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Thursday 23 April 2009
IC packaging firms ASE and SPIL gain shifted orders
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have recently seen more orders shifted from Amkor Technology, STATS ChipPAC Taiwan Semiconductor...
Monday 13 April 2009
Integrated handheld solutions driving demand for wafer-level packaging, says ASE
Handheld devices incorporating functionality such as Bluetooth, FM radio, GPS and Wi-Fi have become the market driver for wafer-level packaging (WLP), Taiwan's Advanced Semiconductor...
Friday 27 March 2009
ASE 1Q revenue drop expected to narrow from original forecast
With Amkor Technology recently revising up its gross margin outlook for the first quarter and indicating that its revenues will fall into the avorable end of the range of the company's...
Thursday 26 March 2009
Amkor narrows 1Q guidance
Amkor Technology, a US-based IC packaging and testing firm, has revised upward gross margins for the first quarter of 2009 (ending March 31, 2009) but still held its previous revenues...
Wednesday 10 December 2008
Amkor likely to lower sales estimate for 4Q08
In response to a weakening outlook, Amkor Technology may soon announce a downgraded revenue estimate for the fourth quarter of 2008, market watchers speculated. Its major competitor...
Wednesday 29 October 2008
Intel, Qualcomm, Amkor, Advantest join up to improve IC testing efficiency
Major players from the semiconductor and test community, including Advantest, Amkor, Infineon, Intel, LTX-Credence, Qualcomm, Roos Instruments, Teradyne, and Verigy, announced that...