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TSMC reportedly invited to set up CoWoS packaging capacity in US, Japan

Monica Chen, Hsinchu; Willis Ke, DIGITIMES Asia Monday 31 July 2023 0

Credit: DIGITIMES

In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC to set up CoWoS and other advanced packaging facilities alongside wafer...

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