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    ASML and Applied Materials enter advanced packaging, challenging South Korea's HBM edge
    6h 19min ago
    Samsung aims to boost foundry utilization rate to over 60% in first half of 2026
    6h 20min ago
    Samsung's Taylor fab reportedly orders South-Korean-made EUV pellicle equipment
    6h 20min ago
    Taiwanese firms remain cautious amid AI bubble debate
    6h 21min ago
    Europe's fuel engine phase-out challening with strict carbon regulations and talent lost to China
    6h 21min ago
    BOE production issues with iPhone OLED give Samsung Display chance to take over
    6h 21min ago
    Tesla's BEV moat faces challenges from Europe's depth and China's speed
    6h 21min ago
    TSMC and Samsung reduce 8-inch wafer capacity, but oversupply still remains
    6h 21min ago
    NEWS TAGGED CHIPS + COMPONENTS
    Thursday 15 January 2026
    Chinese AI startup Z.ai unveils first multimodal model trained on Huawei Ascend chips
    Chinese artificial intelligence startup Z.ai, formerly known as Zhipu AI, has unveiled GLM-Image, a multimodal AI model trained entirely on Huawei's Ascend chip platform, marking a...
    Thursday 15 January 2026
    Samsung shifts to advanced nodes, 8-inch foundry capacity reportedly cut
    Samsung Electronics plans to shut part of its 8-inch foundry capacity in South Korea, as the company reallocates resources toward more advanced manufacturing, according to a report...
    Thursday 15 January 2026
    TSMC retains pricing power using Apple and AI dual structure
    Generative AI is reshaping TSMC's customer structure. While Apple remains TSMC's largest single customer by revenue share, the rapid growth of high-performance computing (HPC) businesses...
    Thursday 15 January 2026
    TSMC's 4Q25 revenue surges 20.5% on advanced process demand
    Taiwan Semiconductor Manufacturing Company (TSMC) reported consolidated revenue of approximately NT$1.4609 trillion (US$46.21 billion) and net income after tax of about NT$505.74 billion...
    Thursday 15 January 2026
    South Korea's memory chip giants pivot back to capacity expansion

    As the global memory market enters a prolonged upcycle, South Korea's two leading memory chipmakers, Samsung Electronics and SK Hynix,...

    Thursday 15 January 2026
    PlayNitride teams up with Brillink to build optical interconnect platform
    As Micro LED moves into non-display application opportunities, PlayNitride Technologies announced a partnership with Brillink Technologies, a leader in two-dimensional array optical...
    Thursday 15 January 2026
    Maxscend's first annual loss exposes fab-lite strain and legal risks
    Maxscend Microelectronics is heading for its first annual loss since going public, marking a sharp reversal for one of China's leading RF chipmakers as it struggles with a costly business...
    Thursday 15 January 2026
    ASML CEO claims China's EUV lags by 8 gen ahead of 4Q25 earnings
    ASML, the Dutch semiconductor equipment leader and exclusive supplier of EUV lithography systems, is set to release its fourth-quarter 2025 and full-year financial results on January...
    Thursday 15 January 2026
    Memory supply bottlenecks to drive PC price hikes and spec reductions through 2027
    Global memory shortages are expected to continue until late 2027, leading to higher costs for PCs, tablets, and smartphones. In an interview with The Register, IDC research...
    Thursday 15 January 2026
    Hanmi Semiconductor leans into EMI shielding as satellite and 6G demand grows
    Hanmi Semiconductor has drawn industry attention in recent years for its thermal compression bonding equipment used in high-bandwidth memory production. As low-earth-orbit satellite...
    Thursday 15 January 2026
    Samsung reportedly files new HBM trademarks as HBM4 advances
    Samsung Electronics has reportedly filed a series of new trademarks related to high bandwidth memory as it advances preparations for its sixth-generation HBM4 products.
    Thursday 15 January 2026
    TSMC Arizona yields depend on Taiwan's on-site experts
    TSMC is known for strong performance and high yields in advanced chip manufacturing, supplying key customers such as Nvidia and Apple. But producing leading-edge semiconductors requires...
    Thursday 15 January 2026
    Foxconn-HCL semiconductor joint venture to be named India Chip Private Limited
    Electronics manufacturing services major Foxconn and India's HCL Group have formally named their semiconductor joint venture India Chip Private Limited, according to a regulatory filing...
    Thursday 15 January 2026
    Exclusive: T-Glass shortage ripples through memory and advanced packaging markets

    The global memory industry is confronting a growing capacity crunch, one that is increasingly rippling upstream to a shortage of glass...

    Thursday 15 January 2026
    Trump invokes Section 232 to levy 25% tariff on Nvidia H200, AMD MI325X chips
    On January 14, US President Donald Trump signed a proclamation invoking Section 232 of the Trade Expansion Act of 1962 to impose an immediate 25% tariff on a narrow category of advanced...
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    biz
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    Mobilint Brings Award-Winning Edge AI Hardware to the Global Stage at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook