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Tuesday 6 October 2026
Qualcomm says Huawei patent deal not tied to LogicFolding, rejects net-payer claims
Correction, Oct. 6, 2026: An earlier version of this story, citing Bloomberg, reported that Qualcomm had agreed to license patents related to Huawei's LogicFolding...
Tuesday 6 October 2026
TSMC expansion pushes Da Yi Cheng Technology's orders over NT$10 billion, visibility through 2028
Da Yi Cheng Technology (DYC) has rapidly expanded in recent years, benefiting from the global semiconductor capacity expansion wave, which has driven demand for second-phase electrical...
Tuesday 6 October 2026
HBM4 prices to nearly triple in 2027, memory makers see windfall margins spread
Memory supply and demand will tighten further in 2027. According to supply chain sources, South Korean memory makers have recently quoted aggressive long-term contract prices for sixth-generation...
Tuesday 6 October 2026
MIPS deepens RISC-V ties with China despite US-China tech tensions
Despite intense technology competition between the US and China, cooperation between the two sides on the open-standard RISC-V architecture continues to deepen, with US intellectual...
Tuesday 6 October 2026
Nanya Technology, Winbond Electronics hit record highs for 10 consecutive months in September 2026
Taiwan memory suppliers Nanya Technology and Winbond Electronics have set new monthly revenue records for 11 and 10 consecutive months, respectively, as their September 2026 consolidated...
Tuesday 6 October 2026
LB Semicon expands power chip capacity as Qualcomm production ramps up
South Korean outsourced semiconductor assembly and test (OSAT) provider LB Semicon is expanding power semiconductor backend capacity at its Gumi plant as it steps up efforts to reduce...
Tuesday 6 October 2026
Samsung ramps Exynos 2700 wafer production as second-gen 2nm rollout advances
Samsung Electronics has reportedly begun front-end wafer mass production of its next-generation Exynos 2700 mobile application processor, with production volume planned at more than...
Tuesday 6 October 2026
China's glass substrate ramp-up outpaces South Korea with WG Tech targeting 1M sqm
China's WG Tech has reportedly begun the second phase of investment in its through-glass via (TGV) glass substrate production line, with total future capacity projected to reach 1...
Tuesday 6 October 2026
Column: How semiconductors' evolution foretells the rise of AI data centers
Semiconductors and AI data centers share a striking number of similarities.
Tuesday 6 October 2026
Winbond, Phison bonuses signal fiercer memory talent war
Memory chip profitability has surged as core operations improve sharply, with some Winbond employees reportedly receiving NT$500,000 to NT$1 million (US$15,733.41–31,466.83)...
Monday 5 October 2026
Samsung opens Boston quantum design lab to expand US research push
Samsung Electronics has set up a Quantum Design Lab in the Boston area of Massachusetts and started hiring for it, marking a new phase in the company's push into quantum computing...
Monday 5 October 2026
Kyushu's chip expo expands as Japan adds a chip design focus
Japan's Kyushu Semiconductor Industry Exhibition, known as K-Semi, grew 36% at this year's edition in Fukuoka, held from September 30 to October 1, 2026, as chip makers expanded their...
Monday 5 October 2026
Southern Taiwan Science Park revenue climbs 36.5% in first eight months of 2026
Companies in the Southern Taiwan Science Park (STSP) posted record revenue of NT$2.495124 trillion (US$78.59 billion) in the first eight months of 2026, up 36.5% from a year earlier,...
Monday 5 October 2026
AMD's Lisa Su back in Taiwan as AI capacity crunch spreads beyond TSMC
AMD CEO Lisa Su arrived in Taiwan on October 5 for a lightning visit, less than five months after her May trip. No major public events are scheduled, but meetings with key suppliers...
Monday 5 October 2026
Bangkok floods disrupt logistics for Taiwan PCB makers in Thailand
Severe floods triggered by days of extreme rain in Thailand have paralyzed transport in Bangkok and several other areas, disrupting local auto and components supply chains and drawing...