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Wednesday 16 September 2026
Nvidia's Jensen Huang expected to attend Trump-Xi Summit as tech and trade take center stage
US President Donald Trump and Chinese President Xi Jinping are scheduled to meet on September 24 in Washington for a state dinner now dubbed the "G2 Summit". The meeting follows a...
Wednesday 16 September 2026
Samsung and Qualcomm jointly developing organic bridges for 2.1D packaging
Samsung Electro-Mechanics and Qualcomm are working together to develop an organic bridge for 2.1D packaging architectures. The partnership takes place as AI chips grow larger, denser,...
Wednesday 16 September 2026
SK Hynix union approves revised pay deal after 25-vote rejection

SK Hynix's production workers' union has approved a revised pay agreement that raises the cash share of employee profit-sharing bonuses,...

Wednesday 16 September 2026
TSMC's overseas expansion faces talent management gap, says co-COO Y.J. Mii
Taiwan Semiconductor Manufacturing Company (TSMC) chairman C.C. Wei and co-chief operating officer (co-COO) Y.J. Mii participated in the "Cross-Generational Dialogue: Questions and...
Wednesday 16 September 2026
SK Hynix, Intel in talks on US production to ease memory crunch
SK Hynix is in talks with Intel about a potential deal that could give the South Korean company its first memory chip manufacturing operation in the US, as tight supply pushes customers...
Wednesday 16 September 2026
Taiwan CCL makers ride Nvidia's M9 shift as AI servers move to 52-layer PCBs

Global cloud service providers are continuing to expand AI infrastructure, driving a surge in demand for high-frequency, high-speed...

Wednesday 16 September 2026
CPO ramp pushes silicon photonics testing upstream to catch defects early

As AI servers drive demand for higher-speed optical interconnects and co-packaged optics (CPO) moves toward volume production, silicon...

Wednesday 16 September 2026
Geckos sees copper paste as a lower-cost answer to shrinking glass via challenges

AI, high-performance computing, and advanced packaging are accelerating demand for glass substrates, but smaller through-glass vias...

Wednesday 16 September 2026
Samsung Exynos regains share as Galaxy phones test 2nm

Samsung Electronics' in-house Exynos application processors (APs) are steadily regaining lost ground in the global smartphone market...

Wednesday 16 September 2026
Samsung reportedly weighs Micron's newest memory for Galaxy S27
Samsung Electronics is reportedly testing Micron's most advanced 1γ LPDDR5X memory for possible use in the Galaxy S27 series, as rising costs around next-generation mobile DRAM...
Wednesday 16 September 2026
Apple reportedly accepts Samsung's 1Q27 memory hike, raising the 2027 smartphone cost floor
Apple's acceptance of sharply higher Samsung Electronics memory prices for early 2027 is putting a number on the cost of the AI boom for smartphones. The reported agreement comes just...
Wednesday 16 September 2026
Micron unveils 512GB DDR5 RDIMM for next-gen servers

Micron has demonstrated what it calls the world's first 512GB DDR5 registered dual in-line memory module (RDIMM) across multiple server...

Wednesday 16 September 2026
Samsung reportedly pushes conventional memory modules to partners in Vietnam and India as HBM crowds its back end
Samsung Electronics is reportedly handing the growth in its commodity memory module business to outside assemblers in Vietnam, India, and the Philippines, a sign of how completely...
Wednesday 16 September 2026
Glass substrates, TGV set to reshape 2027 advanced packaging race
As AI chip package sizes continue to expand, advanced packaging is moving up the technology ladder. Glass substrate and through-glass via (TGV) technologies have become a new competitive...
Wednesday 16 September 2026
Hanmi Semiconductor reportedly lands first back-end foothold at Terafab
Hanmi Semiconductor has reportedly secured an order to supply advanced packaging equipment to Elon Musk's Terafab, marking the first known entry by a South Korean back-end equipment...