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Tuesday 22 September 2026
SiPearl delivers first homegrown server chips for Europe's exascale supercomputer
SiPearl, a fabless company backed by the European Union and France, has delivered the first Rhea1 CPU samples to Bull for integration into Europe's JUPITER supercomputer, moving the...
Tuesday 22 September 2026
Anthropic, OpenAI expected to start buying memory directly in 2027
Anthropic and OpenAI are expected to start buying memory directly from manufacturers in 2027 as model developers take greater control of chip and data-center design, potentially broadening...
Tuesday 22 September 2026
Meta's AI agent Muse tops app charts, driving AMD's market cap past US$1 trillion

Meta's new AI agent, Muse, has leapt to the top of app charts roughly two weeks after its release. Its popularity has helped push up...

Tuesday 22 September 2026
Hermes Testing sees growth opportunity in AI-driven chip demand as OTC debut expands reach
Hermes Testing Solutions began trading on the over-the-counter market on September 22, positioning itself to benefit from rising demand tied to artificial intelligence and high-performance...
Tuesday 22 September 2026
Hanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging
Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM)...
Tuesday 22 September 2026
DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

DeepSeek CEO Liang Wenfeng said during a call with investors that he aims to rely on Huawei chips to train the startup's models in the...

Tuesday 22 September 2026
DEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN
South Korean AI semiconductor company DEEPX is reportedly conducting a proof of concept with a US smart glasses company to test whether its low-power neural processing unit (NPU) can...
Tuesday 22 September 2026
Micron Taiwan union heads for strike vote as board, earnings calendar stall profit-sharing talks

The labor dispute at Micron Taiwan continues to escalate after Micron and the Taiwan Taoyuan Union failed to reach agreement at a second...

Tuesday 22 September 2026
Alibaba expands full-stack AI push as cloud data centers target 20 GW by 2032
Alibaba Group Holding Ltd. doubled down on its full-stack AI strategy at the 2026 Apsara Conference, which opened on Sept. 22 at the Hangzhou International Expo Center. Alibaba Group...
Tuesday 22 September 2026
BOE looks beyond displays with glass substrates for AI packaging
Chinese display maker BOE Technology is expanding beyond its core panel business. Chairman Chen Yanshun said at the BOE Global Innovation Partner Conference 2026 on September 22 that...
Tuesday 22 September 2026
Samsung weighs 4nm expansion as HBM4 demand strains capacity

Samsung Electronics is considering expanding its 4nm foundry capacity as rising HBM4 base-die demand pushes existing capacity to full...

Tuesday 22 September 2026
TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung

Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park...

Tuesday 22 September 2026
India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout
Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September...
Tuesday 22 September 2026
Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries

China's silicon carbide (SiC) end-market demand is expanding rapidly, driven by high-voltage charging infrastructure and AI servers...

Tuesday 22 September 2026
MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices

MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery...