South Korean chip giant SK Hynix has placed significant orders for thermal compression bonding (TCB) equipment with two domestic suppliers, Hanwha Semitech and Hanmi Semiconductor, signaling a strategic push to expand its high-bandwidth memory (HBM) manufacturing capabilities.
Hanwha Semitech, a subsidiary of Hanwha Vision, has secured a contract worth KRW38.5 billion (approx. US$27.70 million) to supply TCB equipment to SK Hynix, according to a report from ET News and company disclosures. The agreement is set to run through July 1, 2025.
This contract follows a previous announcement made in March 2025 involving the supply of TCB equipment valued at KRW42 billion (approx. US$30.22 million) to the same customer. TCB machines play a crucial role in the manufacturing of high-bandwidth memory (HBM), an essential component in advanced memory technologies.
Hanmi Semiconductor has disclosed that it secured an order from SK Hynix for its Dual TC Bonder Griffin model under a contract worth KRW42.8 billion, valid through July 1, 2025. According to industry estimates, the price per TCB unit is around KRW3 billion, indicating that Hanwha Semitech is expected to deliver roughly 10 units, while Hanmi Semiconductor's supply volume is projected to be about 15 units.
Competitive dynamics in the TCB market
In the HBM TCB equipment sector, Hanmi Semiconductor's Dual TC Bonder Griffin continues to hold a dominant position, supported by well-established technology, substantial production capabilities, and robust partnerships with key industry stakeholders. Meanwhile, Hanwha Semitech, despite being a recent entrant to the market, has received approval from SK Hynix for its TC Bonder following performance evaluations.
However, the competitive landscape is complicated by intellectual property tensions. Hanmi Semiconductor, holding an extensive portfolio of TCB-related patents, has recently initiated patent litigation against Hanwha Semitech. The outcome of this legal dispute remains to be seen and could significantly influence future market dynamics.
Article translated by Sherri Wang and edited by Jack Wu
