SK Hynix is looking beyond its position as a leading supplier of high-bandwidth memory (HBM), using venture investments to gain a greater say in how next-generation AI infrastructure...
SK Hynix is reassessing how to finance the US manufacturing expansion of its NAND flash subsidiary Solidigm after shelving a potential initial public offering (IPO), as the South Korean...
Google's tensor processing unit (TPU) business has gained one confirmed and one reported major customer within a week, adding pressure on Nvidia, whose graphics processors still dominate...
SK Hynix is turning to high-bandwidth flash (HBF) to address growing memory bottlenecks in AI inference, as increasingly complex AI agents generate more data than can be economically...
Unimicron Technology is reshaping its global production footprint and steering resources toward Taiwan's higher-margin AI supply chain as surging AI and high-performance computing...
Taiwanese IC design leaders MediaTek, Realtek, and Parade Technologies will hold their third-quarter 2026 earnings conferences in succession this week, offering the market an early...
Micron Technology is heading to South Korea to recruit engineers for its Taiwan operations, with interviews scheduled in Seoul in late November, as a bonus dispute at its Taoyuan plant...
Anthropic recently disclosed details of its computing partnerships with Google, Amazon Web Services (AWS), Microsoft, Advanced Micro Devices (AMD), and other providers in its S-1 filing...
NXP Semiconductors' latest results point to a business gaining from more complex vehicle electronics and industrial computing, while its emerging data center operation offers another...
NXP Semiconductors is heading into 2027 with management arguing that its growth now rests on several structural drivers rather than a cyclical rebound. On the company's October 27...
SK Hynix's third quarter suggests that, for now, the memory industry's familiar boom-and-bust pattern is giving way to something closer to a contracted, supply-constrained business...
Major package substrate makers, including Samsung Electro-Mechanics (Semco), are concentrating capital spending on large, high-layer-count ABF substrates, while capacity expansion...
AI is driving a steady upward revision in chip demand, but semiconductor equipment shortages are not the biggest obstacle to expanding AI chip production, according to industry sources...
Chinese AI chipmaker Cambricon Technologies reported a 131.49% increase in net profit attributable to shareholders for the first nine months of 2026, while revenue more than doubled...
South Korean memory module substrate maker TLB has begun developing substrates for SOCAMM3, a next-generation low-power memory module for AI servers, with two major memory customers...
