Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology has announced it is ramping up a new MEMS and sensor packaging line...
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have agreed to merge through the formation of a parent holding company, which would allow both...
Advanced Semiconductor Engineering (ASE), already a provider of SiP (system-in-package) modules for the first-generation Apple Watch, has reportedly grabbed the majority of SiP module...
Packaging and testing company Amkor Technology has announced net profits of US$28 million, or US$0.12 per share, on revenues of US$734 million for the third quarter ended September...
The IC packaging and testing sector will continue its trend toward consolidation, and Amkor Technology is positive about such development, according to Mike Liang, president of Amkor...
Plans by Advanced Semiconductor Engineering (ASE) to buy up to 25% of Siliconware Precision Industries (SPIL) for an amount likely exceeding NT$30 billion (US$919 million) may be...
Demand for 3D IC parts may not begin to take off until three years due to concerns of high production costs, according to Mike Liang, president of Amkor Technology Taiwan.
Amkor Technology and STATS ChipPAC have each obtained 40% of the total packaging orders placed by Apple for its next-generation A8 processor, with the remaining 20% will be taken...
Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL) and Amkor Technology will continue to commit heavy investments for ramping their high-end backend...
Amkor Technology, Globalfoundries and Open-Silicon have jointly announced the successful demonstration of a functional SoC featuring two 28nm logic chips with embedded ARM processors,...
IC assembly and test service provider Amkor Technology has completed its acquisition of Toshiba's semiconductor packaging operation in Malaysia, according to the two companies.
Robust growth in smartphone usage is encouraging semiconductor assembly and test services providers to head towards related packaging technologies. Amkor Technology is already among...
Renesas Electronics and J-Devices have signed a memorandum of understanding regarding the transfer of three semiconductor backend production facilities operated by Renesas and its...
Advanced Semiconductor Engineering (ASE), Amkor Technology and Siliconware Precision Industries (SPIL) – the world's leading packaging and testing houses – have all set...
