China's high-end AI chip market could become almost entirely domestic in 2026, with local solutions expected to take nearly 90% of...

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Zhen Ding Tech (ZDT), a major PCB supplier, said at its second-quarter 2026 earnings conference on August 11 that rising investment...

Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring...

South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...

Odisha's state cabinet has approved a third amendment to its Semiconductor Manufacturing and Fabless Policy, adding fresh capital support...