 flagship mobile chip. Beyond the shift to a 2nm process, the new platform...
Wednesday 16 September 2026
Samsung reportedly taps TSMC for custom HBM base dies as new foundry dynamics emerge

The logic die at the bottom of a high-bandwidth memory (HBM) stack has become the semiconductor industry's newest contested territory...

Wednesday 16 September 2026
FSC teams with South Korean maker on TGV equipment for glass substrates
Fu Chun Shin Machinery Manufacture (FSC), a major plastic injection molding machine maker, is expanding further into semiconductors by teaming up with Korean-Chinese joint venture...
Wednesday 16 September 2026
A Taiwan machinery maker bets on AI to challenge Japan's grip on advanced capacitors
High-end multilayer polymer capacitors (MLPCs) — increasingly critical to power delivery in AI servers and high-wattage GPUs and CPUs — have historically been dominated...
Wednesday 16 September 2026
South Korean NPU startups face validation hurdle in push for global sales

South Korea's neural processing unit (NPU) startups are moving from chip development toward commercial deployment, but limited experience...