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NEWS TAGGED AMKOR
Friday 2 November 2018
China not necessarily top job destination for Taiwan IC packaging talent
China backend service providers such as Tongfu Microelectronics, Tianshui Huatian Technology, Jiangsu Changjiang Electronics Technology have been actively raiding talent from Taiwan's...
Tuesday 25 September 2018
TSMC to set up new fab for advanced packaging
Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing...
Tuesday 11 September 2018
Amkor opens new plant in Taiwan for high-end IC backend
Amkor Technology has unveiled its new plant in Taiwan to focus mainly on high-end IC backend services, such as wafer-level and flip-chip packaging, and high-end chip probing.
Friday 7 September 2018
Backend firm Amkor to expand capacity in Taiwan
Amkor Technology will soon start operating a new factory at its manufacturing site in Longtan, northern Taiwan for wafer-level packaging (WLP) and wafer test services. The arrival...
Friday 22 June 2018
TSMC develops SiP technology
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.
Friday 1 June 2018
China IC backend output value to exceed US$30 billion in 2018, says Digitimes Research
The output value of China's IC packaging and testing industry will exceed US$30 billion for the first time in 2018, according to Digitimes Research.
Thursday 8 February 2018
China IC backend houses vying for orders for mining ASICs
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...
Wednesday 13 September 2017
SEMICON Taiwan 2017: Focus on IoT, AI, smart applications
The 22nd annual SEMICON Taiwan trade show has kicked off in Taipei, running from September 13-15, with this year's theme focusing on IoT, AI, smart manufacturing, smart transportation...
Wednesday 8 February 2017
Amkor to buy fellow packaging company Nanium
Amkor Technology and Nanium, a Portugal-based IC backend house specializing in wafer-level fan-out (WLFO) packaging solutions, have entered into a definitive agreement for Amkor to...
Friday 18 November 2016
ASE-SPIL merger still under review in China and US
A proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) is still being reviewed by anti-trust authorities in China and the US...
Monday 12 September 2016
Qualcomm opens Shanghai facility for semiconductor test manufacturing
Qualcomm has announced the opening of Qualcomm Communication Technologies (Shanghai), a semiconductor test facility in the Waigaoqiao (WGQ) free-trade zone in Shanghai, and its first...
Wednesday 17 August 2016
China market: Nantong Fujitsu reportedly to acquire Amkor, says paper
China-based IC backend service company Nantong Fujitsu Microelectronics reportedly will acquire US-based Amkor Technology, according to a Chinese-language Economic Daily News...
Monday 4 July 2016
Amkor opens MEMS packaging line in China
Driven by the increase in global demand for sensors from the smartphone and automotive markets, Amkor Technology has announced it is ramping up a new MEMS and sensor packaging line...
Monday 30 May 2016
Digitimes Research: Merger brings more competitiveness to ASE, SPIL
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have agreed to merge through the formation of a parent holding company, which would allow both...
Thursday 14 April 2016
ASE grabs major SiP module orders for second-generation Apple Watch, sources say
Advanced Semiconductor Engineering (ASE), already a provider of SiP (system-in-package) modules for the first-generation Apple Watch, has reportedly grabbed the majority of SiP module...