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NEWS TAGGED CHIPS + COMPONENTS
Tuesday 28 April 2026
AI chip testing complexity lifts probe card and upstream supply chain demand
As AI chips move to advanced process nodes and packaging technologies, semiconductor testing requirements are becoming significantly more complex.
Tuesday 28 April 2026
AI lifts memory: SK Hynix hits 72% margin as Samsung nears 70%
SK Hynix reported record results for the first quarter of 2026, with operating margin reaching about 72% — among the highest globally — as artificial intelligence (AI)-driven...
Tuesday 28 April 2026
Moore Threads hits first profit, AI compute orders drive growth
China's domestic GPU developer Moore Threads is shifting from heavy R&D spending to early monetisation, delivering triple-digit revenue growth in 2025 and its first quarterly profit...
Tuesday 28 April 2026
Commentary: Tim Cook's sole omission during 15-year tenor
On December 6, 2022, Tim Cook stood on a construction site in Phoenix, Arizona, alongside President Biden, TSMC founder Morris Chang, and Nvidia CEO Jensen Huang. It was the tool-in...
Monday 27 April 2026
What Nvidia and Broadcom's CPO bets reveal about the future of AI infrastructure
The CPO market is projected to grow at a 142% CAGR from 2026 to 2030 (excl. ELS). As AI clusters scale and 3.2T data rates push copper to its limits, CPO is emerging as a key solut...
Monday 27 April 2026
DIGITIMES: Enterprise AI shifts toward inference as computing architectures undergo structural realignment

As enterprise adoption of generative AI accelerates, a new phase of infrastructure demand is beginning to take shape. According to...

Monday 27 April 2026
Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
Monday 27 April 2026
Thailand's PCB industry moves upmarket, local supply gaps persist

Thailand is fast emerging as a critical hub for high-end electronics manufacturing, as global supply chains shift and demand for AI computing...

Monday 27 April 2026
TSMC trade secret theft ends in 10-year sentence, $4.6M fine against Tokyo Electron
A Taiwanese court handed down its harshest ruling yet in a semiconductor trade secret case on Monday, sentencing a former TSMC engineer to 10 years in prison and fining Japanese equipment...
Monday 27 April 2026
Meta signs deal for AWS's Graviton CPUs as inferential and agentic AI enter the scene
Meta and Amazon announced on April 24 that Meta will use Graviton5 CPUs made by Amazon Web Services (AWS). The deal illustrates the growing importance of CPU chips for increasingly...
Monday 27 April 2026
Broadcom, Marvell set to benefit as 1.6T optical modules near mass production
1.6T optical communication modules are set for broad adoption in AI data centers in 2026, with optical transceiver vendors and key IC design houses preparing for shipments. Broadcom's...
Monday 27 April 2026
HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor...
Monday 27 April 2026
Denso weighs Rohm bid withdrawal as support stalls

Japanese auto parts supplier Denso said on April 27 that it is considering all options, including withdrawing its acquisition proposal...

Monday 27 April 2026
ASE Technology spotlights 18 suppliers at the forefront of a trillion-dollar AI wave
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging...
Monday 27 April 2026
TSMC's refusal of ASML's expensive High-NA EUV equipment, explained
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first,...